C08G59/3236 - CPC Classification Index

ClassID:

99173 ⎘

C08G59/3236 - CPC Classification

Classification description:

Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used; Epoxy compounds containing three or more epoxy groups Heterocylic compounds

Sub-classes:

C08G59/3245 » {containing only nitrogen as a heteroatom} 62

Recent Application in this class:

20260117017

CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF

20220213371

COMPOSITION FOR FORMING THERMALLY CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE SHEET, AND DEVICE WITH THERMALLY CONDUCTIVE LAYER

20210284788

THERMALLY CONDUCTIVE MATERIAL-FORMING COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE SHEET, DEVICE WITH THERMALLY CONDUCTIVE LAYER, AND FILM

20200172658

Renewable furan based amine curing agents for epoxy thermoset

20200057370

COMPOUND, RESIST COMPOSITION CONTAINING COMPOUND AND PATTERN FORMATION METHOD USING SAME

20190211242

Photosensitive adhesive composition

20190085229

Surface-modified inorganic nitride, composition, thermally conductive material, device with thermally conductive layer, and method for manufacturing surface-modified inorganic nitride

20190031818

Curable composition, cured film, display panel or OLED light, and method for producing cured product

20180334533

Curable composition, cured film, display panel, and method for producing cured product

20180251591

Bio-based resins with high content of ethylenically unsaturated functional groups and thermosets thereof

20180244834

Bio-based thermosets

20180230367

Sugar based epoxy resins with enhanced properties for sand consolidation in subterranean formations

20180086895

Halogen-free thermosetting resin composition, prepreg, laminate and printed circuit board comprising the same

20170275415

Fatty acid polyester derivatives of polyglycosides

20170002131

Epoxy resin composition, prepreg and laminate using same

20160222262

Polymer and composition including same, and adhesive composition

20160160920

Thermosetting resin composition, sliding member and method for producing sliding member

20160145527

Thermosetting resin composition, sliding member and method for producing sliding member

20150307739

Modified glycidyl carbamate resins

20130009327

RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND SEMICONDUCTOR DEVICE USING SAME

20120295199

Long-chain alkylene-containing curable epoxy resin composition

20110319589

Long chain alkylene group-containing epoxy compound

20110054072

White heat-curable silicone/epoxy hybrid resin composition for optoelectronic use, making method, premolded package, and LED device

20100319580

Modified glycidyl carbamate resins

20100294429

EPOXY RESIN FORMULATIONS

20100240816

EPOXY RESIN COMPOSITION CONTAINING ISOCYANURATES FOR USE IN ELECTRICAL LAMINATES

20100216951

Hybrid coatings prepared from glycidyl carbamate resins

20100009293

Antireflective coating compositions

20080160860

Epoxy Resin Composition for Fiber-Reinforced Composite Material, Prepreg, and Fiber-Reinforced Composite Material

20080050596

Composition of oxazolidine epoxy resin, epoxy phosphazene, phosphorus compound or polyphenylene ether and curing agent

20070295983

Optoelectronic device