99174 ⎘
Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used; Epoxy compounds containing three or more epoxy groups; Heterocylic compounds containing only nitrogen as a heteroatom
DEGRADABLE LOST CIRCULATION MATERIAL FOR PROTECTION OIL AND GAS RESERVOIRS, AND PREPARATION METHOD AND USE THEREOF
#2CHEMICAL-RESISTANT PROTECTIVE FILM-FORMING COMPOSITION HAVING CATECHOL GROUP
#3Resist underlayer film-forming composition including reaction product of acid dianhydride
#4RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING A REACTION PRODUCT OF TRIFUNCTIONAL COMPOUND
#5Curable resin composition
#6Highly soluble tris-(2,3-epoxypropyl)-isocyanurate and method for producing same
#7COMPOSITION FOR FORMING THERMALLY CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE SHEET, AND DEVICE WITH THERMALLY CONDUCTIVE LAYER
#8NEGATIVE-WORKING PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIST FILM, PATTERN FORMATION METHOD, CURED FILM, CURED FILM PRODUCTION METHOD, AND ROLLED BODY
#9PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD
#10Epoxy resin systems
#11Protective film-forming composition
#12Member for electrophotography, process cartridge and electrophotographic apparatus
#13Highly soluble tris-(2, 3-epoxypropyl)-isocyanurate and method for producing same
#14Prepreg and fiber-reinforced composite material
#15Floor coating agent having excellent surface adhesion and hardness, and construction method using the same
#16Epoxy resin systems
#17Highly soluble modified epoxy resin composition
#18Curable composition, cured film, display panel or OLED light, and method for producing cured product
#19EPOXY RESIN COMPOSITION
#20Composition, laminate, method of manufacturing laminate, transistor, and method of manufacturing transistor
#21POLYMERIZABLE COMPOSITION AND OPTICALLY ANISOTROPIC BODY USING SAME
#22Long-chain alkylene group-containing epoxy resin composition
#23Epoxy resin composition, prepreg, and fiber reinforced material
#24Porous particle made of organic polymer, method for producing porous particle made of organic polymer, and block copolymer
#25POROUS PARTICLE, METHOD FOR PRODUCING POROUS PARTICLE, AND BLOCK COPOLYMER
#26White heat-curable epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using same
#27Composition, laminate, method of manufacturing laminate, transistor, and method of manufacturing transistor
#28Highly soluble modified epoxy resin composition
#29White heat-curable epoxy resin composition, optical semiconductor element case made of the white heat-curable epoxy resin composition and optical semiconductor device comprised of the case
#30Alkali-soluble resin, photosensitive resin composition for color filter containing the same and uses thereof
#31Multifunctional melamine epoxy resins, methylols and amines
#32Light-emitting device and method for manufacturing same
#33Light-emitting device and method for manufacturing same
#34Epoxy resin composition and light emitting apparatus
#35Epoxy resin composition and light emitting apparatus
#36EPOXY resin composition, prepreg and fiber-reinforced composite materials
#37Method for producing epoxy compound having cyanuric acid skeleton
#38Epoxy resin composition for optical semiconductor device and optical semiconductor device using the same
#39RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR ELEMENT HOUSING PACKAGE, AND OPTICAL SEMICONDUCTOR LIGHT-EMITTING DEVICE OBTAINED USING THE SAME
#40INPUT DEVICE
#41Method of using white resin in an electronic device
#42Electronic device incorporating the white resin
#43Coating agent, substrate for mounting optical semiconductor element using same, and optical semiconductor device
#44Ionic liquid epoxy resin monomers
#45INPUT DEVICE
#46Resin composition for optical semiconductor device, optical-semiconductor-device lead frame obtained using the same, and optical semiconductor device
#47Resin composition for optical semiconductor element housing package, and optical semiconductor light-emitting device obtained using the same
#48Thermosetting light-reflecting resin composition, optical semiconductor element mounting board produced therewith, method for manufacture thereof, and optical semiconductor device
#49Epoxy resin composition for photosemiconductor element encapsulation and cured product thereof, and photosemiconductor device using the same
#50Light-emitting device, method for manufacturing same, molded body and sealing member
#51Thermosetting epoxy resin composition and semiconductor device
#52Heat-curable resin composition
#53THERMOSETTING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
#54Ionic liquid epoxy resins
#55RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR ELEMENT ENCAPSULATION, AND OPTICAL SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME
#56Method for producing an optical, radiation-emitting component and optical, radiation-emitting component
#57Proton Conducting Copolymers
#58Optoelectronic device
#59Optoelectronic device
#60Cured product of epoxy resin composition and method for producing the same, and photosemiconductor device using the same
#61Photosemiconductor encapsulant of epoxy resin, anhydride and aromatic silicone resin
#62Binder composition for lamination and an adhesive film using the same
#63Compound containing epoxide and maleimide groups, cured resin prepared from said compound
#64Methods of curing ionic liquid epoxy mixtures
#65Epoxy resin composition with soda lime glass filler