99206 ⎘
Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used; Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups Macromolecular compounds obtained by reactions other than those involving unsaturated carbon-to-carbon bindings
Sub-classes:BISPHENOL DIGLYCIDYL ETHER COMPOSITION, CURABLE COMPOSITION, CURED PRODUCT, AND ELECTRICAL/ELECTRONIC COMPONENT
#2EPOXY RESIN COMPOSITION
#3EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME
#4CAPPED POLY(PHENYLENE ETHER) AND CURABLE THERMOSETTING COMPOSITION COMPRISING THE SAME
#5WATERBORNE EPOXY CURING AGENT
#6Esterified Acids for Use in Polymeric Materials
#7Esterified acids for use in polymeric materials
#8Waterborne epoxy curing agent
#9Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same
#10Composition of alkoxysilyl-functionalized epoxy resin and composite thereof
#11HARDENER COMPOSITION
#12Esterified acids for use in polymeric materials
#13LOW DIELECTRIC CONSTANT POROUS EPOXY-BASED DIELECTRIC
#14METHOD OF FORMING A CURED EPOXY MATERIAL, CURED EPOXY MATERIAL FORMED THEREBY, PHENYLENE ETHER OLIGOMER-ANHYDRIDE REACTION PRODUCT USEFUL IN THE METHOD, AND COMPOSITE CORE INCORPORATING THE CURED EPOXY MATERIAL
#15ACTIVE ESTER, THERMOSETTING RESIN COMPOSITION, PREPREG AND LAMINATED BOARD CONTAINING SAME
#16Esterified acids for use in polymeric materials
#17Silicone-modified epoxy resin, composition containing the epoxy resin, and cured product of same
#18Photosensitive resin composition production kit, and use thereof
#19Curable composition
#20THERMOSETTING RESIN COMPOSITIONS, FLEXIBLE CIRCUIT BOARD OVERCOATING AGENTS, AND SURFACE PROTECTIVE LAYERS
#21THERMOSETTING RESIN COMPOSITION CONTAINING LOW CHLORINE POLYFUNTIONAL ALIPHATIC GLYCIDYL ETHER COMPOUND, CURED PRODUCTS OF THE COMPOSITION AND USE THEREOF
#22THERMOSETTING RESIN COMPOSITIONS AND USES THEREOF
#23Thermosetting resin composition and uses thereof
#24Carboxyl Group-Containing Polyurethane and Thermosetting Resin Composition Using the Same
#25Electronic material composition, electronic product and method of using electronic material composition
#26Low-temperature-curing epoxy-functional powder coating compositions