99207 ⎘
Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used; Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups; Macromolecular compounds obtained by reactions other than those involving unsaturated carbon-to-carbon bindings Polyesters
EPOXY RESINS
#2STRUCTURAL ADHESIVE COMPOSITIONS
#3COATING COMPOSITIONS, DIELECTRIC COATINGS FORMED THEREFROM, AND METHODS OF PREPARING DIELECTRIC COATINGS
#4ESTER COMPOUND AND RESIN COMPOSITION
#5THERMOSETTING MATERIAL FOR USE IN ADDITIVE MANUFACTURING
#6ACTIVE ESTER RESIN, METHOD FOR PRODUCING THEREOF, EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, PREPREG, LAMINATED BOARD, AND MATERIAL FOR CIRCUIT SUBSTRATE
#7Structural adhesive compositions
#8Structural adhesive compositions
#9Structural adhesive compositions
#10ANTISTATIC AGENT, ANTISTATIC COMPOSITION COMPRISING SAME, ANTISTATIC RESIN COMPOSITION COMPRISING SAME, AND MOLDED ARTICLE THEREOF
#11Coating compositions, dielectric coatings formed therefrom, and methods of preparing dielectric coatings
#12CONDUCTIVE METAL RESIN MULTILAYER BODY AND MOLDED BODY OF SAME
#13Structural adhesive compositions
#14Curing agent composition and curing agent coating formula thereof
#15Curing agent and method for manufacturing the same
#16Method of producing a polymer nanofiber sheet
#17Coating compositions, dielectric coatings formed therefrom, and methods of preparing dielectric coatings
#18Polyester-epoxide polymer compositions
#19Support-provided insulating layer, laminate, and wiring board
#20METHODS OF FORMING DYNAMIC CROSS-LINKED POLYMER COMPOSITIONS USING FUNCTIONAL, POLYMERIC CHAIN EXTENDERS UNDER BATCH PROCESS
#21Active ester curing agent compound for thermosetting resins, flame retardant composition comprising same, and articles made therefrom
#22METHODS OF FORMING DYNAMIC CROSS-LINKED POLYMER COMPOSITIONS
#23USE OF DYNAMIC CROSS-LINKED POLYMER COMPOSITIONS IN SOLDERING APPLICATIONS
#24Curable formulations for laminating adhesives
#25Vinylbenzylated phenol compound, method of manufacturing vinylbenzylated phenol compound, activated ester resin, method of manufacturing activated ester resin, thermoset resin composition, hardened material of thermoset resin composition, interlayer insulating material, prepreg, and method of manufacturing prepreg
#26Silicone-modified epoxy resin, composition containing said epoxy resin, and cured product thereof
#27Resin composition and coating material using the same
#28Structural adhesive compositions
#29Epoxybenzyl-terminated poly(arylene ether)s, method for preparation thereof, and curable compositions comprising same
#30Epoxybenzyl-terminated poly(arylene ether)s, method for preparation thereof, and curable compositions comprising same
#31EPOXY RESIN COMPOSITION
#32STRUCTURAL ADHESIVE COMPOSITIONS
#33THERMOSETTING RESIN COMPOSITION AND PREPREG OR LAMINATE USING THE SAME
#34Resin composition adhesive film and prepreg containing the same, multilayered printed wiring board containing an insulating layer formed by curing such a resin composition, semiconductor device containing such a multilayered printed wiring board, and method of producing such a resin composition
#35Powder coating compositions having a substantially non-zinc containing primer
#36Degassing compositions for curable coatings
#37Degassing compositions for curable coatings
#38Epoxy resin composition and article made therefrom