103462 ⎘
Polishing compositions containing abrasives or grinding agents
Polishing slurry composition for STI process
#602Polishing liquid, polishing liquid set and polishing method
#603Polishing composition
#604CARBON ABRASIVE AND POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#605Method of selective chemical mechanical polishing cobalt, zirconium oxide, poly-silicon and silicon dioxide films
#606CHEMICAL MECHANICAL POLISHING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND POLISHING PAD AND CHEMICAL MECHANICAL POLISHING DEVICE
#607Composition and method for polysilicon CMP
#608Composition and method for conducting a material removing operation
#609POLISHING LIQUID, POLISHING LIQUID SET, AND POLISHING METHOD
#610Polishing liquid, polishing liquid set, and polishing method
#611POLISHING COMPOSITION AND POLISHING METHOD USING THE SAME
#612Polishing slurry, method for manufacturing a display device using the same and display device
#613CHEMICAL MECHANICAL POLISHING METHOD AND CHEMICAL MECHANICAL POLISHING DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#614GALLIUM COMPOUND-BASED SEMICONDUCTOR SUBSTRATE POLISHING COMPOSITION
#615Polishing composition, manufacturing method of polishing composition, polishing method, and manufacturing method of semiconductor substrate
#616Polishing composition
#617POLISHING COMPOSITION
#618Polishing liquid, polishing liquid set, and polishing method
#619Method to increase barrier film removal rate in bulk tungsten slurry
#620Semiconductor substrate polishing methods
#621CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION FOR POLISHING MULTIPLE FILMS AND POLISHING METHOD USING THE SAME
#622Treatment liquid
#623SURFACE TREATMENT COMPOSITION, METHOD FOR PRODUCING SURFACE TREATMENT COMPOSITION, SURFACE TREATMENT METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE
#624Dispersion liquid of silica particles, polishing composition, and method for producing dispersion liquid of silica particles
#625CHEMICAL MECHANICAL POLISHING METHOD FOR TUNGSTEN
#626Polishing compositions for reduced defectivity and methods of using the same
#627CMP slurry solution for hardened fluid material
#628Polishing composition
#629Polishing agent for synthetic quartz glass substrate and method for polishing synthetic quartz glass substrate
#630POLISHING COMPOSITION AND POLISHING METHOD
#631Slurry composition and method of manufacturing integrated circuit device by using the same
#632Dispersion liquid of silica particles and production method therefor
#633Method of reducing semiconductor substrate surface unevenness
#634Cationic fluoropolymer composite polishing method
#635Low-debris fluopolymer composite CMP polishing pad
#636Fluopolymer composite CMP polishing method
#637Thin film fluoropolymer composite CMP polishing method
#638BIASED PULSE CMP GROOVE PATTERN
#639Polishing liquid composition for silicon oxide film
#640POLISHING SOLUTION AND POLISHING METHOD
#641Polishing solution and polishing method
#642Chemical mechanical planarization using nano-abrasive slurry
#643Polishing liquid and chemical mechanical polishing method
#644Chemical mechanical polishing composition and method of polishing silicon nitride over silicon dioxide and simultaneously inhibiting damage to silicon dioxide
#645Slurry
#646Polishing liquid and chemical mechanical polishing method
#647Polishing liquid and chemical mechanical polishing method
#648Polishing liquid and chemical mechanical polishing method
#649CMP stop layer and sacrifice layer for high yield small size MRAM devices
#650Polishing compositions and methods of using same
#651POLISHING COMPOSITIONS AND METHODS OF USING SAME
#652POLISHING LIQUID AND METHOD FOR PRODUCING POLISHED ARTICLE
#653SURFACE COATED ABRASIVE PARTICLES FOR TUNGSTEN BUFF APPLICATIONS
#654Slurry, polishing-liquid set, polishing liquid, and polishing method for base
#655COMPOSITION FOR POLISHING FOR USE IN ELIMINATING PROTRUSION IN PERIPHERY OF LASER MARK
#656Low Temperature Mechanical Polishing Or Planarization Slurry For Surfactant Solubility
#657ADDITIVES TO IMPROVE PARTICLE DISPERSION FOR CMP SLURRY
#658POLISHING COMPOSITION
#659Polishing composition
#660POLISHING COMPOSITION COMPRISING POLISHING PARTICLES HAVING HIGH WATER AFFINITY
#661COMPOSITIONS FOR POLISHING COBALT AND LOW-K MATERIAL SURFACES
#662Compositions for polishing cobalt and low-K material surfaces
#663Chemical mechanical polishing method for cobalt with high cobalt removal rates and reduced cobalt corrosion
#664POLISHING COMPOSITION AND POLISHING METHOD
#665Chemical mechanical polishing composition
#666Polishing composition
#667Slurry and polishing method
#668Polishing liquid, polishing liquid set and polishing method
#669POLISHING COMPOSITION
#670Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt and / or cobalt alloy comprising substrates
#671Polishing slurry and method of manufacturing semiconductor device
#672USE OF A CHEMICAL MECHANICAL POLISHING (CMP) COMPOSITION FOR POLISHING OF COBALT AND / OR COBALT ALLOY COMPRISING SUBSTRATES
#673POLISHING LIQUID, POLISHING LIQUID SET, POLISHING METHOD, ANDDEFECT SUPPRESSION METHOD
#674CMP slurry and CMP method
#675Chemical Mechanical Polishing For Copper And Through Silicon Via Applications
#676Use of HSOas an electrolyte in processes for smoothing and polishing metals by ion transport via free solids
#677Shallow Trench Isolation Chemical And Mechanical Polishing Slurry
#678POLISHING COMPOSITION AND POLISHING METHOD
#679Chemical-mechanical polishing composition comprising benzotriazole derivatives as corrosion inhibitors
#680Chemical mechanical polishing of tungsten using a method and composition containing quaternary phosphonium compounds
#681Polishing composition and method of fabricating semiconductor device using the same
#682Multi-modal diamond abrasive package or slurry for polishing hard substrates
#683Chemical mechanical polishing compositions having stabilized abrasive particles for polishing dielectric substrates
#684Shallow trench isolation (STI) chemical mechanical planarization (CMP) polishing with tunable silicon oxide and silicon nitride removal rates
#685Shallow trench isolation (STI) chemical mechanical planarization (CMP) polishing with low abrasive concentration and a combination of chemical additives
#686Acid polishing composition and method of polishing a substrate having enhanced defect inhibition
#687Surface protectant for semiconductor wafer
#688Production method for dispersion liquid of silica particle
#689Polishing compositions and methods of use thereof
#690Dual additive composition for polishing memory hard disks exhibiting edge roll off
#691Polishing liquid, method for manufacturing glass substrate, and method for manufacturing magnetic disk
#692Composition for tungsten CMP
#693Polishing compositions and methods of using same
#694Polishing compositions and methods of using same
#695Cerium based particles
#696POLISHING PAD AND COMPOSITION FOR MANUFACTURING THE SAME
#697CMP APPARATUS AND METHOD OF PERFORMING CERIA-BASED CMP PROCESS
#698Wafer grinding wheel
#699Roughness reduction methods for materials using illuminated etch solutions
#700Self-stopping polishing composition and method for bulk oxide planarization
#701OXIDIZER FREE SLURRY FOR RUTHENIUM CMP
#702Method of polishing substrate and polishing composition set
#703Wafer polishing with separated chemical reaction and mechanical polishing
#704Polishing additive composition, polishing slurry composition and method for polishing insulating film of semiconductor element
#705Composition and method for copper barrier CMP
#706Composition and method for silicon nitride CMP
#707Composition and method for metal CMP
#708COMPOSITION AND METHOD FOR COBALT CMP
#709Multi-layered windows for use in chemical-mechanical planarization systems
#710Polishing slurry and method of manufacturing semiconductor device
#711SLURRY COMPOSITION FOR POLISHING TUNGSTEN BARRIER LAYER
#712Polishing additive composition, polishing slurry composition and method for polishing insulating film of semiconductor element
#713Polishing method
#714Slurry and manufacturing semiconductor using the slurry
#715Method for manufacturing polishing particles and method for polishing synthetic quartz glass substrate
#716Suppressing SiN removal rates and reducing oxide trench dishing for Shallow Trench Isolation (STI) process
#717Polishing composition containing amphoteric surfactant
#718Polishing composition and polishing method
#719Chemical mechanical polishing composition and method for tungsten
#720Composite abrasive particles for chemical mechanical planarization composition and method of use thereof
#721Method for polishing silicon wafer
#722Nanobubble-containing inorganic oxide fine particle and abrasive containing same
#723Methods of forming an abrasive slurry and methods for chemical-mechanical polishing
#724HARD ABRASIVE PARTICLE-FREE POLISHING OF HARD MATERIALS METHOD
#725CHEMICAL MECHANICAL POLISHING COMPOSITION AND METHOD OF POLISHING SILCON DIOXIDE OVER SILICON NITIRIDE
#726Polishing composition, polishing method, and method of producing substrate
#727Barrier Slurry Removal Rate Improvement
#728CHEMICAL MECAHNICAL POLISHING COMPOSITION AND METHOD OF POLISHING SILCON DIOXIDE OVER SILICON NITIRIDE
#729Metal heterojunction structure with capping metal layer
#730CMP slurry and CMP method
#731High Oxide VS Nitride Selectivity, Low And Uniform Oxide Trench Dishing In Shallow Trench Isolation(STI) Chemical Mechanical Planarization Polishing(CMP)
#732TUNGSTEN DISSOLUTION INHIBITOR, AND POLISHING COMPOSITION AND COMPOSITION FOR SURFACE TREATMENT USING THE SAME
#733INTERMEDIATE RAW MATERIAL, AND POLISHING COMPOSITION AND COMPOSITION FOR SURFACE TREATMENT USING THE SAME
#734Polishing composition
#735Method for reducing metal plug corrosion and device
#736Liquid suspension of cerium oxide particles
#737COMPOSITION FOR SELECTIVE POLISHING OF WORK FUNCTION METALS
#738Chemical mechanical planarization for tungsten-containing substrates
#739Slurry composition and method of selective silica polishing
#740Polishing composition and polishing system
#741POLISHING COMPOSITION AND POLISHING SYSTEM
#742SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING
#743Polishing composition
#744METHOD FOR POLISHING SILICON CARBIDE SUBSTATE
#745Polishing composition and method utilizing abrasive particles treated with an aminosilane
#746Chemical mechanical planarization composition for polishing oxide materials and method of use thereof
#747Plasma etching method
#748Composition including a plurality of abrasive particles and method of using same
#749CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION
#750Polishing composition and method for manufacturing same, polishing method, and method for manufacturing substrate
#751Oxide chemical mechanical planarization (CMP) polishing compositions
#752Slurry recycling for chemical mechanical polishing system
#753Chemical mechanical polish slurry and method of manufacture
#754Tungsten chemical mechanical planarization (CMP) with low dishing and low erosion topography
#755Compositions for use in chemical mechanical polishing
#756Chemical mechanical planarization of films comprising elemental silicon
#757Metal chemical mechanical planarization (CMP) composition and methods therefore
#758Polishing liquid, polishing liquid set, and polishing method
#759Materials and methods for chemical mechanical polishing of ruthenium-containing materials
#760Method for polishing glass substrate, method for manufacturing glass substrate, method for manufacturing magnetic-disk glass substrate, method for manufacturing magnetic disk, polishing liquid, and method for reducing cerium oxide
#761Fabrication of a polishing pad for chemical mechanical polishing
#762Tungsten chemical mechanical polishing for reduced oxide erosion
#763POLISHING AGENT FOR SYNTHETIC QUARTZ GLASS SUBSTRATE, METHOD FOR MANUFACTURING THE POLISHING AGENT, AND METHOD FOR POLISHING SYNTHETIC QUARTZ GLASS SUBSTRATE
#764AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING AND METHOD OF PRODUCING THE SAME
#765Polishing slurry, method of manufacturing the same, and method of manufacturing semiconductor device
#766POLISHING LIQUID COMPOSITION
#767COMPOSITION FOR SURFACE TREATMENT, METHOD FOR PRODUCING THE SAME, SURFACE TREATMENT METHOD USING COMPOSITION FOR SURFACE TREATMENT, AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE
#768Polishing agent, stock solution for polishing agent, and polishing method
#769CERIUM OXIDE ABRASIVE GRAINS
#770Chemical-mechanical polishing solution having high silicon nitride selectivity
#771Chemical mechanical polishing method for tungsten
#772SLURRY AND POLISHING METHOD
#773INTERMEDIATE POLISHING COMPOSITION FOR SILICON SUBSTRATE AND POLISHING COMPOSITION SET FOR SILICON SUBSTRATE
#774Neutral to alkaline chemical mechanical polishing compositions and methods for tungsten
#775Calcium carbonate slurry
#776Low oxide trench dishing chemical mechanical polishing
#777Polishing slurry composition
#778Tungsten Chemical Mechanical Polishing Compositions
#779HYDROXYL FULLERENE DISPERSION, METHOD OF PREPARING THE SAME, POLISHING SLURRY INCLUDING THE SAME, AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#780Polishing composition
#781Polishing liquid and polishing method
#782POLISHING SLURRY COMPOSITION
#783Composition and method for polishing memory hard disks exhibiting reduced edge roll off
#784Composite particles, method of refining and use thereof
#785Polishing compositions containing charged abrasive
#786Polishing compositions containing charged abrasive
#787Polishing composition
#788Altering shear thickening in fumed silica suspensions using nanoparticles
#789Polishing liquid and polishing method
#790Polishing composition
#791Chemical Mechanical Polishing Tungsten Buffing Slurries
#792Chemical mechanical polishing method for tungsten
#793Chemical mechanical polishing method for tungsten
#794Optical surface polishing
#795Fluid synthesis system
#796Chemical mechanical polishing method for tungsten
#797CERIUM OXIDE ABRASIVE GRAINS
#798Finishing Mediums And Finishing Suspensions
#799Modulating metal interconnect surface topography
#800SLURRY COMPOSITION FOR POLISHING HIGH STEPPED REGION
#801MODIFIED COLLOIDAL SILICA AND METHOD FOR PRODUCING THE SAME, AND POLISHING AGENT USING THE SAME
#802Modified colloidal silica and method for producing the same, and polishing agent using the same
#803Method for surface treatment, use of an additive and surface treatment agent
#804COMPOSITION FOR SURFACE TREATMENT, AND METHOD FOR SURFACE TREATMENT AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE USING THE SAME
#805Method for producing polishing composition and polishing method
#806Bulk ruthenium chemical mechanical polishing composition
#807Barrier ruthenium chemical mechanical polishing slurry
#808CHEMICAL MECHANICAL POLISHING COMPOSITION AND METHOD OF MANUFACTURING CIRCUIT BOARD
#809CHEMICAL MECHANICAL POLISHING COMPOSITION AND METHOD OF MANUFACTURING CIRCUIT BOARD
#810POLISHING COMPOSITION, METHOD FOR PRODUCING POLISHING COMPOSITION, AND POLISHING METHOD
#811Polishing slurry and method of polishing substrate by using the polishing slurry
#812SLURRIES FOR CHEMICAL MECHANICAL POLISHING OF COBALT CONTAINING SUBSTRATES
#813Polishing composition and method of polishing a substrate having enhanced defect inhibition
#814CMP compositions containing polymer complexes and agents for STI applications
#815Polishing composition
#816FUMED SILICA AND METHOD FOR PRODUCING THE SAME
#817POLISHING AGENT, POLISHING METHOD, AND LIQUID ADDITIVE FOR POLISHING
#818POLISHING COMPOSITION, METHOD FOR PRODUCING POLISHING COMPOSITION, AND POLISHING METHOD
#819CMP POLISHING SOLUTION AND POLISHING METHOD
#820RINSING AGENT COMPOSITION FOR SILICON WAFERS
#821Ceria composite particle dispersion, method for producing same, and polishing abrasive grain dispersion comprising ceria composite particle dispersion
#822CMP stop layer and sacrifice layer for high yield small size MRAM devices
#823COMPOSITION AND METHOD FOR POLISHING SILICON CARBIDE
#824POLISHING LIQUID COMPOSITION
#825Piezo-electric end-pointing for 3D printed CMP pads
#826Method for producing cationically modified silica, cationically modified silica dispersion, method for producing polishing composition using cationically modified silica, and polishing composition using cationically modified silica
#827Polishing composition, method for producing polishing composition, and polishing method
#828SURFACE-MODIFIED COLLOIDAL CERIA ABRASIVE PARTICLES, PREPARATION METHOD THEREFOR, AND POLISHING SLURRY COMPOSITION CONTAINING SAME
#829TUNGSTEN BULK POLISHING METHOD WITH IMPROVED TOPOGRAPHY
#830Tungsten buff polishing compositions with improved topography
#831Method of selectively removing tungsten over silicon oxide
#832Method for polishing silicon wafer and surface treatment composition
#833Self-stopping polishing composition and method for bulk oxide planarization
#834POLISHING LIQUID FOR CMP AND PREPARATION METHOD AND USE THEREOF
#835Aqueous compositions of low dishing silica particles for polysilicon polishing
#836CMP SLURRY COMPOSITIONS CONTAINING SILICA WITH TRIMETHYLSULFOXONIUM CATIONS
#837Chemical Mechanical Polishing (CMP) of Cobalt-Containing Substrate
#838Chemical mechanical polishing slurry composition and method for manufacturing semiconductor using the same
#839Chemical mechanical polishing slurry composition for polishing polycrystalline silicon film
#840Slurry composition for polishing and method for polishing semiconductor thin film with steps of a high aspect ratio
#841Silica-based composite fine particle dispersion and method for manufacturing same
#842Polishing method and polishing composition
#843Composition for conducting material removal operations and method for forming same
#844Abrasive, polishing composition, and polishing method
#845COMPOSITION AND METHOD FOR POLISHING MEMORY HARD DISKS EXHIBITING REDUCED SURFACE SCRATCHING
#846Display device
#847Chemical processing of additive manufactured workpieces
#848Polishing composition
#849Polishing agent, polishing method, and liquid additive for polishing
#850Composite Particles, Method of Refining and Use Thereof
#851Method for producing cationically modified silica and cationically modified silica dispersion
#852Composition for conducting material removal operations and method for forming same
#853Polishing agent for synthetic quartz glass substrate and method for polishing synthetic quartz glass substrate
#854POLISHING COMPOSITION, METHOD FOR PRODUCING SAME, AND MAGNETIC POLISHING METHOD
#855Polishing composition
#856Polishing composition
#857Anti-corrosion polishing composition
#858CATION-MODIFIED SILICA RAW MATERIAL DISPERSION
#859Polishing compositions containing charged abrasive
#860Fluid processing systems including a plurality of material tanks, at least one mixing tank, at least one holding tank, and recirculation loops
#861Metal compound chemically anchored colloidal particles and methods of production and use thereof
#862Surface treated abrasive particles for tungsten buff applications
#863Chemical mechanical polishing composition and method
#864Method for reducing metal plug corrosion and device
#865POLISHING COMPOSITION, PRODUCTION METHOD OF POLISHING COMPOSITION, POLISHING METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR SUBSTRATE
#866Polishing composition, method for producing polishing composition, polishing method, and method for producing semiconductor substrate
#867Aqueous silica slurry and amine carboxylic acid compositions for use in shallow trench isolation and methods of using them
#868Aqueous silica slurry and amine carboxylic acid compositions selective for nitride removal in polishing and methods of using them
#869Aqueous anionic functional silica slurry and amine carboxylic acid compositions for selective nitride removal in polishing and methods of using them
#870Aqueous low abrasive silica slurry and amine carboxylic acid compositions for use in shallow trench isolation and methods of making and using them
#871Production method of polishing composition
#872COMPOSITION FOR TUNGSTEN CMP
#873POLISHING COMPOSITION, METHOD FOR PRODUCING SAME, POLISHING METHOD, AND METHOD FOR PRODUCING SUBSTRATE
#874POLISHING COMPOSITION FOR OBJECT TO BE POLISHED HAVING METAL-CONTAINING LAYER
#875Chemical mechanical polishing method for cobalt
#876NITRIDE INHIBITORS FOR HIGH SELECTIVITY OF TiN-SiN CMP APPLICATIONS
#877Polishing method, and polishing composition and method for producing the same
#878Polishing slurry composition
#879POLISHING SLURRY COMPOSITION
#880Polishing composition, method for producing polishing composition and polishing composition preparation kit
#881POLISHING COMPOSITION AND POLISHING METHOD USING SAME, AND METHOD FOR PRODUCING POLISHING-COMPLETED OBJECT TO BE POLISHED USING SAME
#882Polishing composition, polishing method, and method for manufacturing semiconductor substrate
#883Modulating metal interconnect surface topography
#884Stop-On Silicon Containing Layer Additive
#885Metal chemical mechanical planarization (CMP) composition and methods therefore
#886Chemical mechanical polishing method
#887Polishing composition and polishing method using same
#888CHEMICAL MECHANICAL POLISHING SLURRY AND APPLICATION THEREOF
#889Aqueous silica slurry compositions for use in shallow trench isolation and methods of using them
#890Method for polishing silicon substrate and polishing composition set
#891Method of chemical mechanical polishing a semiconductor substrate
#892Polishing compositions and methods of use thereof
#893Chemical mechanical planarization (CMP) composition and methods therefore for copper and through silica via (TSV) applications
#894Chemical mechanical polishing method for tungsten
#895Polishing slurries for polishing semiconductor wafers
#896POLISHING COMPOSITION
#897Method of chemical mechanical polishing a substrate
#898Method for polishing silicon substrate and polishing composition set
#899Cleaning composition
#900POLISHING COMPOSITION AND METHOD FOR POLISHING SILICON SUBSTRATE