Slurry composition and method for chemical mechanical polishing of copper integrated with tungsten based barrier metals

Slurry composition, polishing method using the slurry composition and method of forming a gate pattern using the slurry composition

Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method

Method for polishing organic film on semiconductor substrate by use of resin particles, and slurry

Polishing slurry and polished substrate

Chemical mechanical polishing slurry useful for tunsten/titanium substrate

Method of polishing a tungsten-containing substrate

Polishing composition for semiconductor wafers

Metal polish composition, polishing method using the composition and method for producing wafer using the polishing method

Chemical mechanical polishing slurry for polishing copper layer on a wafer

CMP composition for improved oxide removal rate

CMP formulations

Chemical-mechanical polishing (CMP) slurry containing clay and CeOabrasive particles and method of planarizing surfaces

Method for manufacturing isolation structures in a semiconductor device

Polishing composition

Cerium-based abrasive and production process thereof

CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate

Chemical mechanical polishing composition and process

Semiconductor device fabrication method

Method of passivating chemical mechanical polishing compositions for copper film planarization processes

Electrochemical-mechanical polishing composition and method for using the same

Nickel powders, methods for producing powders and devices fabricated from same

Polishing method to reduce dishing of tungsten on a dielectric

Passivative chemical mechanical polishing composition for copper film planarization

Slurry for CMP and method of polishing substrate using same

Compositions for chemical mechanical planarization of tantalum and tantalum nitride

Planarizing solutions including abrasive elements, and methods for manufacturing and using such planarizing solutions

Silica-free surface abrasion compositions and their uses

Barrier polishing solution

Method chemical-mechanical polishing and planarizing corundum, GaAs, GaP and GaAs/GaP alloy surfaces

Method and composition for polishing a substrate

Device and system for coating a surface

Methods of forming integrated circuit devices having polished tungsten metal layers therein

Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method

Polishing composition

Chemically assisted surface finishing process

Process and composition for conductive material removal by electrochemical mechanical polishing

Chemical-mechanical planarization composition having PVNO and associated method for use

CMP porous pad with component-filled pores

Polishing composition and polishing method

Abrasives and compositions for chemical mechanical planarization of tungsten and titanium

Polishing slurries and methods for chemical mechanical polishing

Compositions and methods for chemical mechanical planarization of tungsten and titanium

Compositions and methods for polishing copper

Chemical-mechanical polishing composition and method for using the same

Polishing composition

Ceria slurry for polishing semiconductor thin layer

Polishing composition and polishing method

Polishing composition and polishing method

Methods and systems for planarizing microelectronic devices with Ge-Se-Ag layers

Chemical agent additives in copper CMP slurry

Polishing composition and polishing method

Polishing composition and polishing method

Polishing compound for insulating film for semiconductor integrated circuit and method for producing semiconductor integrated circuit

Copper-based metal polishing solution and method for manufacturing semiconductor device

Composition and method for road-film removal

Cerium-based abrasive, abrasive slurry, and production of cerium-based abrasive

Polishing slurry, method of producing same, and method of polishing substrate

Polishing compound, its production process and polishing method

Bicine/tricine containing composition and method for chemical-mechanical planarization

Polishing compositions for controlling metal interconnect removal rate in semiconductor wafers

Alumina abrasive for chemical mechanical polishing

Polishing composition and polishing method

Cathodoluminescent phosphor powders, methods for making phosphor powders and devices incorporating same

Compositions and methods for chemical mechanical polishing silica and silicon nitride

Polishing fluid and polishing method

Compositions and methods for rapidly removing overfilled substrates

Rare earth aggregate formulation using di-block copolmers

Method of manufacturing semiconductor device

Slurry for polishing copper film and method for polishing copper film using the same

Polishing fluid and method of polishing

Polishing compound

Finishing compositions with reduced volatile organic compounds

Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method

Methods for planarization of Group VIII metal-containing surfaces using complexing agents

Method of chemically mechanically polishing substrates

Chemical mechanical polishing compositions and methods relating thereto

Cleaning and polishing wax composition

Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization

Method of manufacturing a semiconductor device

Polishing system comprising a highly branched polymer

Methanol-containing silica-based cmp compositions

Discoloration removal cleaning agent for titanium and titanium alloy building materials, and discoloration removal cleaning method

Polishing composition and polishing method

Chemical mechanical polishing systems and methods for their use

Slurry composition with high planarity and CMP process of dielectric film using the same

Compositions for planarization of metal-containing surfaces using halogens and halide salts

Glass powders, methods for producing glass powders and devices fabricated from same

Polishing composition and polishing method

Polishing composition

Polishing composition for magnetic disk

Polishing solution and method of polishing nonferrous metal materials

CMP slurry

Compositions and methods for low downforce pressure polishing of copper

Compositions and methods for controlled polishing of copper

Slurry for color photoresist planarization

Polishing composition

Aluminum oxide particles

Slurry compositions and CMP methods using the same

Self-cleaning colloidal slurry composition and process for finishing a surface of a substrate

Semiconductor polishing compound, process for its production and polishing method

Lubricant for wafer polishing using a fixed abrasive pad

Multi-step chemical mechanical polishing of a gate area in a FinFET

Slurry for CMP, polishing method and method of manufacturing semiconductor device

CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate

Post-CMP treating liquid and method for manufacturing semiconductor device

Aerosol method and apparatus, particulate products, and electronic devices made therefrom

High selectivity colloidal silica slurry

Method of chemical-mechanical polishing

CMP slurry for forming aluminum film, CMP method using the slurry, and method for forming aluminum wiring using the CMP method

Chemical mechanical abrasive slurry and method of using the same

Polishing composition for CMP having abrasive particles

Polishing composition

Compositions and methods for chemical mechanical polishing silica and silicon nitride

Method of manufacturing a semiconductor device

SLURRY AND USE THEREOF FOR POLISHING

Aerosol method and apparatus, coated particulate products, and electronic devices made therefrom

Electroluminescent phosphor powders, methods for making phosphor powders, and devices incorporating same

Self-cleaning colloidal slurry composition and process for finishing a surface of a substrate

Coated nickel-containing powders, methods and apparatus for producing such powders and devices fabricated from same

Compositions and methods for a barrier removal

Abrasive liquid for metal and method for polishing

Abrasives for copper CMP and methods for making

CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers

Method of second step polishing in copper CMP with a polishing fluid containing no oxidizing agent

Slurry compositions for chemical mechanical polishing of copper and barrier films

Cerium oxide abrasive and method of polishing substrates

Process for chemical-mechanical polishing of metal substrates

Chemical-mechanical planarization slurries and powders and methods for using same

Planarizing solutions including abrasive elements, and methods for manufacturing and using such planarizing solutions

Chemical-mechanical planarization composition having PVNO and associated method for use

Chemical-mechanical planarization composition with nitrogen containing polymer and method for use

Aerosol method and apparatus, particulate products, and electronic devices made therefrom

Method for making abrasive compositions and products thereof

Particulate or particle-bound chelating agents

Polishing composition and use thereof

Bicine/tricine containing composition and method for chemical-mechanical planarization

Tunable composition and method for chemical-mechanical planarization with aspartic acid/tolyltriazole

Method and system for planarizing integrated circuit material

Chemical-mechanical polishing (CMP) slurry and method of planarizing surfaces

Polishing method

Dispersion of pyrogenically produced cerium oxide

System for the preferential removal of silicon oxide

Chemical-mechanical polishing (CMP) slurry and method of planarizing computer memory disk surfaces

Barrier polishing fluid

Novel slurry for chemical mechanical polishing of metals

COMPOSITIONS COMPRISING GLASS PARTICLES AND METHODS OF DEPOSITING THE SAME

High-rate barrier polishing composition

Methods and compositions for chemical mechanical planarization of ruthenium

Slurry for CMP, polishing method and method of manufacturing semiconductor device

Metal CMP slurry compositions that favor mechanical removal of oxides with reduced susceptibility to micro-scratching

Coated silver-containing particles, method and apparatus of manufacture, and silver-containing devices made therefrom

Method for manufacturing SiC substrate

Polishing composition for semiconductor wafers

Chemical-mechanical polishing composition and method for using the same

Polishing kit for magnetic disk

Polishing composition

Polishing fluid and polishing method

Method of chemical mechanical polishing using abrasive particles of alkaline earth metal salts

Abrasives for CMP applications

Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method

Polishing composition for magnetic disk

Composition for polishing semiconductor layers

Chemical mechanical planarization compositions for reducing erosion in semiconductor wafers

CMP slurry

Polishing composition

Slurry and method for chemical-mechanical planarization of copper

Method of polishing metal and metal/dielectric structures

Polishing slurry and method for chemical-mechanical polishing of copper

Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates

CMP formulations

Composition for chemical-mechanical polishing and method of using same

Process and slurry for chemical mechanical polishing

Slurry for CMP, and method of manufacturing semiconductor device

Non-polymeric organic particles for chemical mechanical planarization

Polishing composition

Slurry for CMP, polishing method and method of manufacturing semiconductor device

CMP slurry and method of manufacturing semiconductor device

Aqueous dispersion for chemical/mechanical polishing

Method of enhancing the removal rate of polysilicon

Compressible non-reticulated polyurea polishing pad

Polishing composition and method of polishing a substrate having enhanced defect inhibition

Chemical mechanical polishing compositions and methods having enhanced defect inhibition and selectively polishing silicon nitride over silicon dioxide in an acid environment

Chemical mechanical polishing compositions and methods for suppressing the removal rate of amorphous silicon

Chemical mechanical polishing of tungsten using a method and composition containing quaternary phosphonium compounds

Chemical mechanical polishing pad and polishing method

Chemical mechanical polishing composition and method for tungsten

Method of manufacturing semiconductor device

Chemical mechanical polishing method for tungsten

Chemical mechanical polishing method for cobalt

Low-abrasive CMP slurry compositions with tunable selectivity

Cationic particle containing slurries and methods of using them for CMP of spin-on carbon films

Chemical mechanical polishing for improved contrast resolution

Aqueous compositions of low abrasive silica particles

Aqueous compositions of stabilized aminosilane group containing silica particles

Method of polishing semiconductor substrate

Aqueous polishing slurry

Cobalt inhibitor combination for improved dishing

Stable, concentratable silicon wafer polishing composition and related methods

Methods of fabricating polycrystalline diamond and polycrystalline diamond compacts with a carbonate material