Halide anions for metal removal rate control

Metal polishing slurry

Method for manufacturing semiconductor device

Semiconductor Polishing Composition

Cleaning and polishing wax composition

Chemical mechanical polishing slurry composition for shallow trench isolation process of semiconductor

Oxidation-stabilized CMP compositions and methods

CMP POLISHING SLURRY AND METHOD OF POLISHING SUBSTRATE

HIGH SELECTIVITY SLURRY COMPOSITIONS FOR CHEMICAL MECHANICAL POLISHING

Copper-based metal polishing compositions and polishing processes

Polishing composition for a tungsten-containing substrate

Compositions for chemical mechanical polishing silicon dioxide and silicon nitride

Cleaning and polishing composition for metallic surfaces

Semiconductor Polishing Composition

Composition and method to polish silicon nitride

Polishing agent

Polishing apparatus and polishing method

Aerosol method and apparatus, particulate products, and electronic devices made therefrom

Process for producing CeOfine particles and polishing slurry containing such fine particles

Polishing composition and polishing method

Chemical mechanical polishing process

Polishing liquid for metals

Metal-Polishing Liquid And Polishing Method Using The Same

CMP slurry and method for polishing semiconductor wafer using the same

Slurry composition and method for polishing organic polymer-based ophthalmic substrates

POLISHING MEDIUM FOR CHEMICAL-MECHANICAL POLISHING, AND POLISHING METHOD

Compositions and methods for CMP of indium tin oxide surfaces

Polishing composition and rinse composition

POLISHING COMPOSITION AND RINSE COMPOSITION

Metal-polishing liquid and chemical mechanical polishing method using the same

Multi-component barrier polishing solution

PASSIVATIVE CHEMICAL MECHANICAL POLISHING COMPOSITION FOR COPPER FILM PLANARIZATION

Polishing liquid for barrier layer

Compositions and methods for CMP of semiconductor materials

CMP porous pad with component-filled pores

Method for improving mechanical properties of polymer particles and its applications

Compositions and methods for CMP of phase change alloys

Metal- polishing liquid and chemical-mechanical polishing method using the same

Compositions and methods for chemical mechanical polishing interlevel dielectric layers

Polishing composition and polishing method

Polishing slurry for silicon oxide, additive liquid and polishing method

CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive

POLISHING COMPOSITION

Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same

Metal-polishing liquid and chemical-mechanical polishing method using the same

Polishing method

Nanocarbon fulerenes (ncf), method for producing ncf and use of ncf in the form of nanocarbons

Cerium salt, producing method thereof, cerium oxide and cerium based polishing slurry

Composition for polishing semiconductor layers

Copper CMP slurry composition

Slurry composition for chemical-mechanical polishing capable of compensating nanotopography effect and method for planarizing surface of semiconductor device using the same

Dispersion for the chemical-mechanical polishing of metal surfaces containing metal oxide particles and a cationic polymer

Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same

Polishing composition for hard disk substrate

Slurry compositions, methods of polishing polysilicon layers using the slurry compositions and methods of manufacturing semiconductor devices using the slurry compositions

Polishing composition for glass substrate

Slurry and method for chemical-mechanical polishing

Chemical mechanical polishing particles and slurry and method of producing the same

Polishing slurry for polishing aluminum film and polishing method for polishing aluminum film using the same

Security features incorporating photoluminescent phosphor powders and methods for making security features

Use of fluorinated additives in the etching or polishing of integrated circuits

Adjuvant for controlling polishing selectivity and chemical mechanical polishing slurry comprising the same

Composition for polishing semiconductor layers

ROLL-OFF REDUCING AGENT

CHEMICAL MECHANICAL POLISHING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Aqueous dispersion for CMP, polishing method and method for manufacturing semiconductor device

Polishing composition and polishing method

Texturing slurry and texturing method by using same

Coated silver-containing particles, method and apparatus of manufacture, and silver-containing devices made therefrom

Texturing pads and slurry for magnetic heads

System for the preferential removal of silicon oxide

SURFACE DEFECT TREATMENT COMPOSITIONS

Polishing slurry for CMP and polishing method

Polishing apparatus and method of polishing work

Method of producing III-nitride substrate

COPPER-BASED METAL POLISHING SOLUTION AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Coated silver-containing particles, method and apparatus of manufacture, and silver-containing devices made therefrom

Chemical mechanical polishing slurry compositions, methods of preparing the same and methods of using the same

Method for preparing of cerium oxide powder for chemical mechanical polishing and method for preparing of chemical mechanical polishing slurry using the same

Abrasive slurry having high dispersion stability and manufacturing method for a substrate

Polishing liquid

CERIUM OXIDE SLURRY, CERIUM OXIDE POLISHING SLURRY AND METHOD FOR POLISHING SUBSTRATE USING THE SAME

Polishing method of Cu film and method for manufacturing semiconductor device

CMP of copper/ruthenium substrates

Polishing slurries

Polishing composition for a semiconductor substrate

LOW COST AND LOW DISHING SLURRY FOR POLYSILICON CMP

Polishing composition and polishing method

Cerium-based abrasive, abrasive slurry, and production of cerium-based abrasive

Method for controlling polysilicon removal

Polishing method, polishing composition and polishing composition kit

Ultrapure colloidal silica for use in chemical mechanical polishing applications

CMP slurry, preparation method thereof and method of polishing substrate using the same

Stabilizer-Fenton's reaction metal-vinyl pyridine polymer-surface-modified chemical mechanical planarization composition and associated method

Polishing slurry, method of treating surface of GaInAsPcrystal and GaInAsPcrystal substrate

Composition and method for planarizing surfaces

Polishing composition and polishing method

Method for fabricating semiconductor device and polishing method

Aqueous polishing liquid and chemical mechanical polishing method

Composition and method for enhancing pot life of hydrogen peroxide-containing CMP slurries

Metal cations for initiating polishing

Metal polishing liquid and polishing method using it

Polishing method for glass substrate, and glass substrate

Metal-polishing liquid and chemical-mechanical polishing method

Polishing method for semiconductor wafer

Ed's baby powder glaze polish

Conductive hydrocarbon fluid

Rapid generation of nanoparticles from bulk solids at room temperature

CMP composition of boron surface-modified abrasive and nitro-substituted sulfonic acid and method of use

Abrasive composition for the integrated circuit electronics industry

Polymeric barrier removal polishing slurry

Electropolishing liquid, electropolishing method, and method for fabricating semiconductor device

Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing process, and process for producing semiconductor devices

Chemical-mechanical planarization composition having ketooxime compounds and associated method for use

Compositions and methods for chemical mechanical polishing silicon dioxide and silicon nitride

Polishing liquid composition

Polishing composition

Polishing composition and polishing method

Polishing slurries and methods for chemical mechanical polishing

Dispersion for chemical-mechanical polishing

CMP wafer contamination reduced by insitu clean

Method for preparing polishing slurry

Aqueous slurry containing metallate-modified silica particles

Polishing method

Polishing slurries and methods for chemical mechanical polishing

Polishing composition and polishing method

Composite materials and method for making same

Chemical-mechanical polishing (CMP) slurry containing clay and CeO2 abrasive particles and method of planarizing surfaces

Use of CMP for aluminum mirror and solar cell fabrication

Compositions and methods for chemical mechanical polishing silica and silicon nitride

Polishing composition and polishing method

Slurry for chemical mechanical polishing of aluminum

Method for chemically mechanically polishing organic film, method of manufacturing semiconductor device, and program therefor

Semiconductor device fabrication method

Polishing slurry and polishing method

NON-AQUEOUS LAPPING COMPOSITION AND METHOD USING SAME

Compositions containing free radical quenchers

Polar surface preparation of nitride substrates

Polishing compound

Planarization composition

Abrasive compounds for semiconductor planarization

Polishing composition and method for defect improvement by reduced particle stiction on copper surface

Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion

Dihydroxy enol compounds used in chemical mechanical polishing compositions having metal ion oxidizers

Detecting particle agglomeration in chemical mechanical polishing slurries

Engineered non-polymeric organic particles for chemical mechanical planarization

Method for manufacturing metal line contact plug of semiconductor device

Methods for planarization of group VIII metal-containing surfaces using oxidizing agents

Polishing composition and polishing method using same

Electroluminescent phosphor powders, methods for making phosphor powders and devices incorporating same

Polishing slurry and method of reclaiming wafers

Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization

Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods

Chemical mechanical polishing compositions for step-ll copper line and other associated materials and method of using same

Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods

Method of producing III-nitride substrate

Abrasive, method of polishing target member and process for producing semiconductor device

Method for polishing wafer

Slurry composition for chemical mechanical polishing, method for planarization of surface of semiconductor element using the same, and method for controlling selection ratio of slurry composition

Process for preparing a polishing composition

CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device

Slurry composition for secondary polishing of silicon wafer

Method of washing a polished object

Method of manufacturing abrasive composition

Polishing liquid composition

Method of surface treatment of group III nitride crystal film, group III nitride crystal substrate, group III nitride crystal substrate with epitaxial layer, and semiconductor device

Compositions and methods for removing scratches from plastic surfaces

Cerium oxide abrasives for chemical mechanical polishing

Sulfur-containing phosphor powders, methods for making phosphor powders and devices incorporating same

Exposing substance, exposing method, and exposing device

Slurry composition and method for polishing organic polymer-based ophthalmic substrates

Polymeric inhibitors for enhanced planarization

Chemical-mechanical polishing (CMP) slurry and method of planarizing computer memory disk surfaces

Polishing technique to minimize abrasive removal of material and composition therefor

Metal CMP process on one or more polishing stations using slurries with oxidizers

Polishing composition and polishing method using the same

Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same

Chemical and mechanical polishing method and polishing liquid using therefor

Composition for oxide CMP in CMOS device fabrication

Metal polishing solution and polishing method

Low-dishing composition and method for chemical-mechanical planarization with branched-alkylphenol-substituted benzotriazole

Method for preparing a polishing slurry having high dispersion stability

Barrier polishing fluid

Ceria abrasive for cmp

Compositions and methods for chemical mechanical polishing interlevel dielectric layers

Compositions and methods for chemical mechanical polishing thin films and dielectric materials

Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion

Methods and compositions for removing Group VIII metal-containing materials from surfaces

Pyrogenic silicon dioxide powder and dispersion thereof

Multi-formulated composition and method for pretreatment, resurfacing, and restoration of plastic material

Slurry for CMP, polishing method and method of manufacturing semiconductor device

CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate

Polishing slurry composition and method of using the same

Composition and method for polishing a sapphire surface

Method of polishing a silicon-containing dielectric

Process for the production of metal oxide powders

Method of polishing a wafer

Method for manufacturing semiconductor device, integrated circuit, electrooptics device, and electronic apparatus

Slurry composition, method of polishing an object and method of forming a contact in a semiconductor device using the slurry composition

Polishing medium for chemical-mechanical polishing, and polishing method

CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate

Chemical mechanical polishing method

Methods for planarization of group VIII metal-containing surfaces using oxidizing gases

Free radical-forming activator attached to solid and used to enhance CMP formulations

Cerium oxide abrasive and method of polishing substrates

Method and composition for polishing a substrate

Abrasive partilcle for chemical mechanical polishing

Slurry for polishing copper film and method for polishing copper film using the same

Corrosion-resistant barrier polishing solution

Novel polishing slurries and abrasive-free solutions having a multifunctional activator

Composition and associated method for catalyzing removal rates of dielectric films during chemical mechanical planarization

Chemical mechanical polishing compositions for metal and associated materials and method of using same

Slurry for use in metal-chemical mechanical polishing and preparation method thereof

Polishing composition and rinsing composition

CMP polishing compound and polishing method

Selective polish for fabricating electronic devices

Dual reduced agents for barrier removal in chemical mechanical polishing

Method of polishing a silicon-containing dielectric

Slurry compositions for use in chemical mechanical polishing and method of manufacturing semiconductor device using the same

Polishing fluid for metal, and polishing method

Chemical mechanical polishing method

Adjuvant for chemical mechanical polishing slurry

Copper containing abrasive particles to modify reactivity and performance of copper CMP slurries

Multi-step methods for chemical mechanical polishing silicon dioxide and silicon nitride

Polishing compositions for reducing erosion in semiconductor wafers

Selective slurry for chemical mechanical polishing

Polishing slurry for ionic materials, method for selecting a dispersant to be contained in the polishing slurring, method for determining a mixing concentration of the selected dispersant and polishing method using said polishing slurry

Polishing medium for chemical-mechanical polishing, and method of polishing substrate member

Chemical mechanical polishing (CMP) slurries and CMP methods using and making the same

Colloidal silica based chemical mechanical polishing slurry

Chemical mechanical polish slurry

Polishing slurry for chemical mechanical polishing and method for polishing substrate

Polishing solutions

Abrasive enhancing composition

Method for setting firing temperature of cerium carbonate, method for producing cerium oxide abrasives and cerium oxide abrasives obtained by the method

Slurry composition and methods for chemical mechanical polishing

CERIUM OXIDE ABRASIVE AND METHOD OF POLISHING SUBSTRATES

Free radical-forming activator attached to solid and used to enhance CMP formulations

Polishing composition

Metal polishing composition and method of polishing using the same

Polishing composition for a semiconductor substrate

Hydrothermal synthesis of cerium-titanium oxide for use in CMP

Cellulose-containing polishing compositions and methods relating thereto

Barrier polishing solution

Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios

Polishing process for producing damage free surfaces on semi-insulating silicon carbide wafers

Process for the produciton of metal oxide and metalloid oxide dispersions

Simultaneous planarization of pole piece and coil materials for write head applications

Novel slurry for chemical mechanical polishing of metals

Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios

Novel slurry for chemical mechanical polishing of metals

High selectivity slurry compositions for chemical mechanical polishing

CMP composition comprising surfactant

CMP composition containing surface-modified abrasive particles

Chemical mechanical polishing method, and washing/rinsing method associated therewith

Generating nano-particles for chemical mechanical planarization

Polishing composition

Methods and compositions for chemical mechanical polishing substrates

Methods and compositions for chemical mechanical polishing substrates

Aqueous slurry composition for chemical mechanical planarization

Metal ion-containing CMP composition and method for using the same

Polishing slurries for copper and associated materials

Systems, methods and slurries for chemical mechanical polishing

Composition for selectively polishing silicon nitride layer and polishing method employing it

Polishing composition and polishing method using the same

CMP composition with a polymer additive for polishing noble metals

Polishing composition and method of polishing with the same

Selective barrier slurry for chemical mechanical polishing

Polishing composition and process for producing wiring structure using it

Slurry compositions, methods of preparing slurry compositions, and methods of polishing an object using slurry compositions

CHEMICAL MECHANICAL POLISHING PROCESS

Chemical mechanical polishing process

Ceria-based polish processes, and ceria-based slurries

Metal surface protective film forming agent and use thereof

Polishing composition and polishing method using the same

Monitoring and control of a fabrication process

Polishing composition and polishing method using the same

Chemical-mechanical planarization composition having benzenesulfonic acid and per-compound oxidizing agents, and associated method for use

Composition for polishing metal, polishing metod for metal layer, and production method for wafer

Chemical mechanical polishing process for 2.45T CoFeNi structures of thin film magnetic heads

Ceria composition and process for preparing same

Slurry, chemical mechanical polishing method using the slurry, and method of forming a surface of a capacitor using the slurry

Polishing medium for chemical-mechanical polishing, and method of polishing substrate member

Ceria composition and process for preparing same

METHODS OF CONTROLLING THE PROPERTIES OF ABRASIVE PARTICLES FOR USE IN CHEMICAL-MECHANICAL POLISHING SLURRIES

Polishing slurry, method of producing same, and method of polishing substrate

Method of manufacturing polishing slurry for use in precise polishing process

Method of preparing slurry composition for chemical mechanical polishing

Polymer-coated particles for chemical mechanical polishing

Slurry for CMP, polishing method and method of manufacturing semiconductor device

Polishing composition

Compositions and methods for tantalum CMP

Slurry, chemical mechanical polishing method using the slurry, and method of forming metal wiring using the slurry

Method of forming a polishing inhibiting layer using a slurry having an additive

High surface quality GaN wafer and method of fabricating same

CMP composition containing organic nitro compounds

Polish having improved abrasion resistance

Polishing composition for noble metals

Method of manufacturing of polymer-coated particles for chemical mechanical polishing

Compositions and methods for chemical mechanical polishing silicon dioxide and silicon nitride