ClassID:

103463

C09G1/04 - page 2 - CPC Classification

Classification description:

Polishing compositions Aqueous dispersions

Recent Application in this class:
#301
20060201378
2006-09-14

Multi-formulated composition and method for pretreatment, resurfacing, and restoration of plastic material

#302
20060186373
2006-08-24

Polishing medium for chemical-mechanical polishing, and polishing method

#303
20060175298
2006-08-10

Method and composition for polishing a substrate

#304
20060169674
2006-08-03

Method and composition for polishing a substrate

#305
20060163083
2006-07-27

Method and composition for electro-chemical-mechanical polishing

#306
20060141913
2006-06-29

Wafer planarization composition and method of use

#307
20060111024
2006-05-25

Cellulose-containing polishing compositions and methods relating thereto

#308
20060110924
2006-05-25

Abrasive-free chemical mechanical polishing compositions and methods relating thereto

#309
20060067900
2006-03-30

Method and composition for imparting high shine to a polymeric substrate

#310
20060049382
2006-03-09

Metal surface protective film forming agent and use thereof

#311
20060042501
2006-03-02

Polishing liquid

#312
20060000808
2006-01-05

Polishing solution of metal and chemical mechanical polishing method

#313
20060000151
2006-01-05

Chemical mechanical polishing compositions and methods relating thereto

#314
20060000150
2006-01-05

Chemical mechanical polishing compositions and methods relating thereto

#315
20050239379
2005-10-27

Miracle Sand, a process that removes paint runs, orange peel and other flaws from latex paint, lacquer and other coatings with the use of Miracle Sand and a sanding sponge

#316
20050215678
2005-09-29

FLUOROCHEMICAL FREE AQUEOUS COATING COMPOSITIONS AND METHODS OF USE THEREOF

#317
20050181609
2005-08-18

Polishing fluid and polishing method

#318
20050176250
2005-08-11

Polishig fluid for metallic films and method for producing semiconductor substrate using the same

#319
20050145507
2005-07-07

Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP

#320
20050136671
2005-06-23

Compositions and methods for low downforce pressure polishing of copper

#321
20050104048
2005-05-19

Compositions and methods for polishing copper

#322
20050079709
2005-04-14

Planarization system and method using a carbonate containing fluid

#323
20050045852
2005-03-03

Particle-free polishing fluid for nickel-based coating planarization

#324
20050037936
2005-02-17

Copper chemical mechanical polishing solutions using sulfonated amphiprotic agents

#325
20050026437
2005-02-03

Abrasive free formulations for chemical mechanical polishing of copper and associated materials and method of using same

#326
20050022309
2005-02-03

Composition, wipe and method for cleaning, protecting and imparting gloss to a substrate

#327
16166085
2020-03-24

Chemical mechanical polishing composition and method for tungsten

#328
15297716
2017-10-10

Aqueous compositions of low abrasive silica particles

#329
15297706
2017-10-31

Aqueous compositions of stabilized aminosilane group containing silica particles

#330
13860806
2014-08-05

Silicon wafer polishing composition and related methods