103463 ⎘
Polishing compositions Aqueous dispersions
CHEMICAL POLISHING BATH FOR TITANIUM AND TITANIUM ALLOYS, AND METHOD USING SUCH A BATH
#2TOOLS FOR CHEMICAL PLANARIZATION
#3Soluble Metal Oxide Anion CMP Slurry
#4SLURRY COMPOSITION FOR POLISHING METAL AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME
#5SURFACE COATED ABRASIVE PARTICLES FOR TUNGSTEN BUFF APPLICATIONS
#6POLISHING COMPOSITION FOR A SEMICONDUCTOR PROCESS AND MANUFACTURING METHOD OF SUBSTRATE USING THE SAME
#7PHOTOELECTRIC FLUID FIELD CLUSTER CATALYTIC METHOD FOR ATOMIC-SCALE DETERMINISTIC PROCESSING
#8ANTIFOAMER FOR GRINDING OR POLISHING COMPOSITIONS AND METHODS FOR USING THE SAME
#9POLISHING SLURRY COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME
#10COMPOSITION FOR ETCHING AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME
#11CHEMICAL MECHANICAL POLISH SLURRY AND METHOD OF MANUFACTURE
#12CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD OF POLISHING METAL LAYER
#13CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
#14CHEMICAL MECHANICAL POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
#15NITRIDE INHIBITORS FOR HIGH SELECTIVITY OF TiN-SiN CMP APPLICATIONS
#16COMPOSITIONS AND METHODS OF USE THEREOF
#17POLISHING LIQUID FOR POLISHING COMPOUND SEMICONDUCTOR SUBSTRATE
#18Ruthenium CMP chemistry based on halogenation
#19SURFACE TREATMENT ARTICLES, DEVICES AND METHODS FOR MAKING THE SAME
#20POLISHING LIQUID FOR POLISHING COMPOUND SEMICONDUCTOR SUBSTRATE
#21SLURRY COMPOSITION FOR POLISHING METAL AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME
#22Polishing Compositions and Methods of Using Same
#23CHEMICAL POLISHING BATH FOR ALUMINUM AND ALUMINUM ALLOYS, AND METHOD USING SUCH A BATH
#24CHEMICAL PLANARIZATION
#25Ruthenium CMP chemistry based on halogenation
#26Slurry composition for chemical mechanical polishing
#27TOOLS FOR CHEMICAL PLANARIZATION
#28COMPOSITIONS AND METHODS OF USE THEREOF
#29CHEMICAL MECHANICAL POLISHING SOLUTION
#30Methods for polishing dielectric layer in forming semiconductor device
#31With-In Die Non-Uniformities (WID-NU) In Planarization
#32Polishing compositions for reduced defectivity and methods of using the same
#33SUSPENSION FOR CHEMICAL MECHANICAL PLANARIZATION (CMP) AND METHOD EMPLOYING THE SAME
#34CMP slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same
#35CMP SLURRY COMPOSITION FOR POLISHING TUNGSTEN PATTERN WAFER AND METHOD OF POLISHING TUNGSTEN PATTERN WAFER USING THE SAME
#36COMPOSITIONS FOR TUNGSTEN ETCHING INHIBITION
#37SILICON CARBONITRIDE POLISHING COMPOSITION AND METHOD
#38Spherical inorganic particles having surface bumps formed thereon, and method of manufacturing same
#39CHITOSAN BASED COATING SYSTEM
#40Chemical mechanical polishing pad and polishing method
#41Silicon carbide substrate
#42SURFACE TREATMENT ARTICLES, DEVICES AND METHODS FOR MAKING THE SAME
#43Methods for polishing dielectric layer in forming semiconductor device
#44Chemical mechanical polishing slurry composition and method of polishing metal layer
#45Chemical mechanical polishing composition containing composite silica particles, method of making the silica composite particles and method of polishing a substrate
#46FREEZE-THAW STABLE WATER-IN-OIL EMULSION CLEANER AND/OR POLISH COMPOSITIONS
#47Polishing compositions and methods of using same
#48POLISHING AGENT REGENERATING METHOD AND POLISHING AGENT RECYCLE PROCESSING SYSTEM
#49Polishing composition
#50Calcium carbonate slurry
#51Polishing liquid and chemical mechanical polishing method
#52POLISHING SLURRY COMPOSITION
#53Polishing slurry composition
#54POLISHING LIQUID
#55Intermediate raw material, and polishing composition and composition for surface treatment using the same
#56Hydrophilization treatment liquid for semiconductor wafer surface
#57Hard abrasive particle-free polishing of hard materials
#58Chemical mechanical polishing composition containing composite silica particles, method of making the silica composite particles and method of polishing a substrate
#59Chemical Mechanical Polish Slurry and Method of Manufacture
#60Polishing slurry, method for polishing glass, and method for manufacturing glass
#61Chemical mechanical polishing composition, chemical mechanical polishing slurry and method for polishing substrate
#62Polishing agent, polishing method, and liquid additive for polishing
#63Barrier ruthenium chemical mechanical polishing slurry
#64Structure and formation method of semiconductor device with conductive feature
#65Derivatized polyamino acids
#66Polishing compositions for reduced defectivity and methods of using the same
#67Chemical mechanical polishing slurry composition and method of polishing metal layer
#68Etching composition for silicon nitride layer and method of etching silicon nitride layer using the same
#69Polishing compositions and methods of use thereof
#70USE OF A CHEMICAL MECHANICAL POLISHING (CMP) COMPOSITION FOR POLISHING OF COBALT COMPRISING SUBSTRATES
#71Water-based coating compositions that resist dirt pickup
#72Semiconductor element
#73Polishing slurry, method for polishing glass, and method for manufacturing glass
#74Polishing liquid, polishing liquid set and polishing method
#75Method of selective chemical mechanical polishing cobalt, zirconium oxide, poly-silicon and silicon dioxide films
#76Etching composition, method for etching insulating film of semiconductor devices using the same and method for preparing semiconductor devices
#77Method for producing aluminum platter
#78Composition and method for polysilicon CMP
#79Composition for etching and manufacturing method of semiconductor device using the same
#80Composition for etching and manufacturing method of semiconductor device using the same
#81Composition for etching and manufacturing method of semiconductor device using the same
#82Composition for etching and manufacturing method of semiconductor device using the same
#83Semiconductor element
#84Polishing liquid, polishing liquid set, and polishing method
#85Metal structure and method of manufacturing the same and metal wire and semiconductor device and electronic device
#86Polishing compositions for reduced defectivity and methods of using the same
#87CMP slurry solution for hardened fluid material
#88Slurry composition and method of manufacturing integrated circuit device by using the same
#89SURFACE COATED ABRASIVE PARTICLES FOR TUNGSTEN BUFF APPLICATIONS
#90Acid polishing composition and method of polishing a substrate having enhanced defect inhibition
#91Roughness reduction methods for materials using illuminated etch solutions
#92Water-based coating compositions that resist dirt pickup
#93Method of polishing substrate and polishing composition set
#94Polishing additive composition, polishing slurry composition and method for polishing insulating film of semiconductor element
#95Composition and method for metal CMP
#96Polishing composition and polishing method using the same
#97Polishing method
#98Polishing composition containing amphoteric surfactant
#99Polishing composition
#100HARD ABRASIVE PARTICLE-FREE POLISHING OF HARD MATERIALS METHOD
#101Chemical mechanical planarization composition for polishing oxide materials and method of use thereof
#102Structure and formation method of semiconductor device with conductive feature
#103Chemical mechanical polish slurry and method of manufacture
#104Compositions for use in chemical mechanical polishing
#105Chemical mechanical planarization of films comprising elemental silicon
#106Composition for surface treatment, method for producing the same, surface treatment method using composition for surface treatment, and method for producing semiconductor substrate
#107Calcium carbonate slurry
#108Composition and method for polishing memory hard disks exhibiting reduced edge roll off
#109Polishing liquid and polishing method
#110Barrier ruthenium chemical mechanical polishing slurry
#111Polishing slurry and method of polishing substrate by using the polishing slurry
#112Ceria composite particle dispersion, method for producing same, and polishing abrasive grain dispersion comprising ceria composite particle dispersion
#113COMPOSITION FOR SEMICONDUCTOR TREATMENT AND TREATMENT METHOD
#114ABRASIVE GRAINS, MANUFACTURING METHOD THEREFOR, POLISHING SLURRY CONTAINING SAID ABRASIVE GRAINS, AND POLISHING METHOD USING SAID POLISHING SLURRY
#115Chemical mechanical polishing slurry composition for polishing polycrystalline silicon film
#116Silica-based composite fine particle dispersion and method for manufacturing same
#117Freeze-thaw stable water-in-oil emulsion cleaner and/or polish compositions
#118Composition for etching and manufacturing method of semiconductor device using the same
#119Polishing agent, polishing method, and liquid additive for polishing
#120POLISHING LIQUID FOR GLASS, AND POLISHING METHOD
#121Composition for conducting material removal operations and method for forming same
#122Aqueous silica slurry and amine carboxylic acid compositions selective for nitride removal in polishing and methods of using them
#123Aqueous anionic functional silica slurry and amine carboxylic acid compositions for selective nitride removal in polishing and methods of using them
#124Production method of polishing composition
#125COMPOSITION FOR TUNGSTEN CMP
#126Stop-On Silicon Containing Layer Additive
#127Polishing slurry and polishing material
#128Hard abrasive particle-free polishing of hard materials
#129Organic film CMP slurry composition and polishing method using same
#130Oxidizing fluid for the chemical-mechanical polishing of ceramic materials
#131Abrasive slurry regeneration method
#132Chemical-mechanical processing slurry and methods for processing a nickel substrate surface
#133System for chemical mechanical polishing of Ge-based materials and devices
#134Slurry for polishing of integrated circuit packaging
#135Polishing liquid, polishing liquid set, and substrate polishing method
#136Polishing slurry for cobalt-containing substrate
#137Method for polishing cobalt-containing substrate
#138Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt comprising substrates
#139Compositions and methods for removing ceria particles from a surface
#140Method for producing zeta negative nanodiamond dispersion and zeta negative nanodiamond dispersion
#141POLISHING COMPOSITIONS WITH IMPROVED LOW TEMPERATURE PROPERTIES
#142Treatment composition for chemical mechanical polishing, chemical mechanical polishing method, and cleaning method
#143Chemical mechanical planarization slurry and method for forming same
#144TREATMENT COMPOSITION FOR CHEMICAL MECHANICAL POLISHING, CHEMICAL MECHANICAL POLISHING METHOD, AND CLEANING METHOD
#145Floor coating compositions and related methods
#146DIAMOND-BASED SLURRIES WITH IMPROVED SAPPHIRE REMOVAL RATE AND SURFACE ROUGHNESS
#147Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt and / or cobalt alloy comprising substrates
#148Chemical mechanical polishing (CMP) composition for high effective polishing of substrates comprising germanium
#149Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt and / or cobalt alloy comprising substrates
#150Single crystal silicon-carbide substrate and polishing solution
#151Chemical mechanical polishing slurry, method for chemical mechanical polishing and manufacturing method of semiconductor structure
#152Semiconductor treatment composition and treatment method
#153Single-crystal silicon-carbide substrate and polishing solution
#154CMP polishing agent, manufacturing method thereof, and method for polishing substrate
#155COMPOSITIONS AND METHODS FOR TREATING LEATHER
#156CMP slurry composition for polishing copper line and polishing method using same
#157Protective coating compositions
#158Tungsten processing slurry with catalyst
#159Abrasive particle-dispersion layer composite and polishing slurry composition including the same
#160Additive composition and positive polishing slurry composition including the same
#161Water-based coating compositions that resist dirt pickup
#162CMP slurry solution for hardened fluid material
#163Chemical mechanical polishing (CMP) composition
#164Halite salts as silicon carbide etchants for enhancing CMP material removal rate for SiC wafer
#165pH-adjuster free chemical mechanical planarization slurry
#166Slurry composition for chemical mechanical polishing of GE-based materials and devices
#167Stop-on silicon containing layer additive
#168POLISHING COMPOSITION
#169Polishing composition, polishing method, and method for producing substrate
#170Method of chemical mechanical polishing of alumina
#171Polishing composition containing ceria abrasive
#172CMP polishing agent, method for manufacturing thereof, and method for polishing substrate
#173Epoxy-fortified floor polishes
#174Chemical mechanical polishing method using slurry composition containing N-oxide compound
#175Ni:NiGe:Ge selective etch formulations and method of using same
#176Cu-low K cleaning and protection compositions
#177CMP composition and method for polishing rigid disks
#178Polishing composition containing ceria abrasive
#179Composition and method for polishing memory hard disks exhibiting reduced edge roll-off
#180Dishing reducing in tungsten chemical mechanical polishing
#181CMP composition for silicon nitride removal
#182Polishing composition and method for producing same
#183Polishing composition and method for producing same
#184POLISHING COMPOSITION
#185Polishing composition
#186Kit for polishing sapphire surfaces
#187Polishing liquid and method of polishing SiC substrate
#188Slurry composition for chemical mechanical polishing of Ge-based materials and devices
#189Slurry composition and method of substrate polishing
#190Method for producing zeta negative nanodiamond dispersion and zeta negative nanodiamond dispersion
#191Polishing of hard substrates with soft-core composite particles
#192Etching liquid, etching method, and method of manufacturing solder bump
#193Chemical mechanical polishing of alumina
#194Method for chemical mechanical polishing substrates containing ruthenium and copper
#195Polishing agent, polishing method and additive liquid for polishing
#196Colloidal silica chemical-mechanical polishing concentrate
#197Methods for fabricating a chemical-mechanical polishing composition
#198Colloidal silica chemical-mechanical polishing composition
#199Colloidal silica chemical-mechanical polishing composition
#200Polishing composition for edge roll-off improvement
#201Polishing slurry preventing agglomeration of charged colloids without loss of surface activity
#202Brightening and passivation of stainless steel surfaces
#203Slurry for chemical-mechanical polishing of metals and use thereof
#204Mixed abrasive tungsten CMP composition
#205Composition and method for polishing memory hard disks
#206GLOSS ENHANCING AND STAINLESS STEEL POLISH COMPOSITIONS
#207Chemical mechanical polishing composition comprising polyvinyl phosphonic acid and its derivatives
#208Emulsion compositions and applications therefor
#209Contact release capsule useful for chemical mechanical planarization slurry
#210Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications
#211Chemical mechanical polishing method using slurry composition containing N-oxide compound
#212Chemical mechanical polishing (CMP) composition comprising two types of corrosion inhibitors
#213Polishing composition and polishing method using the same
#214Chemical-mechanical planarization of polymer films
#215Abrasive composition and method for producing semiconductor substrate
#216Abrasive particle, polishing slurry, and method of manufacturing semiconductor device using the same
#217Polishing composition, manufacturing process therefor, process for production of silicon substrate, and silicon substrate
#218Wet sanding compositions
#219Polishing method
#220Liquid suspensions and powders of cerium oxide particles and preparation and polishing applications thereof
#221Coating compositions having chelant functionality
#222Compositions and methods for CMP of silicon oxide, silicon nitride, and polysilicon materials
#223Polishing agent for synthetic quartz glass substrate
#224POLISHING COMPOSITION
#225CHEMICAL MECHANICAL POLISHING METHODS AND SYSTEMS INCLUDING PRE-TREATMENT PHASE AND PRE-TREATMENT COMPOSITIONS
#226Methods of polishing sapphire surfaces
#227SINGLE-CRYSTAL SILICON-CARBIDE SUBSTRATE AND POLISHING SOLUTION
#228Polishing composition, polishing method using same, and method for producing semiconductor device
#229Polypyrrolidone polishing composition and method
#230Polishing method of non-oxide single-crystal substrate
#231COMPOSITIONS AND METHODS FOR SELECTIVE POLISHING OF PLATINUM AND RUTHENIUM MATERIALS
#232POLISHING COMPOSITION AND POLISHING METHOD USING THE SAME
#233POLISHING COMPOSITION, POLISHING METHOD USING SAME, AND SUBSTRATE PRODUCTION METHOD
#234Aqueous polishing composition and process for chemically mechanically polishing substrates having patterned or unpatterned low-k dielectric layers
#235Aqueous floor polishing composition
#236Polish composition
#237Method of polishing a substrate
#238Slurry for chemical-mechanical polishing of metals and use thereof
#239Low gloss aqueous coating compositions containing poly(ethylene oxide)
#240Polishing method and method for forming a gate
#241Wet sanding compositions
#242Leather-surface repair-composition and the method for surface repair of leather surfaces
#243Abrasive Free Silicon Chemical Mechanical Planarization
#244Polishing agent, compound semiconductor manufacturing method, and semiconductor device manufacturing method
#245Protective coating compositions
#246NON-BUFFING WAX EMULSION COMPOSITION
#247Chemical planarization of copper wafer polishing
#248Liquid suspensions and powders of cerium oxide particles and preparation and polishing applications thereof
#249Polishing composition and polishing method using the same
#250Aqueous coating composition
#251Abrasive-free chemical mechanical polishing compositions
#252Method for polishing through-silicon via (TSV) wafers and a polishing composition used in the method
#253Polishing pad and method for polishing a semiconductor wafer
#254Solution for forming polishing slurry, polishing slurry and related methods
#255POLISHING AGENT FOR SYNTHETIC QUARTZ GLASS SUBSTRATE
#256Phosphate surfactants
#257Systems, methods and solutions for chemical polishing of GaAs wafers
#258Aqueous compositions of fluorinated surfactants and methods of using the same
#259Method for purifying chemical added with chelating agent
#260METHOD AND COMPOSITION FOR ELECTRO-CHEMICAL-MECHANICAL POLISHING
#261Chemical mechanical polishing composition and methods relating thereto
#262Aqueous Solution for Chemical Polishing and Deburring and Process for Polishing and Deburring A Part made of Pure Nickel or Nickel-200 Therein
#263Chemical mechanical polishing slurry composition for polishing phase-change memory device and method for polishing phase-change memory device using the same
#264Leather-surface repair-composition and the method for surface repair of leather surfaces
#265Polishing Copper-Containing patterned wafers
#266Low-stain polishing composition
#267Strippable floor coating and method of forming the coating
#268Leveling agent and water-based floor-polishing composition comprising the leveling agent
#269Furniture polish compositions substantially free of organic solvents
#270Chemical Mechanical Polishing Slurry Composition for Polishing Phase-Change Memory Device and Method for Polishing Phase-Change Memory Device Using the Same
#271Chemical Mechanical Polishing Slurry Composition for Polishing Phase-Change Memory Device and Method for Polishing Phase-Change Memory Device Using the Same
#272Polishing fluids and methods for CMP
#273Polishing fluids and methods for CMP
#274Polishing Slurry
#275SELECTIVE CHEMISTRY FOR FIXED ABRASIVE CMP
#276Pre-polishing treatment solution for interconnect substrate, polishing method, and method and apparatus for manufacturing interconnect substrate
#277Chemical mechanical planarization composition, system, and method of use
#278Chemical mechanical polishing process and method of fabricating semiconductor device using the same
#279Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
#280STABILIZER FOR ACIDIC, METAL-CONTAINING POLISHING BATHS
#281Solution for forming polishing slurry, polishing slurry and related methods
#282Solution for forming polishing slurry, polishing slurry and related methods
#283COMPOSITION FOR POLISHING A SUBSTRATE
#284Polishing slurry and polishing method
#285Polishing slurry and polishing method
#286Leveling agent for floor polish and aqueous floor polish composition
#287POLISHING MEDIUM FOR CHEMICAL-MECHANICAL POLISHING, AND POLISHING METHOD
#288Polishing composition and polishing method
#289Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
#290Abrasive-free polishing slurry and CMP process
#291Polishing fluids and methods for CMP
#292Hydrophilic treatment composition, and hydrophilic protective film-forming method
#293Abrasive-free polishing system
#294Substrate processing method and semiconductor device manufacturing method
#295Method of forming a platinum pattern
#296Compatibilization of esters with latices
#297Floor coating composition and floor coating composition additive
#298Polishing technique to minimize abrasive removal of material and composition therefor
#299Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
#300High solids latex for dry-bright floor polish compositions