103807 ⎘
Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups - ; Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors; Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors Unsaturated polyimide precursors
CURABLE ADHESIVE COMPOSITION COMPRISING MALEIMIDE AND THIOL
#2CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING AGENT, AND SEMICONDUCTOR DEVICE
#3Curable Precursor of an Adhesive Composition
#4ALL-AROMATIC LIQUID-CRYSTALLINE HOMO-POLYIMIDES WITH AROMATIC ENDGROUPS AND CROSSLINKED PRODUCTS THEREFROM
#5CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING AGENT, AND SEMICONDUCTOR DEVICE
#6RESIN COMPOSITION, CURED OBJECT, RESIN SHEET, PREPREG, METAL-CLAD LAMINATE, MULTILAYERED PRINTED WIRING BOARD, SEALING MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL, ADHESIVE, AND SEMICONDUCTOR DEVICE
#7CURABLE RESIN COMPOSITION FOR BONDING FILM, BONDING FILM, AND PRINTED-WIRING BOARD
#8HEAT-CURABLE MALEIMIDE RESIN COMPOSITION AND ADHESIVE AGENT, SUBSTRATE MATERIAL, PRIMER, COATING MATERIAL AND SEMICONDUCTOR DEVICE USING SAME
#9Circuit material and circuit board containing the same
#10Heat resistant polyimide film
#11Heat resistant polyimide film and preparation method thereof
#12CURABLE FIBERGLASS BINDER
#13Curable fiberglass binder comprising salt of inorganic acid
#14Vinyl-modified maleimide, composition and article made thereby
#15Alkenylphenoxy-substituted 1,1-diphenylethylenes, processes for their preparation, and their use
#16Electrically conductive composition
#17Conductive adhesive composition
#18Adhesive film and semiconductor package using adhesive film
#19Metal-on-ceramic substrates
#20PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
#21Thermally conductive pre-applied underfill formulations and uses thereof
#22Curable fiberglass binder
#23Reversible polymer adhesive composition
#24Flexible bismaleimide, benzoxazine, epoxy-anhydride adduct hybrid adhesive
#25Amide-extended crosslinking compounds and methods for use thereof
#26Chain extended epoxy to improve adhesion of conductive die attach film
#27Curable fiberglass binder comprising salt of inorganic acid
#28THERMOSETTING POLYIMIDE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE
#29Amide-extended crosslinking compounds and methods for use thereof
#30Imide-linked maleimide and polymaleimide compounds
#31Cellulosic composite
#32Curable fiberglass binder
#33Imide-linked maleimide and polymaleimide compounds
#34Thermosetting adhesive compositions
#35Maleimide compounds in liquid form
#36Film adhesives containing maleimide compounds and methods for use thereof
#37Low-melt poly(amic acids) and polyimides and their uses