METAL FILAMENTS FOR FUSED FILAMENT FABRICATION

ALLOY THERMAL FUSE

ELECTROLESS PLATING SOLUTION

Electronic Device and Method For Manufacturing Electronic Device

THIN FILM FOR SEMICONDUCTOR LASER BONDING AND METHOD FOR PRODUCING SAME

Lead-Free and Antimony-Free Solder Alloy, Solder Ball, Ball Grid Array, and Solder Joint

FLUX AND SOLDER PASTE

CORROSION-RESISTANT SN-AG-CU SERIES LEAD-FREE SOLDER ALLOY

METHOD FOR STEP-SOLDERING

Solder Alloy, Solder Ball, Solder Preform, Solder Paste, and Solder Joint

SOLDER MATERIAL

SILVER-TIN COATING FOR ELECTRICAL CONNECTORS, AND ELECTRICAL CONNECTORS WITH SILIVER-TIN COATINGS

SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOLDER JOINT

HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELECTRONICS APPLICATIONS

JOINED BODY, METHOD OF MANUFACTURING JOINED BODY, AND METHOD OF EVALUATING ORGANIC RESIDUES OF JOINED BODY

WATER-SOLUBLE FLUX AND SOLDER PASTE

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS OF USING THE SAME

Lead-Free Solder Ball

METAL-ALLOY BIPHASIC SYSTEMS, AND POWDERS AND METHODS FOR MAKING METAL-ALLOY BIPHASIC SYSTEMS

ALLOY FOR USE IN PLASMA CONFINEMENT SYSTEM

METHOD FOR SYNTHESIZING INTERMETALLIC ALLOY NANOPARTICLES

Method of preparing biodegradable Zn—Mg—Bi zinc alloy

Bronze layers as noble metal substitutes

NEGATIVE ELECTRODE ACTIVE MATERIAL AND LITHIUM ION BATTERY

Flux and solder paste

Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit Device

METHOD FOR PRODUCING METAL ALUMINUM BY MOLTEN SALT ELECTROLYSIS OF ALUMINUM OXIDE

METAL PARTICLE FOR JOINT MATERIAL

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS OF USING THE SAME

LEAD-FREE SOLDER ALLOY COMPOSITION, SOLDER BALL INCLUDING THE SAME, SOLDER PASTE INCLUDING THE LEAD-FREE SOLDER ALLOY COMPOSITION, SEMICONDUCTOR DEVICE INCLUDING HYBRID BONDING STRUCTURE INCLUDING THE LEAD-FREE SOLDER ALLOY COMPOSITION, AND METHOD OF MANUFACTURING SOLDER PASTE INCLUDING THE LEAD-FREE SOLDER ALLOY COMPOSITION

SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT

Copper-phosphorus-zinc-tin brazing sheet and preparation method and use thereof

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC COMPONENT

STABLE UNDERCOOLED METALLIC PARTICLES FOR FILLING A VOID

COST-EFFECTIVE LEAD-FREE SOLDER ALLOY FOR ELECTRONIC APPLICATIONS

HIGH RELIABILITY LEAD-FREE SOLDER ALLOY FOR ELECTRONIC APPLICATIONS IN EXTREME ENVIRONMENTS

LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES

Electrically conducting material with coating

Electrical connector

SOLDER PASTES AND METHODS OF USING THE SAME

Method for step-soldering

Preform solder and method of manufacturing the same, and method of manufacturing solder joint

Solder Alloy, Solder Ball, and Solder Joint

SOLDER COMPOSITION AND ELECTRONIC COMPONENT

Flux and solder material

Flux and solder paste

Metal and tin alloy having low alpha-ray emission, and method for producing same

Solder alloy and solder joint

Method for the manufacture of integrated devices including a die fixed to a leadframe

STRUCTURE CONTAINING Sn LAYER OR Sn ALLOY LAYER

Lead-Free and Antimony-Free Solder Alloy, Solder Ball, and Solder Joint

Solder paste

Sn—Cu mixed alloy solder paste, method of making the same and soldering method

High reliability lead-free solder alloys for harsh environment electronics applications

Lead-free solder composition

HIGH TEMPERATURE ULTRA-HIGH RELIABILITY ALLOYS

Preform solder and method of manufacturing the same, and method of manufacturing solder joint

Lead-Free and Antimony-Free Solder Alloy, Solder Ball, Ball Grid Array, and Solder Joint

BIODEGRADABLE Zn-Mg-Bi ZINC ALLOY AND PREPARATION METHOD THEREOF

Solder alloy, solder powder, solder paste and solder joint

SOLDER-METAL MESH COMPOSITE MATERIAL AND METHOD FOR PRODUCING SAME

SOLDER ALLOY, SOLDER POWDER, SOLDER PASTE, AND SOLDER JOINT OBTAINED USING THESE

Solder alloy, solder paste, solder ball, solder preform, solder joint, on-board electronic circuit, ECU electronic circuit, on-board electronic circuit device, and ECU electronic circuit device

SOLDER ALLOY, SOLDER POWDER, AND SOLDER JOINT

Solder alloy, cast article, formed article, and solder joint

Process for manufacturing a chip-card module with soldered electronic component

Aluminum base wire

POWDERS BASED ON NIOBIUM-TIN COMPOUNDS FOR MANUFACTURING SUPERCONDUCTING COMPONENTS

Lead-free solder alloy

Solder alloy, solder power, and solder joint

Solder alloy, solder paste, solder ball, solder preform, and solder joint

Lead-free solder composition

Cost-effective lead-free solder alloy for electronic applications

Lead-free solder compositions

Co-production of lead and tin products

SOLDERING ALLOY, SOLDERING PASTE, PREFORM SOLDER, SOLDERING BALL, WIRE SOLDER, RESIN FLUX CORED SOLDER, SOLDER JOINT, ELECTRONIC CIRCUIT BOARD, AND MULTI-LAYER ELECTRONIC CIRCUIT BOARD

Method for manufacturing solder product, solder, soldered component, printed wiring board, printed circuit board, wire, soldered product, flexible printed board, electronic component, method for manufacturing tin article, method for manufacturing tin intermediate product, tin intermediate product, and conductive member

Flux and solder paste

Manufacturing method of flexible electronic substrate and substrate structure

PROCESS FOR FORMING AN ELECTRIC HEATER

Oxidation-resistant metallic tin

Solder production process

Fuse element and protective element

Solder joint

Apparatus and method for efficiently preparing ultrafine spherical metal powder by one-by-one droplets centrifugal atomization method

Metal particle

SOLDER PARTICLES AND METHOD FOR PRODUCING SOLDER PARTICLES

Flux for solder paste and solder paste

LEAD-FREE AND COPPER-FREE TIN ALLOY AND SOLDER BALL FOR BALL GRID ARRAY PACKAGE

Semiconductor device and method for producing semiconductor device

Electronic component

MAGNETIC CALORIFIC COMPOSITE MATERIAL AND METHOD FOR MANUFACTURING THEREOF

CHIP ARRANGEMENTS

Hot-dip Sn—Zn-based alloy-plated steel sheet

METHOD FOR PRODUCING A COMPONENT WHICH IS CONNECTED TO A SOLDER PREFORM

Method of producing a vehicle glass assembly

Flux and Solder Material

Bonding structure

METAL PARTICLE

METHOD FOR HYDROMETALLURGICAL PROCESSING OF A NOBLE METAL-TIN ALLOY

Flux and solder paste

Resin composition and soldering flux

SLIDING MEMBER AND SLIDING BEARING

Solder alloy for power devices and solder joint having a high current density

Method of producing a vehicle glass assembly

Flux, solder paste, soldering process, method for producing soldered product, and method for producing BGA package

Resin composition for soldering, resin flux cored solder, flux coated solder, and liquid flux

METAL AND TIN ALLOY HAVING LOW alpha-RAY EMISSION, AND METHOD FOR PRODUCING SAME

Flux, and solder paste

THERMOELECTRIC CONVERSION MATERIAL, THERMOELECTRIC CONVERSION ELEMENT, AND THERMOELECTRIC CONVERSION MODULE

Solder material, solder paste, and solder joint

Multiphase metal foils as integrated metal anodes for non-aqueous batteries

Flux composition, solder paste composition, and solder joint

Friction material

Solder alloy, solder ball, solder preform, solder paste and solder joint

SOLDER PASTE AND MOUNT STRUCTURE

Method for the manufacture of integrated devices including a die fixed to a leadframe

METHOD FOR PRODUCING POROUS METAL BODY

Materials for near field transducers and near field transducers containing same

Thermoelectric materials synthesized by self-propagating high temperature synthesis process and methods thereof

Tin-plated copper terminal material, terminal, and electric-wire terminal structure

Solder material and method for die attachment

Thermoelectric materials synthesized by self-propagating high temperature synthesis process and methods thereof

Thermoelectric materials synthesized by self-propagating high temperature synthesis process and methods thereof

Thermoelectric materials synthesized by self-propagating high temperature synthesis process and methods thereof

Thermoelectric materials synthesized by self-propagating high temperature synthesis process and methods thereof

Thermoelectric materials synthesized by self-propagating high temperature synthesis process and methods thereof

Solder ball, solder joint, and joining method

Thermoelectric materials synthesized by self-propagating high temperature synthesis process and methods thereof

Method for producing an NbSn superconductor wire

Semiconductor device manufacturing method

Flux and solder composition

High reliability lead-free solder alloys for harsh environment electronics applications

Method for manufacturing high purity tin, electrowinning apparatus for high purity tin and high purity tin

Stable binary nanocrystalline alloys and methods of identifying same

PLATED WIRE ROD MATERIAL, METHOD FOR PRODUCING SAME, AND CABLE, ELECTRIC WIRE, COIL AND SPRING MEMBER, EACH OF WHICH IS FORMED USING SAME

Wear-resistant sleeve for a gas nozzle for encapsulating a cutting gas jet

Method for producing Nb3Sn superconducting wire, precursor for Nb3Sn superconducting wire, and Nb3Sn superconducting wire using same

Tungsten target

Cu core ball, solder joint, solder paste and formed solder

Soldering method

Semiconductor device and semiconductor device package

SOLDER PASTE AND SOLDER JOINT

METHOD FOR PRODUCING PLAIN-BEARING COMPOSITE MATERIALS, PLAIN-BEARING COMPOSITE MATERIAL, AND SLIDING ELEMENT MADE OF SUCH PLAIN-BEARING COMPOSITE MATERIALS

METHOD FOR PRODUCING PLAIN-BEARING COMPOSITE MATERIALS, PLAIN-BEARING COMPOSITE MATERIAL AND SLIDING ELEMENT COMPRISING PLAIN-BEARING COMPOSITE MATERIALS OF THIS TYPE

Solder alloy, solder and method for producing same

Stable nanocrystalline ordering alloy systems and methods of identifying same

CONDUCTIVE MATERIAL FOR CONNECTION PARTS WHICH HAS EXCELLENT MINUTE SLIDE WEAR RESISTANCE

CONDUCTIVE MATERIAL FOR CONNECTION PARTS WHICH HAS EXCELLENT MINUTE SLIDE WEAR RESISTANCE

Semiconductor light-emitting device and method for manufacturing the same

Negative electrode active material for electrical device

NOVEL SILICON-ENRICHED COMPOSITE MATERIAL, PRODUCTION METHOD THEREOF AND USE OF SAID MATERIAL AS AN ELECTRODE

Sliding member and sliding bearing

Solder bonding method and solder joint

Indium solder metallurgy to control electro-migration

Solder alloy and resin flux cored solder

Solder paste using a solder paste flux and solder powder

Tinned copper terminal material, terminal, and electrical wire end part structure

High purity tin and method for producing same

High reliability lead-free solder alloy for electronic applications in extreme environments

Cost-effective lead-free solder alloy for electronic applications

Lead-Free Solder Alloy for Terminal Preliminary Plating, and Electronic Component

JOINT STRUCTURE, ELECTRONIC COMPONENT MODULE, ELECTRONIC COMPONENT UNIT, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT UNIT

"Lead-Free Solder Ball"

MATERIALS FOR NEAR FIELD TRANSDUCERS AND NEAR FIELD TRANSDUCERS CONTAINING SAME

METHOD FOR MANUFACTURING POROUS METAL BODY

Lead-Free Solder Alloy

Lead-free solder alloy, electronic circuit substrate, and electronic device

LOW HEAT CAPACITY COMPOSITE FOR THERMAL CYCLER

Solder alloy, solder ball, chip solder, solder paste, and solder joint

Liquid Metal Thermal Interface Material Having Anti-melt Characteristic and Preparation Method Thereof

POROUS METAL BODY, FUEL CELL, AND METHOD FOR PRODUCING POROUS METAL BODY

Metal fine particle-containing composition

Solder paste for reduction gas, and method for producing soldered product

Joining material and method for manufacturing joined body

Solder alloy for preventing Fe erosion, resin flux cored solder, wire solder, resin flux cored wire solder, flux coated solder, solder joint and soldering method

Glazing equipped with an electrically conductive device possessing an improved resistance to temperature cycling tests

Materials for near field transducers and near field transducers containing same

Solder alloy, solder ball, and solder joint

FLUX AND SOLDER PASTE

Mixer for producing and solidifying an alloy in a subterranean reservoir

Metal particle and electroconductive paste formed therefrom

Bonding material, and bonding method and bonded structure each using same

Metal particle and articles formed therefrom

Soldering material

Preparation of Sn-based silver-graphene lead-free composite solders

METHOD AND APPARATUS FOR MANUFACTURING LEAD WIRE FOR SOLAR CELL

Composition for bonding

SOLDERING METHOD, SOLDERING APPARATUS, AND METHOD FOR MAINTAINING SOLDER WETTING OF JET NOZZLE

Preform for semiconductor encapsulation

Mount structure including two members that are bonded to each other with a bonding material layer having a first interface layer and a second interface layer

Materials for near field transducers and near field transducers containing same

Bonding member, method for manufacturing bonding member, and bonding method

Plug-in connector and semi-finished product made from an aluminum alloy strip

Solder alloy

SOLDER ALLOY

Stable nanocrystalline ordering alloy systems and methods of identifying same

THERMOELECTRIC MATERIAL, MANUFACTURING METHOD OF THERMOELECTRIC MATERIAL, AND THERMOELECTRIC CONVERTER

LIQUID DISPERSION OF METAL NANOPARTICLES FOR SOLDER PASTE, METHOD FOR PRODUCING THE LIQUID DISPERSION, SOLDER PASTE, METHOD FOR PRODUCING THE SOLDER PASTE

Fluorescence light source apparatus

Synthesis of N-type thermoelectric materials, including Mg—Sn—Ge materials, and methods for fabrication thereof

Bonding member and bonding method

Lead-free solder alloy, solder joint, solder paste composition, electronic circuit board, and electronic device

LEAD-FREE SOLDER COMPOSITION

Surface finishes for interconnection pads in microelectronic structures

Sliding bearing element

Flux activator, flux, and solder

Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint

Method for manufacturing float glass, and float glass

Lead-Free Solder Ball

Lead-free solder alloy

TIN-INDIUM BASED LOW TEMPERATURE SOLDER ALLOY

Solid metal alloy

Preparation and application of Pb-free nanosolder

SOLDER ALLOY FOR PLATING AND ELECTRONIC COMPONENT

Solder alloy and package structure using same

Chip arrangements

METHOD OF ELECTROPLATING TIN FILMS WITH INDIUM USING AN ALKANESULFONIC ACID BASED ELECTROLYTE

Solder material, solder paste, solder preform, solder joint and method of managing the solder material

WINDOW GLASS STRUCTURE FOR VEHICLE

Method for producing a thermoelectric material

Tin-plated copper-alloy terminal material

Cu column, Cu core column, solder joint, and through-silicon via

Metal particles having intermetallic compound nano-composite structure crystal

Lead-Free Solder Alloy for Terminal Preliminary Plating, and Electronic Component

FLUX FOR SOLDERING, AND SOLDERING PASTE COMPOSITION INCLUDING SAME

Mitigation of whisker growth in tin coatings by alloying with indium

Solder paste

Solder material, solder joint, and method of manufacturing the solder material

Method of manufacturing cu core ball

Lead-free solder alloy composition and method for preparing lead-free solder alloy

Solder alloy, solder ball, chip solder, solder paste and solder joint

SOLDER BALL AND ELECTRONIC MEMBER

Electronic device and electronic apparatus

Multi-layer glass and method for producing the same

Low temperature high reliability alloy for solder hierarchy

Flux and solder paste

PV-MODULE AND METHOD FOR MAKING A SOLDER JOINT

SOLDER COMPOSITION AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Method for producing intermetallic compound

Method of printing solder paste

Light emitting diode (LED) components including multiple LED dies that are attached to lead frames

Solder alloy

Solder alloy and mounted structure using same

Methods and apparatuses for high temperature bonding controlled processing and bonded substrates formed therefrom

Forming a solder joint between metal layers

THERMOELECTRIC MATERIAL WITH AN ANTIFLUORITE STRUCTURE TYPE MATRIX AND METHOD OF MANUFACTURING THE MATERIAL

Plated steel sheet

Lead-free composite solder

Methods For Evaluating The Properties Of Transient Liquid Phase Bonds

Method for producing a monofilament for an Nb3Sn superconductor wire

Materials for near field transducers, near field tranducers containing same, and methods of forming

Lead-free high reliability solder alloys

Process for producing bonded body and process for producing power module substrate

Lead-free eutectic solder alloy comprising zinc as the main component and aluminum as an alloying metal

Multi-layer sliding bearing

Solder bump stretching method for forming a solder bump joint in a device

Adaptive interposer and electronic apparatus

APPARATUS AND METHOD WITH SELF-ASSEMBLING METAL MICROCHANNELS

Cu core ball, solder paste, formed solder, Cu core column, and solder joint

Lead-free solder alloy

Diffusion solder bonding using solder preforms

Semiconductor device and method for manufacturing the same

Bonding material, bonding method and semiconductor device for electric power

Device comprising a connecting component and method for producing a connecting component

Growth of nitride films

Lead-free solder ball

HIGH TEMPERATURE BONDING PROCESSES INCORPORATING TRACES

High reliability lead-free solder alloys for harsh environment electronics applications

Ni ball, Ni nuclear ball, solder joint, foam solder and solder paste

Lead-Free Solder Alloy and Semiconductor Device

Metal material for 3-dimensional printing, method for manufacturing the same, and method for 3-dimensional printing using the same

Solder alloy, solder paste, and electronic circuit board

NEGATIVE ELECTRODE FOR ELECTRIC DEVICE AND ELECTRIC DEVICE USING THE SAME

Negative electrode for electric device and electric device using the same

Negative electrode for electrical device, and electrical device using the same

Power module

Lead-Free, Silver-Free Solder Alloys

Solder alloy, solder composition, solder paste, and electronic circuit board

Electrical connection structure

Lead-free solder alloy for printed circuit board assemblies for high-temperature environments

Method for manufacturing float glass, and float glass

Lead-free solder, lead-free solder ball, solder joint using the lead-free solder and semiconductor circuit having the solder joint

Electronic apparatus and method for manufacturing the same

Method for producing a thermoelectric object for a thermoelectric conversion device

Materials for near field transducers and near field transducers containing same

Electrical devices and methods for manufacturing same

Joining to aluminum

Metal foil for electromagnetic shielding, electromagnetic shielding material, and shielding cable

Mounting structure and BGA ball

Solder paste

Solder paste

Porous metal body, method for manufacturing porous metal body, and fuel cell

METAL SINTERING FILM COMPOSITIONS

P-type semiconductor composed of magnesium, silicon, tin, and germanium, and method for manufacturing the same

Light emitting diode (LED) components including LED dies that are directly attached to lead frames

Cu core ball

Negative electrode active material for electric device and electric device using same

Use of novel compounds as negative electrode active material in a sodium-ion battery

Amalgam balls having an alloy coating