120325 ⎘
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Process or apparatus coating on selected surface areas by masking
COMPOUND, POLYMER COMPOUND, PHOTOSENSITIVE SURFACE TREATMENT AGENT, LAMINATE, SUBSTRATE FOR PATTERN FORMATION, TRANSISTOR, PATTERN FORMATION METHOD, AND TRANSISTOR MANUFACTURING METHOD
#2METHOD FOR MANUFACTURING WIRING SUBSTRATE
#3Method of Plating a Printed Circuit Board
#4METHOD FOR MANUFACTURING A THREE-DIMENSIONAL ITEM WITH METAL PATTERN(S)
#5PRINTED CIRCUIT BOARD MANUFACTURING PROCESS AND PRINTED CIRCUIT BOARD
#6Catalyzed Metal Foil and Uses Thereof
#7SEMICONDUCTOR PACKAGE
#8Transferable Maskants Suitable for Chemical Processing
#9GAS SENSOR WITH SUPERLATTICE STRUCTURE
#10Self-Cleanable Transparent Conductive Surface/Film
#11THERMAL COATING OF POWER ELECTRONICS BOARDS FOR THERMAL MANAGEMENT
#12SYSTEMS AND METHODS FOR MANUFACTURING
#13Radiation Curable Composition for Plating Applications
#14Wiring board and production method for same
#15Wiring board and method for manufacturing the same
#16Pattern plate for plating and method for manufacturing wiring board
#17PLATING METHOD AND PLATED METAL
#18SYSTEMS AND METHODS FOR MANUFACTURING
#19Catalyzed metal foil and uses thereof to produce electrical circuits
#20Selective metallized translucent automotive components by laser ablation
#21SYSTEMS AND METHODS FOR MANUFACTURING
#22Method of producing electroconductive substrate, electronic device and display device
#23Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates
#24Plated metallization structures
#25Electronic-component manufacturing method and electronic components
#26METHOD FOR FORMING METALLIZATION STRUCTURE
#27PATTERN FORMATION USING CATALYST BLOCKER
#28Self-cleanable transparent conductive surface/film
#29Printed circuit nanofiber web manufacturing method
#30Plasma treatment method
#31COATED GLASS SLEEVES AND METHODS OF COATING GLASS SLEEVES
#32Selectively Plated Rolls Of Materials And Related Methods
#33Transistor manufacturing method
#34Symbol button for vehicle and manufacturing method thereof
#35Metallization structure and manufacturing method thereof
#36Forming method of hard mask
#37Plated metallization structures
#38Non-Seed Layer Electroless Plating of Ceramic
#39Method for forming metal wiring
#40Method of producing electroconductive substrate, electronic device and display device
#41Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
#42Plating method
#43METHOD FOR PRODUCING ELECTROCONDUCTIVE LAMINATE, LAMINATE, AND ELECTROCONDUCTIVE LAMINATE
#44Deposition mask, method of manufacturing deposition mask and metal plate
#45METHOD OF FORMING METAL PATTERN
#46Manufacturing method of liquid ejecting head chip
#47Two-shot molding for selectively metalizing parts
#48ELECTROLESS PLATING METHOD AND PRODUCT OBTAINED
#49Selectively plated rolls of materials and related methods
#50Electrical member with an electromagnetic shielding, method of producing an electrical member with an electromagnetic shielding
#51Floating metallized element assembly and method of manufacturing thereof
#52Plating processing method of gripping surface of gripping tool, and gripping tool
#53Plasma treatment apparatus
#54Deposition mask and method of manufacturing the same
#55Partial plating method of automobile resin part and automobile resin part plated by using the same
#56High resistivity soft magnetic material for miniaturized power converter
#57Conductive film, touch panel sensor, and touch panel
#58CONTROLLED GRAIN SIZE STRUCTURES
#59Method and device for producing metal patterns on a substrate for decorative and/or functional purposes, manufacture of objects incorporating said production and set of consumables used
#60Method for fine line manufacturing
#61Method for electromagnetic shielding and thermal management of active components
#62Chemically amplified positive-type photosensitive resin composition
#63Chemically amplified positive-type photosensitive resin composition
#64Forming method of hard mask, forming apparatus of hard mask and recording medium
#65Electroless metal coating of load bearing member for elevator system
#66All solution-process and product for transparent conducting film
#67Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates
#68Conductive laminate for touch panel, touch panel, and transparent conductive laminate
#69Chemically amplified positive resist composition and pattern forming process
#70DECORATIVE PLATED PRODUCT, FITTING STRUCTURE, PRODUCTION METHOD AND FITTING METHOD
#71Plating processing method of gripping surface of gripping tool, and gripping tool
#72Mask for thin film deposition and method of manufacturing oled using the same
#73Precious metal switch contact component and its preparation method
#74Wiring pattern production method and transistor production method
#75Method for creating multiple electrical current pathways on a work piece
#76Method of electrolessly plating nickel on tubulars
#77Electroplatingly decorated component comprising symbols or a structure introduced into the surface, and method for the production thereof
#78Method of forming wiring pattern and etching apparatus for forming wiring pattern
#79Roll-to-roll patterning of transparent and metallic layers
#80Wiring pattern manufacturing method and transistor manufacturing method
#81Ion optics components and method of making the same
#82Nickel corrosion barrier under chrome for sucker rod pumps
#83Photosensitive resin composition for projection exposure, photosensitive element, method for forming resist pattern, process for producing printed wiring board and process for producing lead frame
#84Forming silver catalytic sites from reducible silver-oximes
#85Plated polymer compressor
#86Plated tubular lattice structure
#87Metal-encapsulated polymeric article
#88STOP OFF WRAP
#89COATED GLASS SLEEVES AND METHODS OF COATING GLASS SLEEVES
#90Tin or tin alloy plating liquid
#91Electrochemical fabrication process for forming multilayer multimaterial microprobe structures
#92MANUFACTURING METHOD OF TEST STRIP
#93Method of fabricating substrate structure and substrate structure fabricated by the same method
#94Method for manufacturing wiring board with conductive post
#95Method of manufacturing rotary machine, method of plating rotary machine, and rotary machine
#96PRETREATMENT METHOD FOR PARTIAL PLATING, PARTIAL PLATING METHOD FOR ALUMINUM MATERIALS, AND RESIST FOR PLATING ALUMINUM MATERIALS
#97MASKING AGENT, AND METHOD FOR PRODUCING SURFACE-TREATED BASE
#98Nitrided component surface repair with autofrettage
#99Methods and systems for forming flexible multilayer structures
#100PLATING METHOD AND PRODUCT
#101Three-dimensional copper nanostructure and fabrication method thereof
#102Plated instrumentation probes and sensors
#103Conductive transparent film and method for making same
#104Electroless plated material formed directly on metal
#105Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
#106Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids
#107Method for producing a semiconductor element of a direct-converting x-ray detector
#108Electroless deposition of platinum on copper
#109Highly ordered arrays of colloidal 2D crystals and methods for producing the same
#110Method of forming low-resistance metal pattern, patterned metal structure, and display devices using the same
#111Methods for improving corrosion resistance and applications in electrical connectors
#112Method of metal deposition
#113METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
#114Anodization and plating surface treatments
#115ADHESION OF METAL THIN FILMS TO POLYMERIC SUBSTRATRES
#116Lightweight cavity filter and radio subsystem structures
#117Method for strengthening adhesion between dielectric layers formed adjacent to metal layers
#118Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids
#119Method for spatially resolved enlargement of nanoparticles on a substrate surface
#120Microstructure manufacturing method
#121Production method of base plate for disk drive, base plate for disk drive, and drive therewith
#122Manufacturing method of metal structure in multi-layer substrate
#123METHOD FOR MAKING AN ELECTROCHEMICAL SENSOR STRIP
#124Substrate structure and method of manufacturing the same
#125METAL LAYER FORMATION METHOD FOR DIODE CHIPS/WAFERS
#126Electroless gold plating solution for forming fine gold structure, method of forming fine gold structure using same, and fine gold structure formed using same
#127Electroless deposition of platinum on copper
#128METHOD OF PROVIDING SOLAR CELL ELECTROLESS PLATTING AND AN ACTIVATOR USED THEREIN
#129CIRCUIT BOARDS, METHODS OF FORMING THE SAME AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
#130Circuit board and manufacturing method thereof
#131Highly ordered arrays of nanoholes in metallic films and methods for producing the same
#132METHOD FOR ELECTRIC CIRCUIT DEPOSITION
#133RELEASING DEVICE FOR ADMINISTERING A BIO-ACTIVE AGENT
#134Method for fabricating bump structure without UBM undercut
#135ELECTROLESS PLATING PRODUCTION OF NICKEL AND COBALT STRUCTURES
#136METHOD OF PROVIDING SOLAR CELL ELECTRODE BY ELECTROLESS PLATING AND AN ACTIVATOR USED THEREIN
#137ELECTROLESS PLATING SOLUTION FOR PROVIDING SOLAR CELL ELECTRODE
#138Semiconductor processing methods
#139Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
#140METHOD OF ENABLING SELECTIVE AREA PLATING ON A SUBSTRATE
#141Composite material for electric/electronic part, production method thereof, and electric/electronic part
#142Multi-step release method for electrochemically fabricated structures
#143Enhanced method of forming nickel silicides
#144Methods of and Apparatus for Electrochemically Fabricating Structures Via Interlaced Layers or Via Selective Etching and Filling of Voids
#145Method of manufacture of an electrode for a fuel cell
#146Method for Strengthening Adhesion Between Dielectric Layers Formed Adjacent to Metal Layers
#147PROCESS FOR MANUFACTURING CONDUCTIVE TRACKS
#148Electrochemical Fabrication Processes Incorporating Non-Platable Metals and/or Metals that are Difficult to Plate On
#149Methods of Reducing Interlayer Discontinuities in Electrochemically Fabricated Three-Dimensional Structures
#150Method for Selective Adsorption of Noble Metal Onto Surface of Polymer
#151Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates
#152Surface ornamental structure of an article and a method for ornamentally working the surface structure of the article
#153Method and apparatus for workpiece surface modification for selective material deposition
#154INSERT COMPONENT EMBEDDING METHOD
#155Semiconductor processing methods
#156Microprobe Tips and Methods for Making
#157Fabrication Process for Co-Fabricating a Multilayer Probe Array and a Space Transformer
#158Mandrel
#159Mask for thin film deposition and method of manufacturing OLED using the same
#160Electroless Deposition of Platinum on Copper
#161Method of Forming Electrically Isolated Structures Using Thin Dielectric Coatings
#162Electrode formation based on photo-induced reduction of metal ions in the presence of metal nanomaterials
#163Electrochemical Fabrication Process for Forming Multilayer Multimaterial Microprobe Structures
#164PLASTIC SHELL WITH PRINTING PATTERNS AND METHOD FOR FORMING THE SAME
#165METHOD OF FABRICATING AN INTEGRATED CIRCUIT
#166METHOD FOR APPLYING A METAL ON PAPER
#167METHOD FOR FORMING COMPOSITE PLATING FILM AND PROCESS FOR MANUFACTURING INKJET RECORDING HEAD
#168Methods for improving selectivity of electroless deposition processes
#169Semiconductor processing methods
#170SOLAR CELL AND FABRICATION METHOD USING CRYSTALLINE SILICON BASED ON LOWER GRADE FEEDSTOCK MATERIALS
#171Methods for Electrochemically Fabricating Structures Using Adhered Masks, Incorporating Dielectric Sheets, and/or Seed Layers That Are Partially Removed Via Planarization
#172METHOD FOR APPLYING A METAL ON A SUBSTRATE
#173Method of producing metal film
#174Integrated Circuit Packaging Using Electrochemically Fabricated Structures
#175Electrochemical Fabrication Methods Including Use of Surface Treatments to Reduce Overplating and/or Planarization During Formation of Multi-layer Three-Dimensional Structures
#176Unsupported palladium alloy membranes and methods of making same
#177Thick metal interconnect with metal pad caps at selective sites and process for making the same
#178Thick metal interconnect with metal pad caps at selective sites and process for making the same
#179Methods and systems for forming flexible multilayer structures
#180Roll-to-roll patterning of transparent and metallic layers
#181Method of enabling selective area plating on a substrate
#182METHOD FOR MANUFACTURING WIRE GRID DEVICE
#183Electroless plating production of nickel and cobalt structures
#184BIPOLAR ELECTROLESS PROCESSING METHODS
#185Methods for Electrochemically Fabricating Structures Using Adhered Masks, Incorporating Dielectric Sheets, and/or Seed layers That Are Partially Removed Via Planarization
#186METHOD OF FORMING LOW-RESISTANCE METAL PATTERN, PATTERNED METAL STRUCTURE, AND DISPLAY DEVICES USING THE SAME
#187CATALYTIC TREATMENT METHOD, ELECTROLESS PLATING METHOD, AND METHOD FOR FORMING CIRCUIT USING ELECTROLESS PLATING
#188Second surface metallization
#189Element substrate and method of manufacturing the same
#190Integrated Circuit Packaging Using Electrochemically Fabricated Structures
#191Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates
#192Methods for Electrochemically Fabricating Structures Using Adhered Masks, Incorporating Dielectric Sheets, and/or Seed layers That Are Partially Removed Via Planarization
#193Multi-step Release Method for Electrochemically Fabricated Structures
#194Methods of and Apparatus for Forming Three-Dimensional Structures Integral with Semiconductor Based Circuitry
#195Deposition process for iodine-doped ruthenium barrier layers
#196Probe arrays and method for making
#197Method for fabricating a flip chip substrate structure
#198Method and apparatus for workpiece surface modification for selective material deposition
#199Electroformed metal structure
#200Plating process
#201Selective plating system
#202Method for producing electroplated plastic sanitary articles
#203Non-cyanide electroless gold plating solution and process for electroless gold plating
#204Method of and Apparatus for Forming Three-Dimensional Structures Integral With Semiconductor Based Circuitry
#205Methods of Reducing Interlayer Discontinuities in Electrochemically Fabricated Three-Dimensional Structures
#206Microdevices for Tissue Approximation and Retention, Methods for Using, and Methods for Making
#207ELECTROLESS GOLD PLATING SOLUTION AND METHOD
#208ELECTROLESS GOLD PLATING SOLUTION
#209Method of electrolytically depositing materials in a pattern directed by surfactant distribution
#210Method for manufacturing patterned porous molded product or nonwoven fabric, and electric circuit component
#211Electrochemical fabrication processes incorporating non-platable metals and/or metals that are difficult to plate on
#212Method for manufacturing copper wires on substrate of flat panel display device
#213METAL LAYER FORMATION METHOD FOR DIODE CHIPS/WAFERS
#214SYSTEM AND METHOD FOR FORMING PATTERNED COPPER LINES THROUGH ELECTROLESS COPPER PLATING
#215Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology
#216Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids
#217Embossing assembly and methods of preparation
#218Electrochemical fabrication methods including use of surface treatments to reduce overplating and/or planarization during formation of multi-layer three-dimensional structures
#219Method for modifying surface of polymer substrate, method for forming plated film on polymer substrate, method for producing polymer member, and coating member
#220Vertical microprobes for contacting electronic components and method for making such probes
#221Method of forming electrically isolated structures using thin dielectric coatings
#222Optical filter for image display devices and manufacturing method thereof
#223Integrated circuit packaging using electrochemically fabricated structures
#224Plated structures or components
#225Parallel multilayer printed circuit board having interlayer conductivity due to via ports and method of fabricating same
#226Electroless plating of piezoelectric ceramic
#227Probe arrays and method for making
#228Method of forming conductive pattern, wiring substrate, electronic device and electronic equipment
#229Method for applying metal features onto metallized layers using electrochemical deposition and alloy treatment
#230Method for applying metal features onto metallized layers using electrochemical deposition
#231Method for applying metal features onto metallized layers using electrochemical deposition and electrolytic treatment
#232Method for applying metal features onto metallized layers using electrochemical deposition using acid treatment
#233Metallic structures incorporating bioactive materials and methods for creating the same
#234Method for making chrome photo mask
#235Microprobe tips and methods for making
#236Method for producing a local coating and combinatory substrate having such coating
#237Methods for electrochemically fabricating structures using adhered masks, incorporating dielectric sheets, and/or seed layers that are partially removed via planarization
#238Laser enhanced plating for forming wiring patterns
#239Electroformed metallization
#240Method for manufacturing light guide plate mold cores
#241Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
#242Process for fabrication of printed circuit boards
#243Fabrication process for co-fabricating multilayer probe array and a space transformer
#244Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
#245Electrochemical fabrication process for forming multilayer multimaterial microprobe structures
#246Polymer ceramic slip and method of manufacturing ceramic green bodies there therefrom
#247Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
#248Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
#249Integrated circuit packaging using electrochemically fabricated structures
#250Electrochemical fabrication process for forming multilayer multimaterial microprobe structures
#251Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
#252Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
#253Piezoelectric device and method of manufacturing same
#254Method of manufacturing a thin film transistor, thin film transistor, thin film transistor circuit, electronic device, and electronic apparatus
#255Method for electroless deposition of a metal layer on selected portions of a substrate
#256Method of plating metal leafs and metal membranes
#257Compositions and methods for the electroless deposition of NiFe on a work piece
#258Multi-step release method for electrochemically fabricated structures
#259Method of electrolytically depositing materials in a pattern directed by surfactant distribution
#260Electrochemical fabrication process using directly patterned masks
#261Non-reactive coatings for inertization
#262Methods for electrochemically fabricating structures using adhered masks, incorporating dielectric sheets, and/or seed layers that are partially removed via planarization
#263Electrochemical fabrication methods including use of surface treatments to reduce overplating and/or planarization during formation of multi-layer three-dimensional structures
#264Electrochemical fabrication methods using transfer plating of masks
#265Method for defining a source and a drain and a gap inbetween
#266Enhanced microfabrication using electrochemical techniques
#267Shielding coating for selective metallization
#268Shielding coating for selective metallization