C23C18/1664 - CPC Classification Index

ClassID:

120358 ⎘

C23C18/1664 - CPC Classification

Classification description:

Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Process or apparatus; Process of electroless plating; Process features with additional means during the plating process

Sub-classes:

C23C18/1666 » {Ultrasonics} 20
C23C18/1667 » {Radiant energy, e.g. laser} 57
C23C18/1669 » {Agitation, e. g. air introduction} 43
C23C18/1671 » {Electric field} 16
C23C18/1673 » {Magnetic field} 10

Recent Application in this class:

20220186378

Film formation device and film formation method for metal plating film

20190390348

Formation of terminal metallurgy on laminates and boards

20190295836

Electrolytic plating apparatus

20170029951

Web transport system including fluid shield

20160333480

Method of electrolessly plating nickel on tubulars

20160305032

Plating apparatus and container bath

20160053378

Plating method, plating apparatus, and storage medium

20160025925

Method and apparatus for fabrication of metal-coated optical fiber, and the resulting optical fiber

20150159276

Substrate processing apparatus, substrate processing method and storage medium storing substrate processing program

20150056379

Method of manufacturing gold thin film by using electroless-plating method

20140124545

Method of forming lubricative plated layer on viscous liquid feed nozzle and viscous liquid feed nozzle

20130252019

Copper-Clad Laminate and Method for Manufacturing Same

20120164325

Method of forming lubricative plated layer on viscous liquid feed nozzle and viscous liquid feed nozzle

20090178831

Electroless Ni-P plating method and substrate for electronic component