ClassID:

120359

C23C18/1666 - CPC Classification

Classification description:

Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Process or apparatus; Process of electroless plating; Process features with additional means during the plating process Ultrasonics

Recent Application in this class:
#1
20250230549
2025-07-17

METHOD FOR FORMING ELECTROLESS PLATING ELECTRODE THROUGH SELECTIVE CROSS-LINKING LAYER FORMATION USING LASER

#2
20240304355
2024-09-12

METAL NANOWIRE FOAM

#3
20220056587
2022-02-24

METHOD OF FABRICATING AND COATING COPPER NANOWIRES

#4
20210222302
2021-07-22

Method for forming nickel plated graphene hollow sphere

#5
20200354846
2020-11-12

Methods of preparing articles by electrodeposition and additive manufacturing processes

#6
20200265969
2020-08-20

OXIDATION-RESISTANT HYBRID STRUCTURE COMPRISING METAL THIN FILM LAYER COATED ON EXTERIOR OF CONDUCTIVE POLYMER STRUCTURE, AND PREPARATION METHOD THEREFOR

#7
20190264330
2019-08-29

Method of electroless nickle plating on surface of silicon carbide powder

#8
20190153604
2019-05-23

Method and device for preparing high strength and durable super-hydrophobic film layer on inner wall of elongated metal tube

#9
20180100218
2018-04-12

Process for Forming a Cobalt-Iron Alloy Film on a Substrate

#10
20180030609
2018-02-01

Surface mechanical attrition treatment (SMAT) methods and systems for modifying nanostructures

#11
20170191177
2017-07-06

Methods of preparing articles by electrodeposition and additive manufacturing processes

#12
20160250773
2016-09-01

Surface mechanical attrition treatment (SMAT) methods and systems for modifying nanostructures

#13
20160068965
2016-03-10

Method for coating of carbon nanomaterials

#14
20130310243
2013-11-21

Method for regulating the distribution of metallic nanoparticles within the resin support

#15
20130034959
2013-02-07

Electroless plating apparatus and method

#16
20100003807
2010-01-07

Semiconductor device manufacturing method, semiconductor manufacturing apparatus and storage medium

#17
20090130339
2009-05-21

Method for Preparing Electroconductive Particles with Improved Dispersion and Adherence

#18
20080311400
2008-12-18

Nanotube growth and device formation

#19
20070085162
2007-04-19

CAPPING OF COPPER STRUCTURES IN HYDROPHOBIC ILD USING AQUEOUS ELECTRO-LESS BATH

#20
20050227488
2005-10-13

Capping of copper structures in hydrophobic ILD using aqueous electro-less bath

#21
20050147746
2005-07-07

Nanotube growth and device formation