120390 ⎘
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment; Multistep pretreatment with use of metal first
Device for Printing to a Recording Medium
#2ANTI-MULTIPACTOR COATING DEPOSITED ON AN RF OR MW METAL COMPONENT, METHOD FOR FORMING SAME BY LASER SURFACE TEXTURING
#3PATTERNING OF ELECTROLESS METALS BY SELECTIVE DEACTIVATION OF CATALYSTS
#4METHOD FOR MANUFACTURING WIRING PATTERN, METHOD FOR MANUFACTURING CONDUCTIVE FILM, AND METHOD FOR MANUFACTURING TRANSISTOR
#5Patterning of electroless metals by selective deactivation of catalysts
#6Anti-multipactor device
#7Pretreatment solution for electroless plating and electroless plating method
#8Pre-treatment process for electroless plating
#9Electrically-conductive proppant and methods for making and using same
#10Method for activating a copper surface for electroless plating
#11Method for the metallation of a workpiece and a layer structure made up of a workpiece and a metal layer
#12Method for producing magnetic cores
#13Plating catalyst and method
#14Plating catalyst and method
#15PRE-TREATMENT PROCESS FOR ELECTROLESS NICKEL PLATING
#16Method for spatially resolved enlargement of nanoparticles on a substrate surface
#17METHOD FOR DEPOSITING METAL ON A SUBSTRATE; METAL STRUCTURE AND METHOD FOR PLATING A METAL ON A SUBSTRATE
#18SOLUTION FOR INHIBITING PALLADIUM ACTIVITY INCLUDING HALOGENIC ACID AND METHOD FOR PREVENTING DEFECT OF PLATING USING THEREOF
#19Unsupported palladium alloy membranes and methods of making same
#20Method of forming a metal wiring
#21METHOD FOR PRODUCING A COPPER LAYER ON A SUBSTRATE IN A FLAT PANEL DISPLAY MANUFACTURING PROCESS
#22Nickel-Coated Copper Powder and Method for Producing the Nickel-Coated Copper Powder
#23Tin-Based Plating Film and Method for Forming the Same
#24Method of forming a conducting layer on a conducting and non-conducting substrate
#25Conductive composites
#26Process for low resistance metal cap
#27Methods and devices for enhanced adhesion between metallic substrates and bioactive material-containing coatings
#28Reducing electrical resistance in electrolessly deposited copper interconnects
#29Process for contact printing of patterns of electroless deposition catalyst
#30Electroless metallic plating method for leak repair and prevention in liquid-cooled generator stator bars
#31Selective self-initiating electroless capping of copper with cobalt-containing alloys
#32Plating method including pretreatment of a surface of a base metal
#33Process for producing a metal layer on a substrate body, and substrate body having a metal layer
#34High resolution patterning method