120391 ⎘
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment; Multistep pretreatment with use of organic or inorganic compounds other than metals, first
Method of Metallization by a Nickel or Cobalt Alloy for the Manufacture of Semiconductor Devices
#2VAPOR CHAMBER AND METHOD OF PRODUCING THE SAME
#3SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM
#4Electroless Co—W plating film
#5PLATING BATH FOR THE ELECTROLESS PLATING OF A SUBSTRATE
#6AN ALUMINUM ALLOY CAGE AND A PROCESSING METHOD OF THE ALUMINUM ALLOY CAGE
#7NANOSTRUCTURE SUBSTRATE
#8PREPARATION METHOD FOR IRON-BASED ALLOY POWDER EBSD TEST SAMPLE
#9Composite member
#10Surface treating apparatus and surface treatment method
#11Radiation-sensitive compositions and patterning and metallization processes
#12Heat Exchange Element and Process for Production
#13Metallization structure and manufacturing method thereof
#14Process for depositing a metal or metal alloy on a surface of a substrate including its activation
#15CHAIN HAVING AN ELECTROLESS NICKEL COATING CONTAINING HARD PARTICLES
#16SURFACE-INDEPENDENT, SURFACE-MODIFYING, MULTIFUNCTIONAL COATINGS AND APPLICATIONS THEREOF
#17PATTERNING OF ELECTROLESS METALS BY SELECTIVE DEACTIVATION OF CATALYSTS
#18Electroless plating method and ceramic substrate
#19Radiation-sensitive compositions and patterning and metallization processes
#20Pretreatment of iron-based substrates for electroless plating
#21Semiconductor element having a warped surface and production method thereof
#22Coated optical fibres having improved features
#23Patterning of electroless metals by selective deactivation of catalysts
#24Electrode and process for preparing the electrode and devices thereof
#25Alloy steel composition and producing method thereof
#26Method for producing metal-plated stainless material
#27HORIZONTAL METHOD OF ELECTROLESS METAL PLATING OF SUBSTRATES WITH IONIC CATALYSTS
#28Method for producing core-shell catalyst
#29Systems and methods for electroless plating of thin gold films directly onto silicon nitride and into pores in silicon nitride
#30Arc ablation-resistant tungsten alloy switch contact and preparation method thereof
#31Arc-ablation resistant switch contact and preparation method thereof
#32Metallic coating and a method for producing the same
#33Plating method and recording medium
#34Method of electrolessly plating nickel on tubulars
#35ELECTROLESS PLATING METHOD AND ELECTROLESS PLATING FILM
#36Metal wiring layer forming method, metal wiring layer forming apparatus, and recording medium
#37METHOD OF SELECTIVELY TREATING COPPER IN THE PRESENCE OF FURTHER METAL
#38Fabrication of mirror-like coatings
#39Method for activating a copper surface for electroless plating
#40Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds
#41Electroless plating method and ceramic substrate
#42Gold nanostructures and processes for their preparation
#43Separator for fuel cells, fuel cell, fuel cell stack, and method of manufacturing separator for fuel cells
#44Plating catalyst and method
#45Pre-treatment method of plating, storage medium, and plating system
#46Surface treatment of mirror finish
#47Method for producing hard disk substrate
#48Plating method, plating system and storage medium
#49Process for application of metal
#50Electroless nickel plating solution and method
#51Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds
#52Method and composition for electroless nickel and cobalt deposition
#53Multi shell metal particles and uses thereof
#54Electrode pad, printed circuit board using the same, and method of manufacturing printed circuit board
#55Direct Electroless Palladium Plating on Copper
#56Metallization mixtures and electronic devices
#57Surface-independent, surface-modifying, multifunctional coatings and applications thereof
#58Electroless deposition of platinum on copper
#59Method for production of hard disk substrate and hard disk substrate
#60COATED ARTICLE AND METHOD FOR MAKING SAME
#61Plating catalyst and method
#62Plating catalyst and method
#63Aluminum article
#64METHOD FOR MANUFACTURING BASE MATERIAL HAVING GOLD-PLATED METAL FINE PATTERN, BASE MATERIAL HAVING GOLD-PLATED METAL FINE PATTERN, PRINTED WIRING BOARD, INTERPOSER, AND SEMICONDUCTOR DEVICE
#65Plating method of circuit substrate, production method of plated circuit substrate, and silver etching liquid
#66FABRICATION OF MIRROR-LIKE COATINGS
#67Processes and Systems for Engineering a Barrier Surface for Copper Deposition
#68Production method of base plate for disk drive, base plate for disk drive, and drive therewith
#69Electroless gold plating solution for forming fine gold structure, method of forming fine gold structure using same, and fine gold structure formed using same
#70Electroless deposition of platinum on copper
#71Metallization processes, mixtures, and electronic devices
#72DIRECTIONAL SELF-ASSEMBLY OF BIOLOGICAL ELECTRICAL INTERCONNECTS
#73METHOD FOR FORMING A BLOCK COPOLYMER PATTERN
#74METHOD FOR MAKING A DESIRED PATTERN OF A METALLIC NANOSTRUCTURE OF A METAL
#75SOLUTION FOR INHIBITING PALLADIUM ACTIVITY INCLUDING HALOGENIC ACID AND METHOD FOR PREVENTING DEFECT OF PLATING USING THEREOF
#76Conversion coating for magnesium, beryllium, and their alloys and articles thereof
#77METHOD FOR ELECTROLESS NICKEL-PALLADIUM-GOLD PLATING, PLATED PRODUCT, PRINTED WIRING BOARD, INTERPOSER AND SEMICONDUCTOR APPARATUS
#78Method of surface modification of metallic hydride forming materials
#79Surface independent, surface-modifying, multifunctional coatings and applications thereof
#80Process for the preparation of an organic film at the surface of a solid support with oxidizing treatment
#81Chemical modification process for a deep polymeric matrix
#82PROCESS FOR PREPARING A METALLIZED SUBSTRATE, SAID SUBSTRATE AND USES THEREOF
#83PLATING METHOD, METHOD FOR FORMING METAL THIN FILM, AND PLATING CATALYST LIQUID
#84METHOD FOR FORMING GRAFT POLYMER PATTERN AND METHOD FOR FORMING ELECTRICALLY CONDUCTIVE PATTERN
#85METHOD AND APPARATUS FOR PROCESSING SUBSTRATE
#86Method of surface treatment for metal glass part, and metal glass part with its surface treated by the method
#87METHODS OF TREATING A SURFACE TO PROMOTE METAL PLATING AND DEVICES FORMED
#88Methods of treating a surface to promote metal plating and devices formed
#89Methods of preparing thin films by electroless plating
#90Electroless Deposition of Platinum on Copper
#91ELECTROPLATING METHOD FOR MAGNESIUM AND MAGNESIUM ALLOY
#92Method for producing a nitrogen functionalised surface
#93PROCESSES FOR TEXTURING A SURFACE PRIOR TO ELECTROLESS PLATING
#94Method of producing metal film
#95CONVERSION COATING FOR MAGNESIUM, BERYLLIUM AND THEIR ALLOYS AND ARTICLES THEREOF
#96Surface-Treated Doctor Blade
#97Method of selective coating of a composite surface production of microelectronic interconnections using said method and integrated circuits
#98GRAFT PATTERN FORMING METHOD AND CONDUCTIVE PATTERN FORMING METHOD
#99METHOD FOR COATING SUBSTRATES CONTAINING ANTIMONY COMPOUNDS WITH TIN AND TIN ALLOYS
#100PRODUCTION METHOD FOR WIRING AND VIAS
#101Methods of Treating a Surface to Promote Metal Plating and Devices Formed
#102Methods of Treating a Surface to Promote Binding of Molecule(s) of Interest, Coatings and Devices Formed Therefrom
#103Method of forming a metal wiring
#104Electroless Niwp Adhesion and Capping Layers for Tft Copper Gate Process
#105Plating method of electrode can of flat alkaline cell and plating apparatus thereof
#106WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
#107Methods of making functionalized nanorods
#108Surface-independent, surface-modifying, multifunctional coatings and application thereof
#109Substrate Processing Method and Substrate Processing Apparatus
#110Nodular nickel boron coating
#111Method for Preparing a Palladium-Containing Layer
#112Method and apparatus for processing substrate
#113Nickel-plated metal cookware
#114Processes and systems for engineering a barrier surface for copper deposition
#115Method of forming an atomic layer thin film out of the liquid phase
#116Substrate processing method and substrate processing apparatus
#117Manufacturable CoWP metal cap process for copper interconnects
#118Three dimensional microstructures and methods for making three dimensional microstructures
#119Preferred copper plated finish and method of making same
#120Reducing electrical resistance in electrolessly deposited copper interconnects
#121Directional self-assembly of biological electrical interconnects
#122Method of forming metal on a substrate using a Ruthenium-based catalyst
#123Method of depositing films on aluminum alloys and films made by the method
#124Plating bath and surface treatment compositions for thin film deposition
#125Seed layers, cap layers, and thin films and methods of making thereof
#126Casing for transporting a toner mixture and method for producing a casing of this type
#127Solution for etching copper surfaces and method of depositing metal on copper surfaces
#128Wafer cleaning solution for cobalt electroless application
#129Manufacturable CoWP metal cap process for copper interconnects
#130Method of forming a metal thin film in a micro hole by ink-jet printing
#131Activation of aluminum for electrodeposition or electroless deposition
#132Pre-treating method for plating a Fe-Mn-Al alloy surface
#133Method for processing substrate
#134Method of plating a golf club head
#135Coated metal cookware
#136Surface graft material, conductive pattern material, and production method thereof
#137Method of electroplating aluminum
#138Electroless cobalt alloy deposition process
#139Method of pretreating a nonmagnetic substrate and a magnetic recording medium formed thereby
#140Method for forming CoWRe alloys by electroless deposition
#141Heterogeneous activation layers formed by ionic and electroless reactions used for IC interconnect capping layers
#142Plating method including pretreatment of a surface of a base metal
#143High resolution patterning method