120401 ⎘
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating; Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment Use of metal, e.g. activation, sensitisation with noble metals
Bendable Nickel Plating on Flexible Substrates
#2METHOD OF METALLIZATION WITH A NICKEL OR COBALT ALLOY FOR THE MANUFACTURE OF SEMICONDUCTOR DEVICES
#3Bendable Nickel Plating on Flexible Substrates
#4PREVENTION OF UNWANTED PLATING ON RACK COATINGS FOR ELECTRODEPOSITION
#5Sensitizing solution and method of its preparation
#6ETCHING METHOD
#7Method for manufacturing electroless plating substrate and method for forming metal layer on surface of substrate
#8Composite member
#9Method of producing electroconductive substrate, electronic device and display device
#10Printed Circuits on and within Porous, Flexible Thin Films
#11COATED GLASS SLEEVES AND METHODS OF COATING GLASS SLEEVES
#12Formation of terminal metallurgy on laminates and boards
#13Manufacturing a package using plateable encapsulant
#14Compositions and methods for forming articles having silver metal
#15Semiconductor device including a reactant metal layer disposed between an aluminum alloy film and a catalyst metal film and method for manufacturing thereof
#16Site-selective metal plating onto a package dielectric
#17Ceramic device and manufacturing method thereof
#18Self-adsorbed catalyst composition, method for preparing the same and method for manufacturing electroless plating substrate
#19Method of manufacturing ceramic electronic component
#20Method of producing electroconductive substrate, electronic device and display device
#21Method for forming circuit on substrate
#22Embedded formation of wearable and flexible batteries
#23Method of forming patterned metal unit, and patterned article formed with the same
#24Silver-containing precursor and product articles containing cellulosic polymers
#25Substrate processing method
#26Composition for Preparation of Plating Base and Plating Base Thereof
#27Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
#28Semiconductor package with plateable encapsulant and a method for manufacturing the same
#29ARTICLE AND PROCESS FOR SELECTIVE ETCHING
#30Nanostructured sapphire optical fiber sensing platform
#31Anode active material for lithium secondary batteries
#32Adhesion promoting process for metallisation of substrate surfaces
#33Non-aqueous metal catalytic composition with oxyazinium photoreducing agent
#34Forming silver catalytic sites from reducible silver-oximes
#35Forming catalytic sites from reducible silver-heterocyclic complexes
#36Forming silver catalytic sites from silver phosphite carboxylates
#37Method of forming patterned metal unit, and patterned article formed with the same
#38Circuit board and method for fabricating the same
#39Method for forming a metal silicide using a solution containing gold ions and fluorine ions
#40Stable tin free catalysts for electroless metallization
#41Pre-treatment method of plating, storage medium, and plating system
#42Use of titania precursor composition pattern
#43Article and process for selective etching
#44Article and process for selective deposition
#45Article with gradient property and processes for selective etching
#46Method for forming a conductive pattern
#47Method of metalizing surface and article obtainable
#48Ordering structure of scintillator and fabrication method
#49Metal compound, method for preparing the same, selective metallization of surface of substrate with the metal compound
#50Plating catalyst and method
#51Ordering structure of scintillator and fabrication method
#52Supporting unit, substrate treating device including the same, and method of manufacturing the supporting unit
#53Plating catalyst and method
#54Primer for electroless plating comprising hyperbranched polymer and metal fine particles
#55CIRCUIT SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
#56Seeding method for deposit of thin selective membrane layers
#57Process for the surface-modification of flyash and industrial applications thereof
#58COMPOSITE MATERIAL COMPRISING SILICON MATRIX AND METHOD OF PRODUCING THE SAME
#59LOW TEMPERATURE PLATINISATION FOR DYE-SENSITISED SOLAR CELLS
#60Method of forming metal pattern and method of manufacturing display substrate having the same
#61Graphite particle-supported Pt-shell/Ni-core nanoparticle electrocatalyst for oxygen reduction reaction
#62Solution and method for activating the oxidized surface of a semiconductor substrate
#63Electroless plating pretreatment agent, electroless plating method using same, and electroless plated object
#64Solution and process for activating the surface of a semiconductor substrate
#65METHODS FOR METAL PLATING AND RELATED DEVICES
#66Plating catalyst and method
#67SULFUR-RESISTANT COMPOSITE METAL MEMBRANES
#68Anticorrosion Mirror, Method for Producing Same, and Uses Thereof in Solor Energy
#69METHOD OF PROVIDING SOLAR CELL ELECTROLESS PLATTING AND AN ACTIVATOR USED THEREIN
#70Method and device for catchment of platinum group metals in a gas stream
#71Method for producing thermoelectric material
#72Method for manufacturing semiconductor device
#73METHOD OF PROVIDING SOLAR CELL ELECTRODE BY ELECTROLESS PLATING AND AN ACTIVATOR USED THEREIN
#74Composite material comprising silicon matrix and method of producing the same
#75OPEN PORE CERAMIC MATRIX COATED WITH METAL OR METAL ALLOYS AND METHODS OF MAKING SAME
#76Method of manufacture of an electrode for a fuel cell
#77Copper deposition for filling features in manufacture of microelectronic devices
#78Process for producing metallic-nanoparticle inorganic composite and metallic-nanoparticle inorganic composite
#79PROCESS FOR PREPARING A MOULDED PRODUCT
#80Resin composition containing catalyst precursor for electroless plating in forming electro-magnetic shielding layer, method of forming metallic pattern using the same, and metallic pattern formed by the same method
#81DIRECT PATTERNING METHOD FOR MANUFACTURING A METAL LAYER OF A SEMICONDUCTOR DEVICE
#82Plated article having metal thin film formed by electroless plating, and manufacturing method thereof
#83Biomolecular recognition of crystal defects
#84METHOD OF FABRICATING AN INTEGRATED CIRCUIT
#85Method and device for catchment of platinum group metals in a gas stream
#86Catalyst composition and deposition method
#87Method of Applying Catalytic Solution for Use in Electroless Deposition
#88Catalyst composition and deposition method
#89Methods of fabricating solar-cell structures and resulting solar-cell structures
#90ACTIVATION SOLUTION FOR ELECTROLESS PLATING ON DIELECTRIC LAYERS
#91METHOD OF MANUFACTURING DISPLAY DEVICE AND DISPLAY DEVICE THEREFROM
#92Method and apparatus for producing conductive material
#93METHOD FOR MANUFACTURING WIRE GRID DEVICE
#94Substrate processing method and apparatus
#95METHODS OF FORMING FILMS OF A SEMICONDUCTOR DEVICE
#96PLATED SUBSTRATE AND ITS FABRICATION METHOD
#97Metal deposition
#98Pd nanopore and palladium encapsulated membranes
#99Apparatus and method for forming magnetic film
#100BARRIER LAYER, COMPOSITE ARTICLE COMPRISING THE SAME, ELECTROACTIVE DEVICE, AND METHOD
#101High-resistivity magnetic film from nano-particle plating
#102METHOD OF FABRICATING METAL LINE BY WET PROCESS
#103Method of making sulfur-resistant composite metal membranes
#104PLATING SUBSTRATE, ELECTROLESS PLATING METHOD, AND CIRCUIT FORMING METHOD USING THE SAME
#105Pretreating agent for electroless plating, method of electroless plating using the same and product of electroless plating
#106METHOD FOR MANUFACTURING WIRING SUBSTRATE
#107Method for manufacturing wiring substrate
#108TECHNIQUE FOR DEPOSITING METALLIC FILMS USING ION IMPLANTATION SURFACE MODIFICATION FOR CATALYSIS OF ELECTROLESS DEPOSITION
#109Interconnect circuitry, multichip module, and methods of manufacturing thereof
#110Direct patterning method for manufacturing a metal layer of a semiconductor device
#111Methods of fabricating interconnects for semiconductor components
#112JET PRINTING OF PATTERNED METAL
#113Method for the structured metal-coating of polymeric and ceramic support materials, and compound that can be activated and is used in said method
#114SYSTEM AND METHOD FOR FORMING PATTERNED COPPER LINES THROUGH ELECTROLESS COPPER PLATING
#115Electromagnetic-wave-shielding light-transmitting window member and method for producing the same
#116Printable electric circuits, electronic components and method of forming the same
#117Method for electroless plating and metal-plated article
#118Method for manufacturing metallic microstructure
#119Technique for metal deposition by electroless plating using an activation scheme including a substrate heating process
#120Process for preparing palladium alloy composite membranes for use in hydrogen separation, palladium alloy composite membranes and products incorporating or made from the membranes
#121Method of fabricating a magnetic tag
#122Plating substrate, electroless plating method, and circuit forming method using the same
#123Method for making chrome photo mask
#124Method for the surface activation on the metalization of electronic devices
#125Jet printing of patterned metal
#126Plating of multi-layer structures
#127Conductive electrolessly plated powder and method for making same
#128Process for fabrication of printed circuit boards
#129Methods of fabricating interconnects for semiconductor components including plating solder-wetting material and solder filling
#130Methods of fabricating interconnects for semiconductor components including a through hole entirely through the component and forming a metal nitride including separate precursor cycles
#131Methods of fabricating interconnects including depositing a first material in the interconnect with a thickness of angstroms and a low temperature for semiconductor components
#132Interconnect circuitry, multichip module, and methods for making them
#133Metal plating method and pretreatment agent
#134Post rinse to improve selective deposition of electroless cobalt on copper for ULSI application
#135Formation of layers on substrates
#136Method for electroless deposition of a metal layer on selected portions of a substrate
#137Catalyst composition and deposition method
#138Substrate processing method
#139Electroless deposition methods and systems