171228 ⎘
Details of instruments or arrangements of the types included in groups - and; General constructional details; Measuring leads; Measuring probes; Measuring probes; Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins; Elastic Cantilever beams
Manufacture of probe unit having lead probes extending beyond edge of substrate
#302Method of connecting probe pin to circuit board and method of manufacturing probe card
#303Probe card cooling assembly with direct cooling of active electronic components
#304Cantilever microprobes for contacting electronic components and methods for making such probes
#305Test head assembly having paired contact structures
#306Cantilever microprobes for contacting electronic components and methods for making such probes
#307Method for fabricating a structure for making contact with a device
#308Probe with trapezoidal contractor and device based on application thereof, and method of producing them
#309Multi-signal single beam probe
#310Sputtered spring films with low stress anisotropy
#311Lithographic contact elements
#312Release height adjustment of stressy metal devices by annealing before and after release
#313Microprobe for testing electronic device and manufacturing method thereof
#314Integrated probe module for LCD panel light inspection
#315Probe card and contactor of the same
#316Enhanced stress metal spring contactor
#317Forming tool for forming a contoured microelectronic spring mold
#318Probe card for characterizing processes of submicron semiconductor device fabrication