ClassID:

171228

G01R1/06727 - page 2 - CPC Classification

Classification description:

Details of instruments or arrangements of the types included in groups  -  and; General constructional details; Measuring leads; Measuring probes; Measuring probes; Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins; Elastic Cantilever beams

Recent Application in this class:
#301
20050266690
2005-12-01

Manufacture of probe unit having lead probes extending beyond edge of substrate

#302
20050258847
2005-11-24

Method of connecting probe pin to circuit board and method of manufacturing probe card

#303
20050206397
2005-09-22

Probe card cooling assembly with direct cooling of active electronic components

#304
20050189958
2005-09-01

Cantilever microprobes for contacting electronic components and methods for making such probes

#305
20050189956
2005-09-01

Test head assembly having paired contact structures

#306
20050179458
2005-08-18

Cantilever microprobes for contacting electronic components and methods for making such probes

#307
20050179456
2005-08-18

Method for fabricating a structure for making contact with a device

#308
20050162179
2005-07-28

Probe with trapezoidal contractor and device based on application thereof, and method of producing them

#309
20050162177
2005-07-28

Multi-signal single beam probe

#310
20050159002
2005-07-21

Sputtered spring films with low stress anisotropy

#311
20050148214
2005-07-07

Lithographic contact elements

#312
20050102833
2005-05-19

Release height adjustment of stressy metal devices by annealing before and after release

#313
20050092709
2005-05-05

Microprobe for testing electronic device and manufacturing method thereof

#314
20050083074
2005-04-21

Integrated probe module for LCD panel light inspection

#315
20050083072
2005-04-21

Probe card and contactor of the same

#316
20050026476
2005-02-03

Enhanced stress metal spring contactor

#317
20050016251
2005-01-27

Forming tool for forming a contoured microelectronic spring mold

#318
16538723
2023-02-14

Probe card for characterizing processes of submicron semiconductor device fabrication