PROBE FOR ELECTRICAL CONNECTION APPARATUS

CANTILEVER-TYPE PROBE FOR PROBE CARD, AND PROBE CARD

JIG MODULE AND CIRCUIT BOARD TESTING METHOD USING THE SAME

PROBE, PROBE-HOLDING DEVICE, AND METHOD FOR MANUFACTURING PROBE

ELECTRO-OPTICAL PROBING AND MECHANICAL MICROPROBING OF MEMORY DIE USING A CANTILEVER

PROBE SYSTEMS AND METHODS OF OPERATING PROBE SYSTEMS

CANTILEVER PROBE CARD DEVICE AND SOLDER RECEIVING PROBE

CANTILEVER PROBE CARD DEVICE AND CANTILEVER PROBE MODULE

CANTILEVER PROBE CARD DEVICE AND LIGHT ABSORPTION PROBE

TEST APPARATUS AND TEST METHOD THEREOF

CANTILEVER PROBE CARD DEVICE AND LIGHT SCATTERING PROBE

CANTILEVER PROBE CARD DEVICE AND MICRO ELECTRO MECHANICAL SYSTEM (MEMS) PROBE

CANTILEVER PROBE CARD DEVICE AND CLIMB-RESTRICTING PROBE

CONNECTOR CONTACT FORCE SENSING

Socketed Probes

IMPROVED CONTACT ELEMENT FOR A PROBE HEAD FOR TESTING HIGH-FREQUENCY ELECTRONIC DEVICES AND RELATING PROBE HEAD

PROBE DEVICE, PROBE SYSTEM INCLUDING THE PROBE DEVICE AND OPERATING METHOD THEREOF

PROBES WITH PLANAR UNBIASED SPRING ELEMENTS FOR ELECTRONIC COMPONENT CONTACT, METHODS FOR MAKING SUCH PROBES, AND METHODS FOR USING SUCH PROBES

Cantilever probe card device and elastic probe thereof

Multi-beam cantilever style contact pin for IC testing

Cantilever probe card and carrier thereof

PROBES WITH PLANAR UNBIASED SPRING ELEMENTS FOR ELECTRONIC COMPONENT CONTACT, METHODS FOR MAKING SUCH PROBES, AND METHODS FOR USING SUCH PROBES

Pin-Type Probes for Contacting Electronic Circuits and Methods for Making Such Probes

Inspection apparatus having a contactor for inspecting electrical characteristics of an object, a contactor tip position adjusting unit, and a position adjusting method therefor

Test apparatus and test method thereof

Probe unit with a free length cantilever contactor and pedestal

Topside contact device and method for characterization of high electron mobility transistor (HEMT) heterostructure on insulating and semi-insulating substrates

Probe for testing a semiconductor device and a probe card including the same

Wafer inspection system

High speed signal transmitting and receiving detection device

Cantilever-type probe with multiple metallic coatings

Probe assembly and micro vacuum probe station comprising same

Cantilever-Type Probe with Multiple Metallic Coatings

Apparatus For Use With Exercise Equipment

Microwave resonator magnetic field measuring device and magnetic field measuring method

Contact and test socket device for testing semiconductor device

Contact and test socket device for testing semiconductor device

Electrical contactor and electrical connecting apparatus

Probe module and probe

WEDGED CONTACT FINGERS FOR INTEGRATED CIRCUIT TESTING APPARATUS

REUSABLE PROBE CARD WITH REMOVABLE PROBE INSERT

Cantilever contact probe and corresponding probe head

Cantilever probe head and corresponding contact probe

Probe on carrier architecture for vertical probe arrays

Probe for testing an electrical property of a test sample

Hybrid probe head assembly for testing a wafer device under test

Position correction method, inspection apparatus, and probe card

Probe assembly and probe structure thereof

Probe assembly and probe structure thereof

Probes with fiducial targets, probe systems including the same, and associated methods

Cantilever microprobes for contacting electronic components

Interconnect structure with varying modulus of elasticity

Electrical testing apparatus with lateral movement of a probe support substrate

Pin-type probes for contacting electronic circuits and methods for making such probes

Electrical connecting apparatus and contact

Probe card

Contact pin and test base having contact pins

Probe assembly and testing device

Contact and test socket device for testing semiconductor device

MICROELECTROMECHANICAL PROBE AND PROBE HEAD HAVING THE SAME

Coaxial probe structure

Implementing user configurable probing using magnetic connections and PCB features

Probe module having cantilever MEMS probe and method of making the same

Semiconductor inspection device

Vertical probe card

Kelvin contact assembly in a testing apparatus for integrated circuits

Probe card for testing integrated circuits

Dynamically configurable remote instrument interface

Cantilever type probe card for high frequency signal transmission

Method of producing an interposer with microspring contacts

Multiplexing, switching and testing devices and methods using fluid pressure

Cantilever microprobes for contacting electronic components

Probe card and test equipment with the same

Vertical socket contact with flat force response

Prober having linkage portion, method for manufacturing the prober and method of testing circuit boards using the prober

Electrical connection device comprising connection elements with controllable position

Resilient electrical interposers, systems that include the interposers, and methods for using and forming the same

Contact and electrical connection testing apparatus using the same

TESTING OF ELECTRONIC CIRCUITS USING AN ACTIVE PROBE INTEGRATED CIRCUIT

CANTILEVER CONTACT PROBE FOR A TESTING HEAD

CANTILEVER PROBE CARD FOR HIGH-FREQUENCY SIGNAL TRANSMISSION

Probe card assembly for testing electronic devices

Vertical socket contact with flat force response

Rigid probe with compliant characteristics

Rigid probe with compliant characteristics

Contact probe and probe card

Electrical contactor and contact method for the same

Electrical test probe

Laterally driven probes for semiconductor testing

High-precision semiconductor device probing apparatus and system thereof

3-dimensional integrated circuit testing using MEMS switches with tungsten cone contacts

PROBE PIN, PROBE CARD USING THE PROBE PIN, AND METHOD OF MANUFACTURING THE PROBE CARD

PROBE CARD AND MANUFACTURING METHOD THEREOF

Probe with cantilevered beam having solid and hollow sections

Method for cleaning a contact pad of a microstructure and corresponding cantilever contact probe and probe testing head

Oblique parts or surfaces

SCALABLE WIDEBAND PROBES, FIXTURES, AND SOCKETS FOR HIGH SPEED IC TESTING AND INTERCONNECTS

PROBE MANUFACTURING METHOD, PROBE STRUCTURE, PROBE APPARATUS, AND TEST APPARATUS

PROBE, PROBE CARD AND ELECTRONIC DEVICE TESTING APPARATUS

Resilient electrical interposers, systems that include the interposers, and methods for using and forming the same

Micro contact prober

Semiconductor test probe apparatus and method

PROBE CARD

Microsprings partially embedded in a laminate structure and methods for producing same

Interposer with microspring contacts

Methods of creating probe structures from a plurality of planar layers

Methods of creating probe structures from a plurality of planar layers

Probe devices formed from multiple planar layers of structural material with tip regions formed from one or more intermediate planar layers

Methods of creating probe structures from a plurality of planar layers

Probe for testing semiconductor devices

Electrical connecting apparatus and contacts used therefor

Contact spring application to semiconductor devices

Zero Insertion Force Scrubbing Contact

PROBE

PROBE

Probe card for testing high-frequency signals

Prober unit

Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes

Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes

PROBE FOR ELECTRICAL TEST AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRICAL CONNECTING APPARATUS AND METHOD FOR MANUFACTURING THE SAME

MEMS PROBE CARD AND METHOD OF MANUFACTURING SAME

Method for providing alignment of a probe

PROBE CARD

Micro contact probe coated with nanostructure and method for manufacturing the same

Method for manufacturing probe sheet

Cantilever probe structure for a probe card assembly

Method for manufacturing a probe for an electrical test

Test contact arrangement

Attachment of an electrical element to an electronic device using a conductive material

METHOD OF MANUFACTURING NEEDLE FOR PROBE CARD USING FINE PROCESSING TECHNOLOGY, NEEDLE MANUFACTURED BY THE METHOD AND PROBE CARD COMPRISING THE NEEDLE

COMPOSITE MICRO-CONTACTS

Probe assembly and manufacturing method thereof

Dual tip test probe assembly

Sharpened, oriented contact tip structures

Single support structure probe group with staggered mounting pattern

Probe card for testing integrated circuits

Solder attached contact and a method of manufacturing the same

Curved spring structure with downturned tip

Cantilevered probe having a bending contact

Cantilever type probe head having introducing portion with end face having a tapered portion and an extended rectangular portion

METHOD OF MANUFACTURING AN INSPECTION APPARATUS FOR INSPECTING AN ELECTRONIC DEVICE

Probe and electrical connecting apparatus using it

Current test probe having a solder guide portion, and related probe assembly and production method

Contactor, probe card, and method of mounting contactor

Electrical connecting apparatus

Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes

Probe and probe card

PROBE, PROBE CARD, AND METHOD OF PRODUCTION OF PROBE

MEMS probe for probe cards for integrated circuits

Testing of electronic circuits using an active probe integrated circuit

Oblique parts or surfaces

Oblique parts or surfaces

PROBE AND METHOD FOR MANUFACTURING THE SAME

Cantilever-type micro contact probe with hinge structure

Contactor and method of production of contactor

Microelectronic contact structure

LITHOGRAPHIC CONTACT ELEMENTS

Process of positioning groups of contact structures

Probe needle, method for manufacturing the probe needle and method for constructing a three-dimensional structure

Monolithic comb drive system and method for large-deflection multi-DOF microtransduction

Probe card cooling assembly with direct cooling of active electronic components

PROBE CARD

Cantilever Microprobes for Contacting Electronic Components and Methods for Making Such Probes

MEMS probe fabrication on a reusable substrate for probe card application

Method of manufacturing ceramic probe card

Tester with low signal attenuation

Contact for electrical test of electronic devices, probe assembly and method for manufacturing the same

Spring interconnect structures

Probe card

Contact for electrical test, electrical connecting apparatus using it, and method of producing the contact

ELECTRICAL TESTING PROBE ASSEMBLY HAVING NONPARALLEL FACING SURFACES AND SLOTS FORMED THEREON FOR RECEIVING PROBES

PROBE OF CANTILEVER PROBE CARD

Probe card, manufacturing method of probe card, semiconductor inspection apparatus and manufacturing method of semiconductor device

Semiconductor inspecting device

Method of fabricating cantilever type probe and method of fabricating probe card using the same

Contactor for electrical test, electrical connecting apparatus using the same, and method for manufacturing contactor

Probe Holder and Probe Unit

METHOD FOR ARRANGING A PLURALITY OF CONNECTING ELEMENTS

Method of manufacturing a probe card

Cantilever-type probe and method of fabricating the same

Probe unit substrate

REDUCED SCRUB CONTACT ELEMENT

Multi-Pivot Probe Card For Testing Semiconductor Devices

Forked probe for testing semiconductor devices

Electrical test probe

Probe for electrical test and electrical connecting apparatus using it

Contact with plural beams

INTERCONNECT ASSEMBLIES AND METHODS

Method for repairing a microelectromechanical system

Probe for electrical test comprising a positioning mark and probe assembly

Method for providing alignment of a probe

PROBE FOR ELECTRICAL TEST

Electrical testing probe assembly having nonparallel facing surfaces and slots formed thereon for receiving probes

Testing method for semiconductor device having ball-shaped external electrode

Method of bonding probes and method of manufacturing a probe card using the same

Method for forming connection pin, probe, connection pin, probe card and method for manufacturing probe card

Probe card and method for fabricating the same

Scalable wideband probes, fixtures, and sockets for high speed IC testing and interconnects

Spring interconnect structures

Probe for testing semiconductor devices with features that increase stress tolerance

Hybrid probe for testing semiconductor devices

Structure of probe

PROBE ASSEMBLY WITH ROTARY TIP

Cantilever probe card

Method for manufacturing probe card needles

PROBE AND PROBE ASSEMBLY

Method for manufacturing probe structure of probe card

Method for manufacturing cantilever structure of probe card

Probe card manufacturing method including sensing probe and the probe card, probe card inspection system

Probing structure with fine pitch probes

Probe and probe card

Probe unit substrate

Electrical connecting apparatus and method for use thereof

Contact pin probe card and electronic device test apparatus using same

Electrical connecting apparatus and method for manufacturing the same

Interconnect For Microelectronic Structures With Enhanced Spring Characteristics

CONTACT TIP STRUCTURE FOR MICROELECTRONIC INTERCONNECTION ELEMENTS AND METHODS OF MAKING SAME

Method of making lithographic contact elements

Torsion spring probe contactor design

Cantilever microprobes for contacting electronic components and methods for making such probes

Probe for inspecting one or more semiconductor chips

Systems for testing and packaging integrated circuits

HIGH DENSITY CANTILEVERED PROBE FOR ELECTRONIC DEVICES

Manufacture Method Of Vertical-Type Electric Contactor Vertical-Type Electric Contactor Thereof

Single support structure probe group with staggered mounting pattern

Method of repairing a contactor apparatus

Electrical test probe and electrical test probe assembly

Probe card repair using coupons with spring contacts and separate atachment points

Electrical probe assembly with guard members for the probes

PROBE, METHOD OF MANUFACTURING THE PROBE AND PROBE CARD HAVING THE PROBE

HIGH DENSITY CANTILEVERED PROBE FOR ELECTRONIC DEVICES

Probe head assembly for use in testing multiple wafer die

Method for manufacturing probe structure

HIGH DENSITY CANTILEVERED PROBE FOR ELECTRONIC DEVICES

HIGH DENSITY CANTILEVERED PROBE FOR ELECTRONIC DEVICES

Probe Cards

AC coupled parameteric test probe

Contactor having a global spring structure and methods of making and using the contactor

Multifunctional probe array system

Electronic components with plurality of contoured microelectronic spring contacts

Probe needle, method for manufacturing the probe needle and method for constructing a three-dimensional structure

Extended probe tips

Probe

Approach for fabricating cantilever probes

Probe structures with physically suspended electronic components

Post and tip design for a probe contact

Probe for testing an electrical device

Cantilever and cantilever manufacturing method

Two-part microprobes for contacting electronic components and methods for making such probes

Approach for fabricating cantilever probes for probe card assemblies

Probe assembly comprising a parallelogram link vertical probe made of a metal foil attached to the surface of a resin film

Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes

Cantilever microprobes for contacting electronic components and methods for making such probes

Cantilever microprobes for contacting electronic components and methods for making such probes

Contact spring application to semiconductor devices

A PROBE ARRAY STRUCTURE AND A METHOD OF MAKING A PROBE ARRAY STRUCTURE

PROBE WITH TRAPEZOIDAL CONTACTOR AND DEVICE BASED ON APPLICATION THEREOF, AND METHOD OF PRODUCING THEM

Probe chip and probe card

Vertically spaced plural microsprings

Method of producing a probe with a trapezoidal contactor

Sputtered Spring Films With Low Stress Anisotropy

Probes of probe card and the method of making the same

Electrical connecting apparatus and contact

Cantilever probe structure for a probe card assembly

PROBE CARD FOR INTEGRATED CIRCUITS

Multifunctional probe array system

Lithographic type microelectronic spring structures with improved contours

Electrical contact device of probe card

Torsion spring probe contactor design

Post and tip design for a probe contact

Probe use in electric test

Transmission-line spring structure

Non-abrasive electrical test contact

Semiconductor device assemblies with compliant spring contact structures

Fabrication of compliant spring contact structures and use thereof

Enhanced stress metal spring contactor

Microelectronic contact structure and method of making same

Intermetallic Spring Structure

Front-wing cantilever for the conductive probe of electrical scanning probe microscopes

Method of forming an interconnection element

Inspection probe

Test apparatuses for integrated circuits and method for manufacturing the same

Method for manufacturing electrical contact element for testing electronic device and electrical contact element manufactured thereby

Micro contact device comprising the micro contact element and the base member

Method for making a planar suspended microstructure, using a sacrificial layer of polymer material and resulting component

Oblique parts or surfaces

Method of manufacturing a resilient contact

Probe card and contactor of the same

Fiducial alignment masks on microelectronic spring contacts

Electrical connector design and contact geometry and method of use thereof and methods of fabrication thereof

Stacked tip cantilever electrical connector

Electronic device with a warped spring connector

A Highly Resilient Cantilever Spring Probe Having Curved Surfaces for Testing ICs

Highly resilient cantilever spring probe for testing ICs

Transmission-line spring structure

Intermetallic spring structure

Method for forming microelectronic spring structures on a substrate

Cantilever probe with dual plane fixture and probe apparatus therewith

Compliant spring contact structures

Method of making photolithographically-patterned out-of-plane coil structures