ClassID:

176979

G03F7/008 - CPC Classification

Classification description:

Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor; Photosensitive materials Azides

Sub-classes:
Recent Application in this class:
#1
20250199402
2025-06-19

POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT OF THE SAME, AND DISPLAY DEVICE INCLUDING THE SAME

#2
20230244141
2023-08-03

Photocurable composition and method for producing semiconductor device

#3
20230168585
2023-06-01

RESIST UNDERLAYER FILM MATERIAL, PATTERNING PROCESS, AND METHOD FOR FORMING RESIST UNDERLAYER FILM

#4
20220011664
2022-01-13

Photosensitive, inorganic ligand-capped inorganic nanocrystals

#5
20210364915
2021-11-25

CLICK-CHEMISTRY COMPATIBLE STRUCTURES, CLICK-CHEMISTRY FUNCTIONALIZED STRUCTURES, AND MATERIALS AND METHODS FOR MAKING THE SAME

#6
20210116812
2021-04-22

Positive photosensitive resin composition, cured film therefrom, and solid state image sensor comprising the same

#7
20190171101
2019-06-06

Photocurable composition and method for producing semiconductor device

#8
20180329296
2018-11-15

Click-chemistry compatible structures, click-chemistry functionalized structures, and materials and methods for making the same

#9
20180059541
2018-03-01

Click-chemistry compatible structures, click-chemistry functionalized structures, and materials and methods for making the same

#10
20180059540
2018-03-01

Click-chemistry compatible structures, click-chemistry functionalized structures, and materials and methods for making the same

#11
20150343413
2015-12-03

Method for direct photopatterning of molecules on surfaces

#12
20150079519
2015-03-19

Photosensitive compound, photosensitive resin, and photosensitive composition

#13
20080292993
2008-11-27

PHOTO-CATIONIC POLYMERIZABLE EPOXY RESIN COMPOSITION, LIQUID DISCHARGE HEAD, AND MANUFACTURING METHOD THEREOF

#14
20070172978
2007-07-26

Manufacture of a polymer device

#15
20060194251
2006-08-31

Method of fixing low-molecular compound to solid-phase support