ClassID:

206680

H01J2237/3342 - CPC Classification

Classification description:

Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging; Processing objects by plasma generation characterised by the type of processing; Etching Resist stripping

Recent Application in this class:
#1
20250237959
2025-07-24

PLASMA MULTI-WAFER ASHING SYSTEM

#2
20250218740
2025-07-03

Plasma Strip Tool With Movable Insert

#3
20240304453
2024-09-12

ETCHING METHOD

#4
20240249920
2024-07-25

REMOVABLE MASK LAYER TO REDUCE OVERHANG DURING RE-SPUTTER PROCESS IN PVD CHAMBERS

#5
20240030031
2024-01-25

TIN OXIDE THIN FILM SPACERS IN SEMICONDUCTOR DEVICE MANUFACTURING

#6
20240030010
2024-01-25

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

#7
20240021413
2024-01-18

SUBSTRATE PROCESS APPARATUS AND SUBSTRATE PROCESS METHOD USING THE SAME

#8
20230282447
2023-09-07

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

#9
20230102933
2023-03-30

Gas distribution plate with UV blocker

#10
20220367155
2022-11-17

RING CARRIER AND SUBSTRATE TREATING SYSTEM

#11
20220344167
2022-10-27

Etching method

#12
20220336228
2022-10-20

METAL ETCHING WITH IN SITU PLASMA ASHING

#13
20220293428
2022-09-15

Apparatus for processing substrate

#14
20220108873
2022-04-07

Gas supply ring and substrate processing apparatus

#15
20220093367
2022-03-24

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

#16
20220068611
2022-03-03

Plasma strip tool with movable insert

#17
20220005694
2022-01-06

Tin oxide thin film spacers in semiconductor device manufacturing

#18
20210242019
2021-08-05

Tin oxide thin film spacers in semiconductor device manufacturing

#19
20210013013
2021-01-14

Plasma Spreading Apparatus And System

#20
20200381263
2020-12-03

Method of processing target object

#21
20200219725
2020-07-09

Tin oxide thin film spacers in semiconductor device manufacturing

#22
20200176269
2020-06-04

Metal etching with in situ plasma ashing

#23
20200126769
2020-04-23

PLASMA ASHING OF COATED SUBSTRATES

#24
20200043719
2020-02-06

Substrate processing apparatuses and substrate processing methods

#25
20190198301
2019-06-27

Plasma Processing Apparatus and Methods

#26
20190088496
2019-03-21

Method of processing target object

#27
20180308668
2018-10-25

Plasma spreading apparatus and method of spreading plasma in process ovens

#28
20180061655
2018-03-01

Method of processing target object

#29
20180012759
2018-01-11

Tin oxide thin film spacers in semiconductor device manufacturing

#30
20170248849
2017-08-31

Implanted photoresist stripping process

#31
20160300741
2016-10-13

Substrate support with thermal zones for semiconductor processing

#32
20140374919
2014-12-25

Method for producing contact areas on a semiconductor substrate

#33
20140182619
2014-07-03

High dose implantation strip (HDIS) in Hbase chemistry

#34
20140045337
2014-02-13

Heating plate with heating zones for substrate processing and method of use thereof

#35
20130056022
2013-03-07

Bare aluminum baffles for resist stripping chambers

#36
20120211473
2012-08-23

High dose implantation strip (HDIS) in H2 base chemistry

#37
20120024314
2012-02-02

PLASMA MEDIATED ASHING PROCESSES

#38
20110092072
2011-04-21

Heating plate with planar heating zones for semiconductor processing

#39
20100319813
2010-12-23

Bare aluminum baffles for resist stripping chambers

#40
20100055807
2010-03-04

Plasma ashing apparatus and endpoint detection process

#41
20090181526
2009-07-16

Plasma Doping Method and Apparatus

#42
20090104783
2009-04-23

Asher, Ashing Method and Impurity Doping Apparatus

#43
20090056875
2009-03-05

Enhanced stripping of low-K films using downstream gas mixing

#44
20090053901
2009-02-26

High dose implantation strip (HDIS) in Hbase chemistry

#45
20090042394
2009-02-12

Manufacturing method for wiring

#46
20090011615
2009-01-08

Advanced processing technique and system for preserving tungsten in a device structure

#47
20080210273
2008-09-04

BATCH PHOTORESIST DRY STRIP AND ASH SYSTEM AND PROCESS

#48
20080178906
2008-07-31

Bare aluminum baffles for resist stripping chambers

#49
20080000497
2008-01-03

Removal of organic-containing layers from large surface areas

#50
20070269721
2007-11-22

Method and apparatus for providing mask in semiconductor processing

#51
20070264841
2007-11-15

Photoresist stripping chamber and methods of etching photoresist on substrates

#52
20070167023
2007-07-19

Manufacturing method for wiring

#53
20070151956
2007-07-05

Plasma processing device and ashing method

#54
20070105392
2007-05-10

Batch photoresist dry strip and ash system and process

#55
20070066056
2007-03-22

Method of removing a photoresist and method of manufacturing a semiconductor device using the same

#56
20070051471
2007-03-08

Methods and apparatus for stripping

#57
20060289384
2006-12-28

Method and apparatus for performing hydrogen optical emission endpoint detection for photoresist strip and residue removal

#58
20060228889
2006-10-12

Methods of removing resist from substrates in resist stripping chambers

#59
20060154486
2006-07-13

Low-pressure removal of photoresist and etch residue

#60
20060151116
2006-07-13

Focus rings, apparatus in chamber, contact hole and method of forming contact hole

#61
20060151115
2006-07-13

Dry stripping equipment comprising plasma distribution shower head

#62
20060124589
2006-06-15

Apparatus and method for removing photoresist in a semiconductor device

#63
20060108324
2006-05-25

Process for removing a residue from a metal structure on a semiconductor substrate

#64
20060051967
2006-03-09

Wafer bevel polymer removal

#65
20060048893
2006-03-09

Atmospheric pressure plasma processing reactor

#66
20060046470
2006-03-02

Apparatus and plasma ashing process for increasing photoresist removal rate

#67
20050284573
2005-12-29

Bare aluminum baffles for resist stripping chambers

#68
20050274694
2005-12-15

Manufacturing method of semiconductor device

#69
20050230351
2005-10-20

Plasma processing method and apparatus

#70
20050199586
2005-09-15

Resist removal method and semiconductor device manufactured by using the same

#71
20050150601
2005-07-14

Gas distribution plate assembly for plasma reactors

#72
20050106875
2005-05-19

Plasma ashing method

#73
20050026436
2005-02-03

Method for improving ash rate uniformity in photoresist ashing process equipment

#74
20050011752
2005-01-20

Manufacturing method for wiring

#75
15195348
2017-11-21

Tin oxide thin film spacers in semiconductor device manufacturing