205391 ⎘
Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof; Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields; Magnetron sputtering Planar magnetron sputtering
Electrically Coupled Target Panels
#302Magnetron cathode and sputtering device installing it
#303Magnetron sputtering apparatus
#304Plasma systems with magnetic filter devices to alter film deposition/etching characteristics
#305Sputtering with cooled target
#306Etch and sidewall selectivity in plasma sputtering
#307Magnetron source for deposition on large substrates
#308Physical vapor deposition plasma reactor with arcing suppression
#309Partially suspended rolling magnetron
#310Methods and apparatus for generating strongly-ionized plasmas with ionizational instabilities
#311Sputtering system providing large area sputtering and plasma-assisted reactive gas dissociation
#312Method of ionized physical vapor deposition sputter coating high aspect-ratio structures
#313Sputter target utilization
#314METHOD OF MANUFACTURING AT LEAST ONE SPUTTER-COATED SUBSTRATE AND SPUTTER SOURCE
#315Process kit components for titanium sputtering chamber
#316Target for sputtering chamber
#317Metal foam shield for sputter reactor
#318Magnetron sputtering method and magnetron sputtering apparatus
#319Method and apparatus for improving symmetry of a layer deposited on a semiconductor substrate
#320Flexible magnetron including partial rolling support and centering pins
#321Sputtering apparatus
#322SPUTTERING TARGET FOR TITANIUM SPUTTERING CHAMBER
#323High-Power Pulsed Magnetron Sputtering
#324Sputtering method and sputtering device
#325Magnetron source having increased usage life
#326Small scanned magentron
#327Protective offset sputtering
#328Protective offset sputtering
#329MAGNETRON SPUTTERING SYSTEM FOR LARGE-AREA SUBSTRATES HAVING REMOVABLE ANODES
#330Sputtering device
#331Anode reactive dual magnetron sputtering
#332Coil and coil support for generating a plasma
#333Multiple zone sputtering target created through conductive and insulation bonding
#334Coating machine and method for operating a coating machine
#335Simultaneous ion milling and sputter deposition
#336Apparatus and method of positioning a multizone magnetron assembly
#337Multizone magnetron assembly
#338High-density plasma source
#339Controllable target cooling
#340System and apparatus for real-time monitoring and control of sputter target erosion
#341Single-process-chamber deposition system
#342Evacuable magnetron chamber
#343Magnetron sputtering system for large-area substrates having removable anodes
#344Method and apparatus for sputtering onto large flat panels
#345Method of improving magnetron sputtering of large-area substrates using a removable anode
#346Magnetron sputtering system for large-area substrates
#347Low voltage sputtering for large area substrates
#348Enhanced magnetron sputtering target
#349Method for adjusting electromagnetic field across a front side of a sputtering target disposed inside a chamber
#350Methods and apparatus for generating strongly-ionized plasmas with ionizational instabilities
#351Multiple scanning magnetrons
#352Interior antenna for substrate processing chamber
#353Process for physical vapor deposition of a chalcogenide material layer and chamber for physical vapor deposition of a chalcogenide material layer of a phase change memory device
#354Oscillating magnet in sputtering system
#355Magnet arrangement for a planar magnetron
#356Split magnet ring on a magnetron sputter chamber
#357Dual magnetron thin film deposition system
#358Sacrificial cathode target for sputtering cathode assembly
#359Method of performing physical vapor deposition with RF plasma source power applied to the target using a magnetron
#360Magnetron sputtering coater and method of improving magnetic field uniformity thereof
#361Methods and apparatus for generating strongly-ionized plasmas with ionizational instabilities
#362Apparatus for plasma-enhanced physical vapor deposition of copper with RF source power applied through the workpiece
#363Method for plasma-enhanced physical vapor deposition of copper with RF source power applied to the target
#364Physical vapor deposition plasma reactor with RF source power applied to the target
#365Sputtering device
#366Physical vapor deposition plasma reactor with RF source power applied to the target and having a magnetron
#367Apparatus for plasma-enhanced physical vapor deposition of copper with RF source power applied through the workpiece with a lighter-than-copper carrier gas
#368Physical vapor deposition plasma reactor with VHF source power applied through the workpiece
#369Sputtering cathode, production method and corresponding cathode
#370Linear sweeping magnetron sputtering cathode and scanning in-line system for arc-free reactive deposition and high target utilization
#371Multi-track magnetron exhibiting more uniform deposition and reduced rotational asymmetry
#372Method for the production of a substrate with a magnetron sputter coating and unit for the same
#373Magnetron sputter cathode
#374Method of manufacturing a rotation-magnetron-in-magnetron (RMIM) electrode
#375Physical vapor deposition chamber having a rotatable substrate pedestal
#376Physical vapor deposition chamber having an adjustable target
#377Method for magnetron sputtering
#378Systems and methods for magnetron deposition
#379High uniformity 1-D multiple magnet magnetron source
#380Sputtering device
#381In-situ monitoring of target erosion
#382Magnetron having continuously variable radial position
#383Apparatus and method for metal plasma vapor deposition and re-sputter with source and bias power frequencies applied through the workpiece
#384APPARATUS FOR GENERATING HIGH CURRENT ELECTRICAL DISCHARGES
#385Method for manufacturing magnetron coated substrates and magnetron sputter source
#386Apparatus and method for two dimensional magnetron scanning for sputtering onto flat panels
#387Sputtering magnetron control devices
#388MAGNETRON SPUTTERING APPARATUS
#389Multi-step process for forming a metal barrier in a sputter reactor
#390Variable quadruple electromagnet array in plasma processing
#391Self-ionized and inductively-coupled plasma for sputtering and resputtering
#392High deposition rate sputtering
#393Pulsed magnetron for sputter deposition
#394Magnetron sputtering source and chamber therefor
#395Selectable dual position magnetron
#396Sputtering device for manufacturing thin films
#397Shields usable with an inductively coupled plasma reactor
#398Method for manufacturing sputter-coated substrates, magnetron source and sputtering chamber with such source
#399Methods and apparatus for generating strongly-ionized plasmas with ionizational instabilities
#400Sputter arrangement with a magnetron and a target
#401High deposition rate sputtering
#402Two dimensional magnetron scanning for flat panel sputtering
#403Sputtering device
#404Method and apparatus for depositing dielectric films
#405Mechanism for varying the spacing between sputter magnetron and target
#406Compensation of spacing between magnetron and sputter target
#407Apparatus and process for physical vapor deposition
#408Magnet secured in a two part shell
#409Ionized physical vapor deposition apparatus using helical self-resonant coil
#410PLASMA SOURCE WITH SEGMENTED MAGNETRON CATHODE
#411Method and apparatus for plasma generation
#412Linear sweeping magnetron sputtering cathode and scanning in-line system for arc-free reactive deposition and high target utilization
#413Sputtering using an unbalanced magnetron
#414Method for controlling plasma density or the distribution thereof
#415Sliding anode magnetron sputtering source
#416Magnetic control oscillation-scanning sputter
#417[IONIZED PHYSICAL VAPOR DEPOSITION PROCESS AND APPARATUS THEREOF]
#418Self-ionized and inductively-coupled plasma for sputtering and resputtering
#419Sputtering device
#420Cathode assemblies and sputtering systems
#421Cathode assemblies and sputtering systems