Patents-Review.com
ClassID:

205408 ⎘

H01J37/3458 - CPC Classification

Classification description:

Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof; Gas-filled discharge tubes operating with cathodic sputtering; Constructional aspects of the reactor; Magnet arrangements in particular for cathodic sputtering apparatus Electromagnets in particular for cathodic sputtering apparatus

Recent Application in this class:
#1
20260135070
2026-05-14

PHYSICAL VAPOR DEPOSITION APPARATUS

 #2
20260094795
2026-04-02

Inverted Cylindrical Magnetron (ICM) System and Methods of Use

 #3
20250112032
2025-04-03

PERMEANCE MAGNETIC ASSEMBLY

 #4
20250095975
2025-03-20

SYSTEM AND METHOD FOR PARTICLE CONTROL IN MRAM PROCESSING

 #5
20250087536
2025-03-13

DEPOSITION SYSTEM AND METHOD

 #6
20240339310
2024-10-10

APPARATUS AND METHOD FOR PHYSICAL VAPOR DEPOSITION

 #7
20240093357
2024-03-21

Semiconductor Device, Method and Machine of Manufacture

 #8
20240087861
2024-03-14

Permeance magnetic assembly

 #9
20230402271
2023-12-14

Methods and apparatus for controlling ion fraction in physical vapor deposition processes

 #10
20230386806
2023-11-30

System and method for particle control in MRAM processing

 #11
20230352350
2023-11-02

Deposition system and method

 #12
20230313364
2023-10-05

Electromagnet pulsing effect on PVD step coverage

 #13
20230175113
2023-06-08

PHYSICAL VAPOR DEPOSITION APPARATUS

 #14
20220380888
2022-12-01

Methods for shaping magnetic fields during semiconductor processing

 #15
20220367160
2022-11-17

Permeance magnetic assembly

 #16
20220359174
2022-11-10

Apparatus and method for physical vapor deposition

 #17
20220341029
2022-10-27

EM SOURCE FOR ENHANCED PLASMA CONTROL

 #18
20220290291
2022-09-15

Semiconductor device, method and machine of manufacture

 #19
20220277940
2022-09-01

METHOD AND APPARATUS FOR SPUTTER DEPOSITION

 #20
20220259719
2022-08-18

Electrically and magnetically enhanced ionized physical vapor deposition unbalanced sputtering source

 #21
20220068620
2022-03-03

Systems and methods for an improved magnetron electromagnetic assembly

 #22
20220051952
2022-02-17

Deposition system and method

 #23
20220033956
2022-02-03

Methods and apparatus for extended chamber for through silicon via deposition

 #24
20220020577
2022-01-20

Methods and apparatus for controlling ion fraction in physical vapor deposition processes

 #25
20210327693
2021-10-21

System and method for particle control in MRAM processing

 #26
20210123130
2021-04-29

Method and apparatus for depositing a material

 #27
20210071295
2021-03-11

Electromagnetic module for physical vapor deposition

 #28
20210071294
2021-03-11

METHODS AND APPARATUS FOR CONTROLLING ION FRACTION IN PHYSICAL VAPOR DEPOSITION PROCESSES

 #29
20200303165
2020-09-24

Charged particle beam treatment apparatus

 #30
20200176220
2020-06-04

Modifiable magnet configuration for arc vaporization sources

 #31
20200161108
2020-05-21

Permeance magnetic assembly

 #32
20200102645
2020-04-02

Semiconductor device, method and machine of manufacture

 #33
20200051799
2020-02-13

System and method for particle control in MRAM processing

 #34
20190316249
2019-10-17

Electrically and magnetically enhanced ionized physical vapor deposition unbalanced sputtering source

 #35
20190136369
2019-05-09

Electromagnetic module for physical vapor deposition

 #36
20190057849
2019-02-21

Physical vapor deposition chamber particle reduction apparatus and methods

 #37
20180247797
2018-08-30

Reactors for plasma-assisted processes and associated methods

 #38
20180218890
2018-08-02

SPUTTERING COIL PRODUCT AND METHOD OF MAKING

 #39
20170253959
2017-09-07

Methods and apparatus for controlling ion fraction in physical vapor deposition processes

 #40
20170025258
2017-01-26

DEPOSITION OF THICK MAGNETIZABLE FILMS FOR MAGNETIC DEVICES

 #41
20160289815
2016-10-06

Method and apparatus for depositing a material

 #42
20160237555
2016-08-18

Multi-Magnetron Arrangement

 #43
20150235823
2015-08-20

Plasma apparatus, magnetic-field controlling method, and semiconductor manufacturing method

 #44
20150107987
2015-04-23

Plasma generation apparatus, deposition apparatus, and plasma generation method

 #45
20150028295
2015-01-29

Method of manufacturing organic light emitting display apparatus by performing plasma surface process using target sputtering apparatus

 #46
20140332370
2014-11-13

Filtered cathodic arc deposition apparatus and method

 #47
20140262750
2014-09-18

Sputtering devices and methods

 #48
20130101750
2013-04-25

High metal ionization sputter gun

 #49
20130101749
2013-04-25

Method and Apparatus for Enhanced Film Uniformity

 #50
20130032469
2013-02-07

Arc PVD plasma source and method of deposition of nanoimplanted coatings

 #51
20120214793
2012-08-23

Sleep aid composition and method

 #52
20120152896
2012-06-21

High density plasma etchback process for advanced metallization applications

 #53
20120111270
2012-05-10

PLASMA PROCESSING CHAMBER HAVING ENHANCED DEPOSITION UNIFORMITY

 #54
20120070589
2012-03-22

CREATION OF MAGNETIC FIELD (VECTOR POTENTIAL) WELL FOR IMPROVED PLASMA DEPOSITION AND RESPUTTERING UNIFORMITY

 #55
20110308941
2011-12-22

Modifiable magnet configuration for arc vaporization sources

 #56
20110247928
2011-10-13

Sputtering apparatus and sputtering method

 #57
20110240468
2011-10-06

Target utilization improvement for rotatable magnetrons

 #58
20110233058
2011-09-29

Magnetron Plasma Sputtering Apparatus

 #59
20110233050
2011-09-29

Magnetic lensing to improve deposition uniformity in a physical vapor deposition (PVD) process

 #60
20110220494
2011-09-15

METHODS AND APPARATUS FOR MAGNETRON METALLIZATION FOR SEMICONDUCTOR FABRICATION

 #61
20110108416
2011-05-12

MAGNETRON SPUTTER

 #62
20110062019
2011-03-17

Sputtering apparatus

 #63
20100270144
2010-10-28

High Power Pulse Magnetron Sputtering For High Aspect-Ratio Features, Vias, and Trenches

 #64
20100006423
2010-01-14

MAGNETIC FIELD GENERATION CONTROL UNIT AND MAGNETRON SPUTTERING APPARATUS AND METHOD USING THE SAME

 #65
20090314631
2009-12-24

Magnetron With Electromagnets And Permanent Magnets

 #66
20090200158
2009-08-13

HIGH POWER IMPULSE MAGNETRON SPUTTERING VAPOUR DEPOSITION

 #67
20090145743
2009-06-11

Sputtering devices and methods

 #68
20080179183
2008-07-31

Offset magnet compensation for non-uniform plasma

 #69
20080141939
2008-06-19

Encapsulated and water cooled electromagnet array

 #70
20080110749
2008-05-15

Arc source and magnet configuration

 #71
20070199817
2007-08-30

Magnetron source for deposition on large substrates

 #72
20070175749
2007-08-02

Sputter target utilization

 #73
20070095654
2007-05-03

Controlled multi-step magnetron sputtering process

 #74
20060207871
2006-09-21

Sputtering devices and methods

 #75
20050255700
2005-11-17

Controlled multi-step magnetron sputtering process

 #76
20050103620
2005-05-19

PLASMA SOURCE WITH SEGMENTED MAGNETRON CATHODE

 #77
20050056536
2005-03-17

Multi-step magnetron sputtering process

 #78
14483093
2017-09-12

Filtered cathodic arc method, apparatus and applications thereof

 #79
13277441
2015-08-11

Filter circuit for a magnetron deposition source