H01L2021/60285 - CPC Classification

Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer; Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups  - , e.g. sealing of a cap to a base of a container; Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the use of mechanical auxiliary parts without the use of an alloying or soldering process, e.g. pressure contacts

Recent Application in this class: