H01L2021/60 - CPC Classification Index

ClassID:

207301 ⎘

H01L2021/60 - CPC Classification

Classification description:

Sub-classes:

H01L2021/60007 » {involving a soldering or an alloying process} 49
H01L2021/60277 » {involving the use of conductive adhesives} 28
H01L2021/60285 » {involving the use of mechanical auxiliary parts without the use of an alloying of soldering process, e.g. pressure contacts} 5
H01L2021/60292 » {involving the use of an electron or laser beam} 15
H01L2021/603 » {involving the application of pressure, e.g. thermo-compression bonding} 19
H01L2021/607 » {involving the application of mechanical vibrations, e.g. ultrasonic vibrations} 4

Recent Application in this class:

20220149002

Bonded assembly formed by hybrid wafer bonding using selectively deposited metal liners

20220130685

Semiconductor packages

20220013462

Package substrate and manufacturing method thereof

20210183764

Package structure and method of forming the same

20210167013

Power Distribution

20210050312

Integrated structures with antenna elements and IC chips employing edge contact connections

20200251428

Semiconductor device, manufacturing method of semiconductor device, integrated substrate, and electronic device

20200118937

System and method for aligned stitching

20190164899

System and method for aligned stitching

20190109099

Semiconductor device, manufacturing method of semiconductor device, integrated substrate, and electronic device

20190096861

MICROELECTRONIC PACKAGE FOR WAFER-LEVEL CHIP SCALE PACKAGING WITH FAN-OUT

20180211914

Power distribution

20170117260

Microelectronic package for wafer-level chip scale packaging with fan-out

20160365498

Light emitting device

20160042979

Multi-chip module with rework capability

20160028203

SHIELDED SOCKETS FOR MICROPROCESSORS AND FABRICATION THEREOF BY OVERMOLDING AND PLATING

20150311410

Light emitting device

20150270204

Lead frame with radiator plate, method for manufacturing lead frame with radiator plate, semiconductor device, and method for manufacturing semiconductor device

20150014842

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

20140319567

Light emitting device

20140226297

Method of manufacturing connection structure

20140183750

Ultrathin buried die module and method of manufacturing thereof