207308 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer; Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups - , e.g. sealing of a cap to a base of a container; Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the use of an electron or laser beam
METHOD FOR PRODUCING AN SMD POWER SEMICONDUCTOR COMPONENT MODULE AND SMD POWER SEMICONDUCTOR COMPONENT MODULE
#2SYSTEMS AND METHODS FOR WAFER BOND MONITORING
#3LASER BONDING APPARATUS FOR THREE-DIMENSIONAL MOLDED SCULPTURES
#4ELECTRONIC PACKAGE WITH HEATSINK AND MANUFACTURING METHOD THEREFOR
#5Systems and methods for wafer bond monitoring
#6METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE
#7Systems and methods for wafer bond monitoring
#8Laser beam shaping for foil-based metallization of solar cells
#9Chip to chip interconnect in encapsulant of molded semiconductor package
#10Systems and methods for wafer bond monitoring
#11Laser bonding apparatus for three-dimensional molded sculptures
#12Chip to chip interconnect in encapsulant of molded semiconductor package
#13Mask changing unit for laser bonding apparatus
#14Laser beam shaping for foil-based metallization of solar cells
#15Laser bonding apparatus for three-dimensional molded sculptures
#16Laser beam shaping for foil-based metallization of solar cells
#17Hybrid exposure for semiconductor devices