H01L2023/4018 - CPC Classification Index

ClassID:

207630 ⎘

H01L2023/4018 - CPC Classification

Classification description:

Details of semiconductor or other solid state devices; Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements; Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled

Sub-classes:

H01L2023/4025 » {Base discrete devices, e.g. presspack, disc-type transistors} 15
H01L2023/4031 » {Packaged discrete devices, e.g. to-3 housings, diodes} 101

Recent Application in this class:

20240087981

HEAT SINK FOR A SEMICONDUCTOR SWITCHING DEVICE, AND SEMICONDUCTOR SWITCHING DEVICE

20230298960

Lid Allowing for a Thermal Interface Material with Fluidity in a Lidded Flip Chip Package

20220077024

Semiconductor device including heat dissipation structure and fabricating method of the same

20210176869

Power conversion device

20200105644

Semiconductor device including heat dissipation structure and fabricating method of the same

20200058572

Electrical assembly equipped with auxiliary retention for facilitating heat sink installation

20200020608

Circuit device

20190304871

Method and apparatus for detaching a microprocessor from a heat sink

20190252292

Power module and semiconductor apparatus

20190027421

Heat dissipation structure of semiconductor device

20180019179

Silicon-based heat dissipation device for heat-generating devices

20170243807

Packaging for high power integrated circuits and infrared emitter arrays

20160353608

Package assembly

20140252587

Semiconductor device, and on-board power conversion device

15681333

Apparatus, system, and method for improving the thermal conduction of heat sinks

14830684

Packaging and cooling method and apparatus for power semiconductor devices