Patents-Review.com
ClassID:

207632 ⎘

H01L2023/4031 - CPC Classification

Classification description:

Details of semiconductor or other solid state devices; Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements; Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled Packaged discrete devices, e.g. to-3 housings, diodes

Recent Application in this class:
#1
20260018485
2026-01-15

SEMICONDUCTOR UNIT

 #2
20250167073
2025-05-22

POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING POWER SEMICONDUCTOR DEVICE

 #3
20250132225
2025-04-24

SEMICONDUCTOR DEVICE

 #4
20250125218
2025-04-17

ELECTRONIC MODULE HAVING A CLIP CONNECTED TO A SEMICONDUCTOR PACKAGE

 #5
20250087615
2025-03-13

METHOD OF FABRICATING PACKAGE STRUCTURE HAVING HOLLOW CYLINDERS

 #6
20240397606
2024-11-28

MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD

 #7
20240371795
2024-11-07

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

 #8
20240040689
2024-02-01

SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING A SEMICONDUCTOR MODULE

 #9
20240030096
2024-01-25

POWER BLOCK BASED ON TOP-SIDE COOL SURFACE-MOUNT DISCRETE DEVICES WITH DOUBLE-SIDED HEAT SINKING

 #10
20230378884
2023-11-23

Power transistor conversion device

 #11
20230378098
2023-11-23

Semiconductor package and manufacturing method thereof

 #12
20230309278
2023-09-28

Battery Disconnect Unit

 #13
20230260859
2023-08-17

SEMICONDUCTOR DEVICE

 #14
20230230895
2023-07-20

HEAT TRANSFER FOR POWER MODULES

 #15
20230187311
2023-06-15

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

 #16
20230163046
2023-05-25

Apparatus for protecting a stack of electronic components and method of the same

 #17
20230066410
2023-03-02

Semiconductor package and manufacturing method thereof

 #18
20220301998
2022-09-22

Power semiconductor module and method for producing a power semiconductor module

 #19
20220285289
2022-09-08

Semiconductor package and manufacturing method thereof

 #20
20220246570
2022-08-04

Package structure having hollow cylinders and method of fabricating the same

 #21
20220085001
2022-03-17

Dual-sided co-packaged optics for high bandwidth networking applications

 #22
20210343623
2021-11-04

Semiconductor device and method of manufacturing semiconductor device

 #23
20210343621
2021-11-04

Heat sink, heat dissipation apparatus, heat dissipation system, and communications device

 #24
20210296225
2021-09-23

Structural elements for application specific electronic device packages

 #25
20210280566
2021-09-09

Dual-sided co-packaged optics for high bandwidth networking applications

 #26
20200388557
2020-12-10

Heat transfer for power modules

 #27
20200335414
2020-10-22

Heat transfer for power modules

 #28
20200294885
2020-09-17

Electronic module comprising a semiconductor package with integrated clip and fastening element

 #29
20200286811
2020-09-10

Semiconductor device including a spring plate

 #30
20200286810
2020-09-10

Mounting devices for semiconductor packages with a fixation mechanism

 #31
20200243415
2020-07-30

Device for cooling electrical components

 #32
20200203301
2020-06-25

Electronic assembly, package structure having hollow cylinders and method of fabricating the same

 #33
20200169148
2020-05-28

Electric working machine with semiconductor element that completes or interrupts current path to motor

 #34
20200144147
2020-05-07

Method of manufacturing semiconductor module and semiconductor module

 #35
20200141669
2020-05-07

Fixing device for double sided heat sink and associated heat dissipating system

 #36
20200118905
2020-04-16

Conductive lid and semiconductor device package

 #37
20200051892
2020-02-13

Power semiconductor module and vehicle

 #38
20190341327
2019-11-07

Heat transfer for power modules

 #39
20190306985
2019-10-03

Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array sockets

 #40
20190295920
2019-09-26

Multi-package top-side-cooling

 #41
20190252293
2019-08-15

Semiconductor device

 #42
20190229036
2019-07-25

Solid-state storage device

 #43
20190221549
2019-07-18

Semiconductor device

 #44
20190221497
2019-07-18

Holding and ignition prevention device for semiconductor element, and power conversion device using holding and ignition prevention device

 #45
20190206763
2019-07-04

Heat sink, heat dissipation apparatus, heat dissipation system, and communications device

 #46
20190170457
2019-06-06

Fixing device for double sided heat sink and associated heat dissipating system

 #47
20190157183
2019-05-23

Semiconductor device and method for manufacturing semiconductor device

 #48
20190150311
2019-05-16

Socket connector for an electronic package

 #49
20190148860
2019-05-16

Socket connector for an electronic package

 #50
20190148859
2019-05-16

Socket connector assembly for an electronic package

 #51
20190148858
2019-05-16

Cable socket connector assembly for an electronic

 #52
20190115282
2019-04-18

Heat sink fastening seat and securing device with gasket for use with electrical connector

 #53
20190057914
2019-02-21

Power module and power conversion apparatus including case and elastic member

 #54
20190023308
2019-01-24

Electronic control unit and electric power steering device using the same

 #55
20190014692
2019-01-10

Electronic control unit and electric power steering device using the same

 #56
20190006258
2019-01-03

Method of packaging power semiconductor module including power transistors

 #57
20180343775
2018-11-29

Power module, power module assembly and assembling method thereof

 #58
20180337153
2018-11-22

Semiconductor module, base plate of semiconductor module, and method of manufacturing semiconductor device

 #59
20180337108
2018-11-22

Power electronic arrangement and electric vehicle with such an arrangement

 #60
20180261526
2018-09-13

Heat exchangers for dual-sided cooling

 #61
20180247881
2018-08-30

Electronic apparatus

 #62
20180203490
2018-07-19

Conductive stress-relief washers in microelectronic assemblies

 #63
20180122782
2018-05-03

Power module having power device connected between heat sink and drive unit

 #64
20180090416
2018-03-29

Heat dissipation component and terminal device including heat dissipation component

 #65
20180019186
2018-01-18

Semiconductor device and manufacturing method of semiconductor device

 #66
20170290209
2017-10-05

Systems and methods for thermal management for high power density EMI shielded electronic devices

 #67
20170271239
2017-09-21

Semiconductor module and manufacturing method of semiconductor module

 #68
20170230011
2017-08-10

Vapor chamber amplifier module

 #69
20170207143
2017-07-20

Semiconductor device and semiconductor module having cooling fins

 #70
20170141012
2017-05-18

Semiconductor module

 #71
20160336252
2016-11-17

Semiconductor module having an embedded metal heat dissipation plate

 #72
20160329264
2016-11-10

Semiconductor assembly having a press pack stack

 #73
20160322333
2016-11-03

Electronic module comprising fluid cooling channel and method of manufacturing the same

 #74
20160307821
2016-10-20

Cooler and cooler fixing method

 #75
20160240456
2016-08-18

Semiconductor device

 #76
20160104654
2016-04-14

Semiconductor device and semiconductor module having cooling fins

 #77
20150325494
2015-11-12

Power semiconductor module with switching device and assembly

 #78
20150214133
2015-07-30

Electronic device and method for fabricating an electronic device

 #79
20150087113
2015-03-26

Electrically isolated power semiconductor package with optimized layout

 #80
20150076605
2015-03-19

Switching Device with Free-Wheeling Diode

 #81
20150035136
2015-02-05

Semiconductor device to be attached to heat radiation member

 #82
20120235308
2012-09-20

Manufacturing method of semiconductor device, and semiconductor device

 #83
20100226096
2010-09-09

Clamping part for pressing power components against a cooling surface

 #84
20100127391
2010-05-27

Fixture for semiconductor device and assembly of semiconductor device

 #85
20100103625
2010-04-29

Printed circuit board and heat sink

 #86
20100079958
2010-04-01

Transistor clamping device

 #87
20090237898
2009-09-24

Heat sink arrangement for electrical apparatus

 #88
20090168360
2009-07-02

Clamp for electrical devices

 #89
20080218978
2008-09-11

IC fixing structure

 #90
20080186681
2008-08-07

Electronic assembly cooling

 #91
20080137302
2008-06-12

Boost spring holder for securing a power device to a heatsink

 #92
20080080140
2008-04-03

Assembled structure of power semiconductor device and heat sink

 #93
20080079145
2008-04-03

Power semiconductor arrangement

 #94
20080055862
2008-03-06

Heat sink fastening device and assembling process thereof

 #95
20080037223
2008-02-14

Power Electronics with a Heat Sink

 #96
20070200227
2007-08-30

Power semiconductor arrangement

 #97
20070086165
2007-04-19

Heat-generating electronic part cover and cover mounting method

 #98
20060279934
2006-12-14

Electronic device package heat sink assembly

 #99
20060267180
2006-11-30

Heat sink arrangement for electrical apparatus

 #100
20060191908
2006-08-31

Electric range

 #101
20060158859
2006-07-20

Power supply and fixing structure of heatsink and circuit board applicable to the same

 #102
20060121703
2006-06-08

Assembly structure of electronic element and heat sink

 #103
20050264998
2005-12-01

Heat sink assembly

 #104
20050135065
2005-06-23

Electric circuit module

 #105
15937781
2019-05-28

Apparatus, system, and method for mitigating electromagnetic radiation leaks in double-decker heatsinks

 #106
15378011
2018-03-27

Power semiconductor device module baseplate having peripheral heels