207634 ⎘
Details of semiconductor or other solid state devices; Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements; Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to have chip
Package and Method for Manufacturing the Same
#2Chip Package System Having A Vapor Chamber With Solder Thermal Interface Material And Method Of Manufacturing Same
#3HEAT DISSIPATION STRUCTURE OF HIGH-POWER CHIP POWER SUPPLY MODULE
#4Heat dissipation fastener structure
#5INTEGRATED CIRCUIT DEVICE WITH THERMAL DISSIPATING PACKAGE
#6POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING A POWER SEMICONDUCTOR DEVICE
#7Power transistor conversion device
#8POWER DEVICE AND POWER MODULE
#9BOARD, ELECTRONIC DEVICE, AND MANUFACTURING METHOD
#10Heat sink
#11Semiconductor module and vehicle
#12Package and Method for Manufacturing the Same
#13Heat dissipation structure and heat dissipation method
#14Integrated electronic device
#15Electronic device apparatus with multiple thermally conductive paths for heat dissipation
#16Electric machine with a heat transfer device for transferring heat from an electronic component to a heat sink
#17HEAT SINK
#18Adjustable heat sink fin spacing
#19Adjustable heat sink fin spacing
#20Positioning assembly for computer radiator
#21Microelectronic components having integrated heat dissipation posts and systems including the same
#22COOLING DEVICE
#23Semiconductor device
#24Stacked semiconductor die assemblies with high efficiency thermal paths and molded underfill
#25Semiconductor memory device and a chip stack package having the same
#26Temperature control device, semiconductor device including the same, and method for controlling the semiconductor device
#27Adjustable heat sink fin spacing
#28Semiconductor device
#29Package assembly
#30Electronic assembly with one or more heat sinks
#31Semiconductor device and method for manufacturing the same
#32Fan-out wafer level package
#33Fastening systems for power modules
#34Three dimensional integrated circuit (3DIC) having a thermally enhanced heat spreader embedded in a substrate
#35Power module package and method for manufacturing the same
#36Dual Heat Sinks For Distributing A Thermal Load
#37Multi-die integrated circuit structure with heat sink
#38SEMICONDUCTOR DEVICE HAVING DUMMY PATTERN AND DESIGN METHOD THEREOF
#39Semiconductor package structures having liquid cooler integrated with first level chip package modules
#40HEAT DISSIPATING DEVICE
#41Semiconductor package structures having liquid coolers integrated with first level chip package modules
#42SEMICONDUCTOR COOLING STRUCTURE
#43Semiconductor device
#44SEMICONDUCTOR MODULE DEVICE, METHOD OF MANUFACTURING THE SAME, FLAT PANEL DISPLAY, AND PLASMA DISPLAY PANEL
#45Lidless semiconductor cooling
#46Integrated heat sink
#47Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof
#48Chip on a board
#49Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof
#50Semiconductor device with pins and method of assembling the semiconductor device
#51Apparatus, system, and method for dynamic compensation of heatsink-clamping mechanisms
#52Cable connector assembly for an integrated circuit assembly
#53Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof