Patents-Review.com
ClassID:

207633 ⎘

H01L2023/4037 - CPC Classification

Classification description:

Details of semiconductor or other solid state devices; Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements; Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink

Sub-classes:
Recent Application in this class:
#1
20240431017
2024-12-26

ELECTRONIC BOARD EQUIPPED WITH A HEAT DISSIPATION DEVICE AND APPARATUS COMPRISING SUCH AN ELECTRONIC BOARD

 #2
20210288433
2021-09-16

Card-type connector having heat conductive members extending over terminals thereof

 #3
20210143083
2021-05-13

Back plate assembly and electronic device

 #4
20200411411
2020-12-31

Multi layer thermal interface material

 #5
20200373218
2020-11-26

HEAT DISSIPATION DEVICE AND ELECTRONIC DEVICE

 #6
20180376613
2018-12-27

Fixing structure of electronic component

 #7
20180374770
2018-12-27

ELECTRICAL ASSEMBLY

 #8
20180321720
2018-11-08

ADDITIVE MANUFACTURED PASSIVE THERMAL ENCLOSURE

 #9
20180277396
2018-09-27

Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreader

 #10
20180247881
2018-08-30

Electronic apparatus

 #11
20180174941
2018-06-21

Semiconductor memory device and a chip stack package having the same

 #12
20180151473
2018-05-31

Lightweight liquid-cooling-plate assembly having plastic frame and heat dissipation system using same

 #13
20180108593
2018-04-19

Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink

 #14
20180096911
2018-04-05

Case and electronic device having the same

 #15
20180061733
2018-03-01

Method of fabricating a chip module with stiffening frame and orthogonal heat spreader

 #16
20180007811
2018-01-04

Heart dissipator structure

 #17
20170229374
2017-08-10

Heat sink with integrated threaded lid

 #18
20160284623
2016-09-29

Cooling device and device

 #19
20160146447
2016-05-26

Heat-dissipating socket for lighting fixtures

 #20
20160118315
2016-04-28

Heat sink coupling using flexible heat pipes for multi-surface components

 #21
20160064300
2016-03-03

Fan-out wafer level package

 #22
20160043017
2016-02-11

Printed circuit board assembly including conductive heat transfer

 #23
20130337612
2013-12-19

Heat dissipation methods and structures for semiconductor device

 #24
20130265721
2013-10-10

Thermal interface materials with thin film or metallization

 #25
20130093074
2013-04-18

Multi-die integrated circuit structure with heat sink

 #26
20130021769
2013-01-24

MULTICHIP MODULE, PRINTED WIRING BOARD, METHOD FOR MANUFACTURING MULTICHIP MODULE, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

 #27
20120306106
2012-12-06

SEMICONDUCTOR DEVICE HAVING DUMMY PATTERN AND DESIGN METHOD THEREOF

 #28
20090168364
2009-07-02

Heat dissipation device for semiconductor package module, and semiconductor package module having the same

 #29
20080211079
2008-09-04

Heat dissipation methods and structures for semiconductor device