ClassID:

207639

H01L2023/4075 - CPC Classification

Classification description:

Details of semiconductor or other solid state devices; Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements; Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws Mechanical elements

Sub-classes:
Recent Application in this class:
#1
20230413476
2023-12-21

Heat Dissipating Object with Self Sealing Plug Allowing for a Thermal Interface Material with Fluidity for an Electronic Device

#2
20230389234
2023-11-30

Error-unlocking protection structure for heat dissipation base seat

#3
20200375017
2020-11-26

Printed circuit board and electronic device

#4
20190132939
2019-05-02

Printed circuit board and electronic device

#5
20190057927
2019-02-21

Component coupled to heat dissipation unit

#6
20190027425
2019-01-24

Configurable mounting hole structure for flush mount integration with vapor chamber forming plates

#7
20180002101
2018-01-04

Containers for holding and dispensing stacks of electronic device components

#8
20140374898
2014-12-25

Semiconductor device and semiconductor device fabrication method

#9
20140161558
2014-06-12

Sprung washer and fixing device

#10
20130083504
2013-04-04

ELECTRONIC DEVICE

#11
20100178780
2010-07-15

Socket assembly incorporated with rotationally mounted pressing member

#12
20090168364
2009-07-02

Heat dissipation device for semiconductor package module, and semiconductor package module having the same

#13
20090166021
2009-07-02

Heat sink and method of forming a heatsink using a wedge-lock system

#14
20090151492
2009-06-18

Heat sink mechanism

#15
20070004083
2007-01-04

Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support

#16
20060092235
2006-05-04

Electronic part-mounted substrate, thermal conductive member for electronic part-mounted substrate and liquid-jetting head

#17
20060027921
2006-02-09

Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support