207640 ⎘
Details of semiconductor or other solid state devices; Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements; Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws; Mechanical elements Compliant clamping elements not primarily serving heat-conduction
SEMICONDUCTOR PACKAGE, POWER ELECTRONIC SYSTEM AND METHOD FOR COUPLING A SEMICONDUCTOR PACKAGE TO A HEATSINK
#2Integrated Circuit Package and Method
#3ELECTRONIC MODULE HAVING A CLIP CONNECTED TO A SEMICONDUCTOR PACKAGE
#4POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION METHOD
#5LEVER ACTUATED COLD PLATE
#6REMOTE HEAT SINK SIDE ATTACH METHODOLOGY
#7Integrated Circuit Package and Method
#8LOCALIZED DAMPING ELEMENTS FOR MITIGATING INTERCONNECT VIBRATION DAMAGE
#9POWER SEMICONDUCTOR MODULE
#10Structure for evenly applying forces on a heat dissipation base plate
#11Circuit Board Assembly and Connector Comprising the Same
#12DISC CELL ASSEMBLY CLAMP
#13Power semiconductor module having a pressure device acting on a switching device
#14POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING A POWER SEMICONDUCTOR DEVICE
#15Component cooler with spring mechanism
#16Integrated Circuit Package and Method
#17Transistor package comprising thermally conductive and electrically insulating layer
#18Error-unlocking protection structure for heat dissipation base seat
#19Backing plate assembly with jack screw for bare die device heat sink applications to ensure uniform loading
#20Circuit carrier arrangement and method for producing such a circuit carrier arrangement
#21Pressure balancing clamp for press-pack insulated gate bipolar transistor module
#22POWER SEMICONDUCTOR MODULE COMPRISING A SUBSTRATE, POWER SEMICONDUCTOR COMPONENTS AND COMPRISING A PRESSURE BODY
#23CONTROLLED-FORCE THERMAL MANAGEMENT DEVICE INSTALLATION
#24SEMICONDUCTOR MODULE
#25CHIP MODULE AND ELECTRONIC DEVICE
#26DISPLAY DEVICE
#27Integrated circuit package and method
#28MULTILAYER BACK PLATE WITH MOLDED CERAMIC LAYER
#29Semiconductor device
#30POWER SEMICONDUCTOR MODULE WITH CLAMPING DEVICE
#31Circuit carrier arrangement and method for producing such a circuit carrier arrangement
#32Mechanical architecture for a multi-chip module
#33Heat sink, heat dissipation apparatus, heat dissipation system, and communications device
#34Power semiconductor module with baseplate and heat dissipating element
#35Technologies for processor loading mechanisms
#36Backing plate with manufactured features on top surface
#37Cooler
#38High impact resistant heat sink
#39Restricting pole equipped with captive ring to commonly restrain torsioned wire located at corner of stiffener
#40Flexible base design for chipset heat sink
#41Electronic module comprising a semiconductor package with integrated clip and fastening element
#42Semiconductor device including a spring plate
#43Heatsink for pluggable optical devices for the prevention of heatsink clip deformation
#44Heatsink for information handling system
#45Device for cooling electrical components
#46Locating unit with base seat locating structure
#47Method of forming integrated circuit packages with mechanical braces
#48Floating heat sink and elastic support thereof
#49Mechanical part for fastening processor, assembly, and computer device
#50Substrate
#51Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array sockets
#52Bi-directional heatsink dampening force system
#53Positioning assembly for computer radiator
#54Holding and ignition prevention device for semiconductor element, and power conversion device using holding and ignition prevention device
#55Heat sink, heat dissipation apparatus, heat dissipation system, and communications device
#56Socket connector for an electronic package
#57Socket connector for an electronic package
#58Socket connector assembly for an electronic package
#59Cable socket connector assembly for an electronic
#60Heat sink fastening seat and securing device with gasket for use with electrical connector
#61Power module and power conversion apparatus including case and elastic member
#62High impact resistant heat sink
#63DMD assembly and DLP projection device
#64Power module, power module assembly and assembling method thereof
#65Bi-directional heatsink dampening force system
#66Securing mechanism and electronic device with same
#67Heat exchanger for dual-sided cooling of electronic modules
#68Integrated circuit device assembly
#69Thermosiphon systems for electronic devices
#70Spatially selective roughening of encapsulant to promote adhesion with functional structure
#71DMD assembly, DLP optical engine and DLP projection device
#72Systems and methods for coupling a semiconductor device of an automation device to a heat sink
#73High impact resistant heat sink
#74Base with heat absorber and heat dissipating module having the base
#75Semiconductor assembly having a press pack stack
#76Adjustable fastening bracket for radiator
#77Cooling device and device
#78Semiconductor device and method for manufacturing the same
#79Thermosiphon systems for electronic devices
#80SEMICONDUCTOR RADIATOR
#81Thin heat transfer device for thermal management
#82Systems and methods for coupling a semiconductor device of an automation device to a heat sink
#83Electronic device with serviceable CPU
#84Switching Device with Free-Wheeling Diode
#85Sprung washer and fixing device
#86Fastener
#87Thermosiphon systems for electronic devices
#88Electronic assembly with flexible fixtures for spreading load
#89Heat dissipation device with fastener
#90Heat dissipation device with fastener and flange
#91Multicomponent heat sink with movable fin support portion
#92Heat dissipation device with fastener
#93Mounting a heat sink module
#94GROUNDING MECHANISM FOR HEAT SINK ASSEMBLY
#95Dual Heat Sinks For Distributing A Thermal Load
#96ELECTRONIC DEVICE
#97HEAT DISSIPATION DEVICE WITH FASTENER
#98Cooling device installation using a retainer assembly
#99Structure for fixing electric part for motor-driven compressor
#100HEAT DISSIPATION DEVICE AND FASTENER THEREOF
#101Semiconductor device
#102Cooling structure for an electronic component and electronic instrument
#103Fixing mechanism for fixing a thermal module on a base and related electronic device
#104Fixing device and heat sink assembly using the same
#105Heat dissipation device
#106Fastener and heat dissipation device using the same
#107HEAT DISSIPATION DEVICE
#108Package for an integrated circuit
#109Top actuated, force limiting heatsink retention system
#110Fastener and electronic device having the same
#111Heat sink assembly with temperature display
#112Vapor chamber heat sink with cross member and protruding boss
#113Heat dissipation assembly with pivotable deflecting plate
#114Power semiconductor module including substrates spaced from each other
#115Heat sink and method for manufacturing the same
#116Fastener and heat sink assembly having the same
#117FAN ASSEMBLY AND HEAT DISSIPATION DEVICE HAVING THE SAME
#118Adjustable retention load plate of electrical connector assembly
#119Heat sink mount for providing non-rigid support of overhanging portions of heat sink
#120HEAT DISSIPATION DEVICE HAVING A FAN HOLDER FOR ATTACHMENT OF A FAN
#121Heat-dissipated fastener and elastic frame thereof
#122Fixture for semiconductor device and assembly of semiconductor device
#123CLIP AND HEAT SINK ASSEMBLY HAVING THE SAME
#124Electronic device with circuit board support
#125Electronic package with a thermal interposer and method of manufacturing the same
#126Mounting structure with heat sink for electronic component and female securing member for same
#127Package for an integrated circuit
#128Printed circuit board unit and semiconductor package
#129Strain reduction fixing structure
#130Fastening device for thermal module
#131HEAT DISSIPATION DEVICE AND METHOD FOR MOUNTING THE SAME
#132SUPPORT DEVICE AND ELECTRONIC DEVICE USING SAME
#133THERMALLY BALANCED HEAT SINKS
#134Heat radiating component
#135Heat dissipation device with base having fasteners
#136Heat dissipation device
#137Heat sink
#138Mounting device for mounting heat sink onto electronic component
#139Heat-dissipating module
#140Electronic device package with connection terminals including uneven contact surfaces
#141Modular heat sink assembly comprising a larger main heat sink member thermally connected to smaller additional floating heat sink members
#142Clamp for electrical devices
#143HEAT DISSIPATING DEVICE AND HEAT SINK FASTENER
#144METHOD FOR POWER SEMICONDUCTOR MODULE FABRICATION, ITS APPARATUS, POWER SEMICONDUCTOR MODULE AND ITS JUNCTION METHOD
#145Electrical connector assembly with fastening element
#146Sandwiched organic LGA structure
#147Heat dissipation device having a back plate unit
#148Fixing Structure and Heat Dissipation Device
#149APPARATUS AND METHOD FOR ATTACHING HEATSINKS
#150Stacked heat-transfer interface structure
#151Fixing structure of fixing a thermal module
#152Thermal dissipating device
#153CPU Heat Sink Mounting Method And Apparatus
#154HOLDING BASE FOR A RADIATOR ASSEMBLY
#155Fastener for heat sinks
#156Holding device for a heat sink
#157Cooling assembly
#158Mounting a heat sink in thermal contact with an electronic component
#159Mounting a heat sink in thermal contact with an electronic component
#160Spring loaded heat sink retention mechanism
#161Support device for heat dissipation module
#162Retention module for a heat sink
#163Mounting structure with heat sink for electronic component and female securing member for same
#164Easily disassembling cooling apparatus
#165Resilient fastener and thermal module incorporating the same
#166Lidless semiconductor cooling
#167Heatsink assembly structure
#168Heatsink assembly structure
#169Electronic assembly cooling
#170Easily disassembling cooling apparatus
#171HEAT DISSIPATION ASSEMBLY
#172HEAT DISSIPATION DEVICE WITH HEAT PIPES
#173High-load even pressure heatsink loading for low-profile blade computer applications
#174Sub-assembly
#175System and method for cooling a module
#176Boost spring holder for securing a power device to a heatsink
#177Heat sink fixing assembly
#178Heat dissipation device assembly
#179Heat sink assembly
#180HEAT DISSIPATION DEVICE WITH A HEAT PIPE
#181THERMAL MANAGEMENT MODULE AND ELECTRONIC ASSEMBLY USING THE SAME
#182Shape memory based mechanical enabling mechanism
#183Fastening element for heat dissipating apparatus
#184Package unit
#185Heat radiation device for memory module
#186HEAT DISSIPATION MODULE
#187HEAT SINK BACK PLATE MODULE
#188Integrated heat sink
#189CONTACT LOAD PROFILE MODIFICATION FOR A COMPRESSION SOCKETED CPU
#190Semiconductor circuit arrangement
#191Heat conduction device
#192Heat-dissipating device having air-guiding structure
#193FASTENING DEVICE FOR MOUNTING A THERMAL MODULE TO AN ELECTRONIC COMPONENT
#194Non-influencing fastener for mounting a heat sink in contact with an electronic component
#195Semiconductor device
#196System and method for cooling a module
#197Heatsink module of heat-generating electronic elements on circuit board
#198Heat dissipating structure
#199Fixing means for heat dissipater
#200Gimballed attachment for multiple heat exchangers
#201Sub-assembly
#202Structure for air conduction in radiator device
#203Apparatus for supporting a heatsink
#204Mounting apparatus for securing heat dissipation module to circuit board
#205Heat sink
#206Heat sink
#207Fan duct
#208HEAT DISSIPATION DEVICE
#209Mounting a heat sink in thermal contact with an electronic component
#210Electronic system
#211Single unit heat sink, voltage regulator, and package solution for an integrated circuit
#212Fixing device for a radiator
#213Modular heat sink assembly
#214Electronic device package heat sink assembly
#215Heat dissipation device with heat pipes
#216Package for an integrated circuit
#217Heat dissipation device
#218Coolant cooled type semiconductor device
#219Heat dissipation apparatus with second degree curve shape heat pipe
#220Method and structure to provide balanced mechanical loading of devices in compressively loaded environments
#221Heatsink module for electronic device
#222Circuit board assembly with a brace surrounding a ball-grid array device
#223Heat dissipation device with a heat pipe
#224Electronic component package including heat spreading member
#225Spring adapted to hold electronic device in a frame
#226Electronic system and method
#227Coolant cooled type semiconductor device
#228Thermal management apparatus
#229Heat dissipating device
#230Electronic part-mounted substrate, thermal conductive member for electronic part-mounted substrate and liquid-jetting head
#231Auxiliary supporting structure of circuit board and assembling method for the same
#232Structure for controlled shock and vibration of electrical interconnects
#233Assemblies for mounting electronic devices and associated heat sinks to computer modules and other structures
#234Memory metal springs for heatsink attachments
#235Heat sink attachment
#236Heat sink assembly
#237Electronic module assembly
#238Retaining heat sinks on printed circuit boards
#239System and method for self-leveling heat sink for multiple height devices
#240Electric circuit module
#241Integrated heat sink assembly
#242Heat radiation device for memory module
#243Apparatus and method for coupling a thermal dissipation device to an electronic substrate
#244Coolant cooled type semiconductor device
#245Apparatus, system, and method for dynamic compensation of heatsink-clamping mechanisms
#246Apparatus, system, and method for mitigating electromagnetic radiation leaks in double-decker heatsinks