206981 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof; Preparing wafers; Preparing bulk and homogeneous wafers Multistep processes
Sub-classes:METHOD OF SUPPLYING CHEMICAL LIQUID
#2HYBRID SEMICONDUCTOR WAFER AND METHOD OF FORMING
#3PROFILE CONTROL IN FORMING EPITAXY REGIONS FOR TRANSISTORS
#4METHOD OF MANUFACTURING COMPOUND SEMICONDUCTOR BONDED SUBSTRATE AND COMPOUND SEMICONDUCTOR BONDED SUBSTRATE
#5Method of manufacturing semiconductor structure
#6BONDED WAFER PROCESSING METHOD
#7WAFER FOR THE CVD GROWTH OF UNIFORM GRAPHENE AND METHOD OF MANUFACTURE THEREOF
#8METHOD FOR PREPARING THE RESIDUE OF A DONOR SUBSTRATE, A LAYER OF WHICH HAS BEEN REMOVED BY DELAMINATION
#9METHOD OF FORMING GRAPHENE ON A SILICON SUBSTRATE
#10MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER
#11MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER
#12Electronic substrate having differential coaxial vias
#13METHOD OF SUPPLYING CHEMICAL LIQUID
#14Profile control in forming epitaxy regions for transistors
#15METHOD FOR MANUFACTURING A CARRIER SUBSTRATE ON A SEMICONDUCTOR WAFER AND DEVICE INCLUDING A SEMICONDUCTOR WAFER
#16AUTOMATED OVERLAY REMOVAL DURING WAFER SINGULATION
#17Method for preparing a self-supporting substrate from a film base structure comprising a first substrate layer, a first film layer, and a second substrate layer
#18N-TYPE DOPED GERMANIUM MONOCRYSTALS AND WAFERS DERIVED THEREFROM
#19SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#20METHOD AND SYSTEM FOR FORMING MATERIAL WITHIN A GAP
#21METHOD AND SYSTEM FOR FORMING MATERIAL WITHIN A GAP USING MELTABLE MATERIAL
#22Manufacturing method for semiconductor silicon wafer
#23Epitaxial growth apparatus and method of producing epitaxial wafer
#24EPITAXIAL WAFER AND METHOD OF FABRICATING THE SAME, AND ELECTROCHEMICAL SENSOR
#25Apparatus and method for manufacturing a wafer
#26SiC SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFOR
#27Method of forming graphene on a silicon substrate
#28Method of manufacturing semiconductor structure
#29GAN SUBSTRATE WAFER AND PRODUCTION METHOD FOR SAME
#30GaN substrate wafer and method for manufacturing same
#31Bonding wafer structure and method of manufacturing the same
#32Semiconductor structure and manufacturing method thereof
#33Electronic substrate having differential coaxial vias
#34Method for manufacturing gallium nitride semiconductor device
#35Chemical liquid supplying system and method of supplying chemical liquid
#36Stacking structure applicable to manufacturing circuit board
#37Semiconductor wafers and semiconductor devices with barrier layer and methods of manufacturing
#38Semiconductor device and manufacturing method thereof
#39Device manufacturing method
#40Semiconductor stack
#41Semiconductor device and method for manufacturing the same
#42Apparatus and method for manufacturing a wafer
#43Method of forming memory device
#44Memory device and method for forming the same
#45Bonded wafer, a method of manufacturing the same, and a method of forming through hole
#46Semiconductor substrate processing method
#47Etching using chamber with top plate formed of non-oxygen containing material
#48Indium phosphide substrate, method of inspecting indium phosphide substrate, and method of producing indium phosphide substrate
#49Elbow contact for field-effect transistor and manufacture thereof
#50Semiconductor device and manufacturing method therefor
#51Compound semiconductor laminate substrate, method for manufacturing same, and semiconductor element
#52Semiconductor stack
#53Light assisted platelet formation facilitating layer transfer from a semiconductor donor substrate
#54Method for manufacturing semiconductor device
#55Memory device and fabrication thereof
#56Electronic substrate having differential coaxial vias
#57Elbow contact for field-effect transistor and manufacture thereof
#58Structure light module using vertical cavity surface emitting laser array
#59Semiconductor device and manufacturing method thereof
#60NON-ELECTROSTATIC CHUCK HEATER
#61Semiconductor device and method for manufacturing the same
#62Methods, Apparatus and System for Dose Control for Semiconductor Wafer Processing
#63Method for manufacturing circuit board and stacking structure applied thereto
#64Systems and methods for wafer map analysis
#65LAMINATE PRODUCTION METHOD, SUBSTRATE PROCESSING METHOD, AND LAMINATE
#66Semiconductor stack
#67Silicon carbide substrate and method for manufacturing the same
#68Method for producing bonded SOI wafer
#69Semiconductor device and method for manufacturing same
#70Electronic device using group III nitride semiconductor and its fabrication method
#71Display device with a plurality of insulating layers between two electrodes and method of manufacturing the same
#72Etching using chamber with top plate formed of non-oxygen containing material
#73Semiconductor device and manufacturing method therefor
#74Semiconductor wafers and semiconductor devices with barrier layer and methods of manufacturing
#75Method of fabrication of a semiconductor element comprising a highly resistive substrate
#76Organic light emitting display device having bank with bankhole
#77Organic electroluminescent apparatus forming a microcavity
#78Ion beam etching
#79Indium phosphide substrate, method of inspecting indium phosphide substrate, and method of producing indium phosphide substrate
#80Method for manufacturing a bonded SOI wafer
#81Manufacturing method of monocrystalline silicon and monocrystalline silicon
#82Semiconductor fabrication method including non-uniform cover layer
#83LAMINATE PRODUCTION METHOD, SUBSTRATE PROCESSING METHOD, AND LAMINATE
#84Semiconductor device having a defined oxygen concentration
#85Semiconductor wafer and semiconductor device manufacturing method
#86Method for polishing semiconductor substrate
#87Schedule preparation method for substrate processing device and substrate processing device
#88Method of manufacturing semiconductor wafers and method of manufacturing a semiconductor device
#89Silicon carbide substrate, semiconductor device, and methods for manufacturing them
#90Multilayer substrate for semiconductor packaging
#91Single-crystal silicon carbide substrate, method for producing single-crystal silicon carbide substrate, and method for inspecting single-crystal silicon carbide substrate
#92Method for producing mirror-polished wafer
#93Method for manufacturing SiC wafer fit for integration with power device manufacturing technology
#94Adhesive resins for wafer bonding
#95Method for manufacturing a semiconductor wafer, and semiconductor device having a low concentration of interstitial oxygen
#96SiC ingot slicing method
#97Method for processing an oxygen containing semiconductor body
#98Silicon carbide substrate, semiconductor device, and methods for manufacturing them
#99Substrate, semiconductor device, and method of manufacturing the same
#100High-resistive silicon substrate with a reduced radio frequency loss for a radio-frequency integrated passive device
#101Silicon wafer and method for manufacturing the same
#102Substrate, semiconductor device, and method of manufacturing the same
#103Substrate, semiconductor device, and method of manufacturing the same
#104Wafer supporting structure and method for forming the same
#105Sapphire substrate flattening method
#106Flat SiC semiconductor substrate
#107Method and apparatus for wafer backgrinding and edge trimming on one machine
#108Method for manufacturing semiconductor wafer
#109Silicon carbide substrate, semiconductor device, and methods for manufacturing them
#110Diode cell modules
#111Method for trimming a structure obtained by the assembly of two plates
#112Substrate, semiconductor device, and method of manufacturing the same
#113Semiconductor device and method for manufacturing same
#114MANUFACTURING METHOD FOR SEMICONDUCTOR WAFER
#115Method for producing a semiconductor wafer
#116Wafer processing method, wafer polishing apparatus, and ingot slicing apparatus
#117Method for producing a semiconductor wafer
#118SILICON CARBIDE SINGLE CRYSTAL SUBSTRATE
#119Method for manufacturing semiconductor wafer
#120Method for evaluating oxide dielectric breakdown voltage of a silicon single crystal wafer
#121GaN single-crystal mass and method of its manufacture, and semiconductor device and method of its manufacture
#122METHOD FOR MANUFACTURING EPITAXIAL SILICON WAFER
#123Nitride semiconductor wafer and method of processing nitride semiconductor wafer
#124SILICON MATERIAL SURFACE ETCHING FOR LARGE GRAIN POLYSILICON THIN FILM DEPOSITION AND STRUCTURE
#125SILICON WAFER AND METHOD FOR PRODUCING THE SAME
#126Silicon wafer and method for producing the same
#127Method for producing a silicon substrate having modified surface properties and a silicon substrate of said type
#128WAFER MANUFACTURING METHOD AND WAFER OBTAINED THROUGH THE METHOD
#129METHOD OF PRODUCING SEMICONDUCTOR WAFER
#130Method for manufacturing nitride semiconductor self-supporting substrate and nitride semiconductor self-supporting substrate
#131METHOD FOR PRODUCING SEMICONDUCTOR WAFER
#132METHOD FOR PRODUCING SEMICONDUCTOR WAFER
#133Method for manufacturing a semiconductor wafer
#134METHOD FOR PRODUCING SEMICONDUCTOR WAFER
#135Epitaxially coated silicon wafer with 110 orientation and method for producing it
#136SEMICONDUCTOR WAFER
#137Nitride semiconductor wafer and method of processing nitride semiconductor wafer
#138P-type silicon wafer and method for heat-treating the same
#139Surface Grinding Method and Manufacturing Method for Semiconductor Wafer
#140Method for trimming a structure obtained by the assembly of two plates
#141Method for manufacturing epitaxial wafer
#142GaAs semiconductor substrate and fabrication method thereof
#143METHOD FOR MANUFACTURING SILICON WAFER
#144Method for manufacturing high flatness silicon wafer
#145Semiconductor Wafer Fabricating Method and Semiconductor Wafer Mirror Edge Polishing Method
#146Method for producing semiconductor wafer and semiconductor wafer
#147Manufacturing method of group III nitride substrate, group III nitride substrate, group III nitride substrate with epitaxial layer, manufacturing method of group III nitride substrate with epitaxial layer, and manufacturing method of group III nitride device
#148Method for Producing Silicon Wafer and Silicon Wafer
#149Inspection method of compound semiconductor substrate, compound semiconductor substrate, surface treatment method of compound semiconductor substrate, and method of producing compound semiconductor crystal
#150Etching Liquid for Controlling Silicon Wafer Surface Shape
#151Self-standing GaN single crystal substrate, method of making same, and method of making a nitride semiconductor device
#152Epitaxial wafer and method for producing same
#153Production method for semiconductor wafer
#154Semiconductor substrate, method for fabricating the same, and method for fabricating semiconductor device
#155Method of processing silicon wafer
#156Etching liquid for controlling silicon wafer surface shape and method for manufacturing silicon wafer using the same
#157Silicon semiconductor substrate and its manufacturing method
#158P-type silicon wafer and method for heat-treating the same
#159Method for manufacturing SOI wafer
#160Method of manufacturing a wafer
#161Nitride semiconductor wafer and method of processing nitride semiconductor wafer
#162Semiconductor wafer manufacturing method and wafer
#163Longitudinal silicon ingot slicing machine and jig fixture
#164LDMOS FinFET structures with trench isolation in the drain extension
#165Package structure and method of fabricating the same
#166Method for forming semiconductor structure
#167Method for fabricating handling wafer
#168Integrated circuit dies having alignment marks and methods of forming same