206982 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof; Preparing wafers; Preparing bulk and homogeneous wafers; Multistep processes Specific process step
Sub-classes:SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING, METHOD OF PREPARING SAME, AND CHEMICAL MECHANICAL POLISHING METHOD OF WAFER
#2Selective Dielectric Capping for Hybrid Bonding
#3SUBSTRATE HOLDING APPARATUS, SUBSTRATE SUCTION DETERMINATION METHOD, SUBSTRATE POLISHING APPARATUS, SUBSTRATE POLISHING METHOD, METHOD OF REMOVING LIQUID FROM UPPER SURFACE OF WAFER TO BE POLISHED, ELASTIC FILM FOR PRESSING WAFER AGAINST POLISHING PAD, SUBSTRATE RELEASE METHOD, AND CONSTANT AMOUNT GAS SUPPLY APPARATUS
#4POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND POLISHING METHOD OF SUBSTRATE USING THE SAME
#5SUBSTRATE CARRIER DETERIORATION DETECTION AND REPAIR
#6METHOD OF WAFER BONDING
#7APPARATUS AND METHOD FOR SEPARATING WAFER SLICES
#8METHOD OF MANUFACTURING SEMICONDUCTOR WAFERS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
#9METHOD OF MANUFACTURING SILICON WAFERS
#10PROCESSING METHOD
#11METHOD FOR PRODUCING SEMICONDUCTOR WAFERS USING A WIRE SAW, WIRE SAW, AND SEMICONDUCTOR WAFERS MADE OF MONOCRYSTALLINE SILICON
#12METHOD FOR CONTROLLING IMPLANTING TOOL
#13SEMICONDUCTOR WAFER PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT
#14System with substrate carrier deterioration detection and repair
#15METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#16Processing method of wafer
#17Method of separating wafer
#18Carbon-doped silicon single crystal wafer and method for manufacturing the same
#19Film for component manufacture and component manufacturing method
#20SEMICONDUCTOR SUBSTRATE POLISHING METHOD
#21Apparatus for cleaning semiconductor silicon wafer and method for cleaning semiconductor silicon wafer
#22Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline silicon
#23Wafer process, apparatus and method of manufacturing an article
#24Substrate holding apparatus, substrate suction determination method, substrate polishing apparatus, substrate polishing method, method of removing liquid from upper surface of wafer to be polished, elastic film for pressing wafer against polishing pad, substrate release method, and constant amount gas supply apparatus
#25Wafer process, apparatus and method of manufacturing an article
#26Substrate carrier deterioration detection and repair
#27Robot apparatus including dual end effectors with variable pitch and methods
#28Semiconductor wafers and semiconductor devices with barrier layer and methods of manufacturing
#29Negative capacitance FET with improved reliability performance
#30Semiconductor surface smoothing and semiconductor arrangement
#31Surface oxidation method for wafer
#32Packaging method, panel assembly, wafer package and chip package
#33Packaging method, panel assembly, wafer package and chip package
#34Substrate processing method and substrate processing apparatus
#35Semiconductor wafer manufacturing method and semiconductor device
#36Method for fabricating a semiconductor device
#37Method for selectively increasing silicon fin area for vertical field effect transistors
#38Substrate holding apparatus, substrate suction determination method, substrate polishing apparatus, substrate polishing method, method of removing liquid from upper surface of wafer to be polished, elastic film for pressing wafer against polishing pad, substrate release method, and constant amount gas supply apparatus
#39Methods and apparatuses for effluent monitoring for brush conditioning
#40Light assisted platelet formation facilitating layer transfer from a semiconductor donor substrate
#41Method of producing wafer and apparatus for producing wafer
#42Negative capacitance FET with improved reliability performance
#43Method for selectively increasing silicon fin area for vertical field effect transistors
#44Negative capacitance FET with improved reliability performance
#45Substrate carrier deterioration detection and repair
#46Film for component manufacture and component manufacturing method
#47Shaped silicon ingot using layer transfer
#48Methods and apparatuses for effluent monitoring for brush conditioning
#49Thin film and substrate-removed group III-nitride based devices and method
#50SEMICONDUCTOR INGOT INSPECTING METHOD AND APPARATUS, AND LASER PROCESSING APPARATUS
#51Combined wafer production method with a multi-component receiving layer
#52SiC wafer producing method using ultrasonic wave
#53Semiconductor wafers and semiconductor devices with barrier layer and methods of manufacturing
#54Wafer stacking to form a multi-wafer-bonded structure
#55WAFER STACKING TO FORM A MULTI-WAFER-BONDED STRUCTURE
#56VERTICAL WAFER BOAT
#57Cleaning apparatus and substrate processing apparatus
#58Semiconductor device having a defined oxygen concentration
#59Large aluminum nitride crystals with reduced defects and methods of making them
#60Method for estimating depth of latent scratches in SiC substrates
#61Method and device for slicing a shaped silicon ingot using layer transfer
#62Large aluminum nitride crystals with reduced defects and methods of making them
#63Method for manufacturing a semiconductor wafer, and semiconductor device having a low concentration of interstitial oxygen
#64Method for the production of a wafer with a carrier unit
#65SiC ingot slicing method
#66METHODS FOR CLEANING SEMICONDUCTOR SUBSTRATES
#67CIRCULAR POLISHING PAD
#68Group III nitride wafers and fabrication method and testing method
#69Group III nitride wafers and fabrication method and testing method
#70Substrate, semiconductor device, and method of manufacturing the same
#71Method of making wafer assembly
#72Processing gas generating apparatus, processing gas generating method, substrate processing method, and storage medium
#73Silicon wafer with a plurality of chip patterns
#74Electro-polishing and porosification
#75Substrate, semiconductor device, and method of manufacturing the same
#76Substrate, semiconductor device, and method of manufacturing the same
#77Method for filling recesses using pre-treatment with hydrocarbon-containing gas
#78Methods and apparatus for transfer of films among substrates
#79Methods and apparatus for transfer of films among substrates
#80Method and device for slicing a shaped silicon ingot using layer transfer
#81Semiconductor memory card
#82Semiconductor wafer and manufacturing method thereof
#83Semiconductor structure and method
#84Wafer assembly with carrier wafer
#85Thermal plate with planar thermal zones for semiconductor processing
#86Method of manufacturing semiconductor device
#87Method and apparatus for temporary bonding of ultra thin wafers
#88Defect capping method for reduced defect density epitaxial articles
#89Thermal plate with planar thermal zones for semiconductor processing
#90Substrate, semiconductor device, and method of manufacturing the same
#91Thermal treatment method of silicon wafer and silicon wafer
#92Isocyanurate compound for forming organic anti-reflective layer and composition including same
#93Method of cleaning and micro-etching semiconductor wafers
#94DEFECT CAPPING FOR REDUCED DEFECT DENSITY EPITAXIAL ARTICLES
#95Semiconductor device using a silicon wafer with a pattern arrangement
#96METHOD OF PROCESSING SILICON WAFER
#97Method for fabricating semicoductor wafers applicable to integrated circuit manufacture
#98Semiconductor device
#99Carrier Head Membrane
#100Large aluminum nitride crystals with reduced defects and methods of making them
#101WAFER PROCESSING METHOD AND WAFER PROCESSING APPARATUS
#102Package structure and method of fabricating the same