207010 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof; Cleaning product to be cleaned Cleaning of wafer backside
WAFER CLEANING METHOD AND APPARATUS
#2METAL-COMPOUND-REMOVING SOLVENT AND METHOD IN LITHOGRAPHY
#3SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING
#4WAFER BACKSIDE CLEANING METHOD
#5WAFER CLEANING SYSTEM
#6Single wafer-type wafer cleaning device and method for controlling surface roughness of wafer using same
#7Semiconductor Device and Method of Coating a Semiconductor Wafer with High Viscosity Liquid Photoresist Using N2 Purge
#8SEMICONDUCTOR WAFER CLEANING DEVICE, SEMICONDUCTOR WAFER CLEANING METHOD, AND METHOD FOR MANUFACTURING SILICON WAFER
#9PURGE SYSTEM TO CLEAN WAFER BACKSIDE FOR RING SUSCEPTOR
#10Substrate processing apparatus and substrate processing method
#11SEMICONDUCTOR FABRICATING SYSTEM HAVING HYBRID BRUSH ASSEMBLY
#12POLISHING APPARATUS
#13Substrate processing apparatus and substrate processing method
#14EPITAXIAL WAFER CLEANING METHOD
#15METHOD FOR MANUFACTURING WAFER HAVING FUNCTIONAL FILM
#16Wafer cleaning method
#17Metal-compound-removing solvent and method in lithography
#18Substrate cleaning method and substrate processing method
#19Semiconductor device and method of coating a semiconductor wafer with high viscosity liquid photoresist using N2 purge
#20Semiconductor fabricating system having hybrid brush assembly
#21Treatment Liquid for Semiconductor Wafers, Which Contains Hypochlorite Ions
#22COMPOSITION AND METHOD FOR TREATING SUBSTRATE
#23SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
#24PROCESS SOLUTION FOR POLYMER PROCESSING
#25Substrate processing method and substrate processing system
#26Semiconductor wafer and method of wafer thinning
#27Method for cleaning semiconductor wafer backside surface by hybrid brush assembly
#28Substrate cleaning device, substrate processing apparatus, substrate cleaning method and substrate processing method
#29Metal-compound-removing solvent and method in lithography
#30Treatment liquid for semiconductor wafers, which contains hypochlorite ions
#31Substrate processing apparatus, substrate processing method, and storage medium
#32Substrate processing device and substrate processing method for carrying out chemical treatment for substrate
#33Substrate processing apparatus and substrate processing method
#34Optimal exposure of a bottom surface of a substrate material and/or edges thereof for cleaning in a spin coating device
#35Optimal exposure of a bottom surface of a substrate material and/or edges thereof for cleaning in a spin coating device
#36Method of fabricating semiconductor device by removing material on back side of substrate
#37Self-aligned and robust IGBT devices
#38Semiconductor device having a back electrode including Au-Sb alloy layer and method of manufacturing the same
#39Wafer cleaning system and method
#40Substrate processing apparatus, and substrate processing method
#41Substrate warehouse, substrate processing system, and substrate inspection method
#42PERC solar cell capable of improving photoelectric conversion efficiency and preparation method thereof
#43WAFER CLEANING WITH DYNAMIC CONTACTS
#44Substrate processing apparatuses and substrate processing methods
#45Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method
#46Optimal exposure of a bottom surface of a substrate material and/or edges thereof for cleaning in a spin coating device
#47Method for manufacturing thin substrate
#48Substrate support with edge seal
#49Self-aligned and robust IGBT devices
#50Substrate cleaning device, substrate processing apparatus, substrate cleaning method and substrate processing method
#51Method and device for reducing contamination for reliable bond pads
#52Semiconductor device fabrication method and semiconductor device
#53Apparatus and method for processing a surface of a substrate
#54Polishing apparatus
#55Substrate processing apparatus and substrate processing method
#56Substrate processing apparatus, substrate processing method, and storage medium
#57Substrate processing method and substrate processing device
#58Semiconductor wafer and method of wafer thinning
#59Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method
#60Apparatus and method for cleaning a back surface of a substrate
#61SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD FOR CARRYING OUT CHEMICAL TREATMENT FOR SUBSTRATE
#62Substrate processing apparatus and substrate processing method
#63Method and apparatus for substrate processing
#64Substrate processing apparatus, substrate processing method and storage medium
#65Backside polisher with dry frontside design and method using the same
#66Semiconductor device fabrication method and semiconductor device
#67Manufacturing method of semiconductor device
#68Method for manufacturing ferroelectric thin film device
#69Metal-compound-removing solvent and method in lithography
#70Metal-compound-removing solvent and method in lithography
#71Manufacturing method of semiconductor device
#72Method for processing a semiconductor region and an electronic device
#73Cleaner composition and preparation of thin substrate
#74Method for Cleaning Wafer, and Chemical Used in Such Cleaning Method
#75Systems and Methods for In-Situ Wafer Edge and Backside Plasma Cleaning
#76Backside polisher with dry frontside design and method using the same
#77Polishing cleaning mechanism, substrate processing apparatus, and substrate processing method
#78APPARATUS AND METHOD FOR TREATING SUBSTRATES
#79Substrate cleaning device, substrate processing apparatus, substrate cleaning method and substrate processing method
#80Removing particulate contaminants from the backside of a wafer or reticle
#81MANUFACTURING APPARATUS FOR SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#82Wafer back-side polishing system and method for integrated circuit device manufacturing processes
#83Removal of particles on back side of wafer
#84Methods and apparatus for substrate edge cleaning
#85DEVICE AND METHOD FOR CLEANING BACKSIDE OR EDGE OF WAFER
#86Manufacturing method of semiconductor device
#87Method for fabricating semiconductor device
#88Apparatus and method for removing particles present on a wafer using photoelectrons and an electric field
#89Substrate cleaning method
#90Semiconductor device fabrication method and semiconductor device
#91Single-wafer-type cleaning apparatus
#92Wafer back-side polishing system and method for integrated circuit device manufacturing processes
#93Method of monitoring output intensity of laser beam in bevel etching apparatus
#94TANTALUM OXIDE FILM REMOVAL METHOD AND APPARATUS
#95Method of selectively depositing floating gate material in a memory device
#96Substrate processing method and substrate processing apparatus
#97Heat assisted handling of highly warped substrates post temporary bonding
#98Substrate cleaning method, substrate cleaning apparatus and vacuum processing system
#99Apparatus and process for wafer cleaning
#100Wafer cleaning system and method
#101Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method
#102Mechanisms for forming protection layer on back side of wafer
#103Method and apparatus for water edge exposure and backside cleaning
#104Systems and Methods for In-Situ Wafer Edge and Backside Plasma Cleaning
#105METHOD FOR TREATING WAFER
#106Electroplating and post-electrofill systems with integrated process edge imaging and metrology systems
#107Semiconductor wafer chuck and method
#108Rinse liquid for insulating film and method of rinsing insulating film
#109Method and equipment for removing photoresist residue after dry etch
#110Methods and apparatus for cleaning a substrate
#111Apparatus and method for edge bevel removal of copper from silicon wafers
#112Substrate cleaning method and substrate cleaning system
#113SUBSTRATE CLEANING APPARATUS, SUBSTRATE CLEANING METHOD, AND COMPUTER-READABLE STORAGE MEDIUM
#114Substrate processing device and substrate processing method for carrying out chemical treatment for substrate
#115Methods for minimizing edge peeling in the manufacturing of BSI chips
#116Superior stability of characteristics of transistors having an early formed high-K metal gate
#117Wafer backside defectivity clean-up utilizing selective removal of substrate material
#118METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
#119Methods for particle reduction in semiconductor processing
#120Semiconductor device production method and rinse
#121REMOVAL OF PARTICLES ON BACK SIDE OF WAFER
#122METHOD FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE AND DEVICE FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE
#123Wafer backside defectivity clean-up utilizing selective removal of substrate material
#124Wet etch and clean chemistries for MoO
#125Semiconductor fabrication apparatuses to perform semiconductor etching and deposition processes and methods of forming semiconductor device using the same
#126METHOD OF PRODUCING EPITAXIAL SILICON WAFER
#127Liquid processing method, recording medium having recorded program for executing liquid processing method therein and liquid processing apparatus
#128CLEANING APPARATUS AND CLEANING METHOD
#129SEMICONDUCTOR WET ETCHANT AND METHOD OF FORMING INTERCONNECTION STRUCTURE USING THE SAME
#130SUBSTRATE PROCESSING SYSTEM, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM
#131Configurable bevel etcher
#132Method of reducing contamination by providing a removable polymer protection film during microstructure processing
#133Etching and cleaning methods and etching and cleaning apparatuses used therefor
#134Polymer removing apparatus and method
#135Method for manufacturing semiconductor device
#136SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANING APPARATUS
#137Semiconductor device, method of manufacturing the same, and silane coupling agent
#138METHOD FOR THE FABRICATION OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
#139Bevel plasma treatment to enhance wet edge clean
#140Chemical-liquid processing apparatus and chemical-liquid processing method
#141Cross-contamination control for semiconductor process flows having metal comprising gate electrodes
#142METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
#143Cleaning method of semiconductor wafer
#144Process for manufacturing semiconductor integrated circuit device
#145Backside nitride removal to reduce streak defects
#146ETCHING SOLUTION AND ETCHING METHOD
#147Substrate cleaning method, substrate cleaning apparatus, substrate processing system, substrate cleaning program and storage medium
#148Apparatus for plasma processing and method for plasma processing
#149Apparatus and method for edge bevel removal of copper from silicon wafers
#150APPARATUS AND METHOD FOR ETCHING SEMICONDUCTOR WAFER
#151METHOD AND APPARATUS FOR REMOVING POLYMER FROM A SUBSTRATE
#152METHOD OF SUBSTRATE POLYMER REMOVAL
#153METHOD AND APPARATUS FOR REMOVING POLYMER FROM A SUBSTRATE
#154Method of manufacturing semiconductor wafer
#155System and Method For Removing Edge-Bead Material
#156Method and apparatus for removing polymer from the wafer backside and edge
#157Bevel/backside polymer removing method and device, substrate processing apparatus and storage medium
#158Cleaning apparatus and cleaning method
#159Semiconductor wet etchant and method of forming interconnection structure using the same
#160Process for manufacturing semiconductor integrated circuit device
#161Semiconductor fabrication apparatuses to perform semiconductor etching and deposition processes and methods of forming semiconductor device using the same
#162High yield plasma etch process for interlayer dielectrics
#163Removal of process residues on the backside of a substrate
#164SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#165Configurable bevel etcher
#166Bevel etcher with gap control
#167Process for wafer backside polymer removal and wafer front side photoresist removal
#168PROCESS FOR WAFER BACKSIDE POLYMER REMOVAL WITH WAFER FRONT SIDE GAS PURGE
#169Substrate cleaning apparatus, substrate cleaning method, and computer-readable storage medium
#170METHOD AND APPARATUS FOR WAFER EDGE PROCESSING
#171SUBSTRATE PROCESSING SYSTEM, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM
#172Substrate processing apparatus and substrate processing method
#173Blanket resist to protect active side of semiconductor
#174Removing solution, cleaning method for semiconductor substrate, and process for production of semiconductor device
#175Method of reducing contamination by providing a removable polymer protection film during microstructure processing
#176Substrate polishing apparatus and substrate polishing method
#177Plasma dielectric etch process including ex-situ backside polymer removal for low-dielectric constant material
#178Plasma dielectric etch process including in-situ backside polymer removal for low-dielectric constant material
#179Method of manufacturing semiconductor device
#180Apparatus and methods for selective removal of material from wafer alignment marks
#181Method for manufacturing a semiconductor wafer
#182Substrate processing method and apparatus using a combustion flame
#183Semiconductor process for preventing layer peeling in wafer edge area and method for manufacturing interconnects
#184Method of cleaning a wafer
#185Methods of fabricating a semiconductor substrate for reducing wafer warpage
#186Substrate processing apparatus and substrate processing method
#187Substrate processing apparatus and substrate processing method
#188Method for preventing edge peeling defect
#189Method for cleaning a semiconductor substrate
#190Process for manufacturing semiconductor integrated circuit device
#191Method of wafer processing with edge seed layer removal
#192Semiconductor processing methods
#193Non-contact discrete removal of substrate surface contaminants/coatings, and method, apparatus, and system for implementing the same
#194Substrate cleaning method, substrate cleaning apparatus, substrate processing system, substrate cleaning program and storage medium
#195Cleaning submicron structures on a semiconductor wafer surface
#196Method of and apparatus for manufacturing semiconductor device
#197Etching and cleaning methods and etching and cleaning apparatuses used therefor
#198Wet processing method and processing apparatus of substrate
#199Composition and a method for defect reduction
#200Tungsten metal removing solution and method for removing tungsten metal by use thereof
#201Method and apparatus for fabricating semiconductor device
#202Wafer processing method and wafer processing apparatus
#203Method for preventing edge peeling defect
#204Substrate processing method
#205Method of plating a metal or metal compound on a semiconductor substrate that includes using the same main component in both plating and etching solutions
#206Plating apparatus and plating method