ClassID:

207007

H01L21/02082 - CPC Classification

Classification description:

Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof; Cleaning product to be cleaned

Sub-classes:
Recent Application in this class:
#1
20250210341
2025-06-26

SUBSTRATE TREATING METHOD

#2
20250144677
2025-05-08

METHOD FOR CLEANING SUBSTRATE AND CLEANING DEVICE

#3
20240404843
2024-12-05

Ramped Spin-Dry on Semiconductor Wafer

#4
20230339843
2023-10-26

Composition for removing polymer

#5
20230260780
2023-08-17

METHOD FOR CLEANING SUBSTRATE AND CLEANING DEVICE

#6
20230260779
2023-08-17

Methods for stripping and cleaning semiconductor structures

#7
20230101770
2023-03-30

CARRIER BOAT FOR DIE PACKAGE FLUX CLEANING

#8
20220250285
2022-08-11

Cleaning sheet, manufacturing method of semiconductor device and manufacturing method of cleaning sheet

#9
20220139758
2022-05-05

Multi-wafer deposition tool for reducing residual deposition on transfer blades and methods of operating the same

#10
20210300860
2021-09-30

Composition for removing polymer

#11
20210166956
2021-06-03

CLEANING DEVICE

#12
20210134590
2021-05-06

Substrate processing apparatus and substrate processing method

#13
20210066064
2021-03-04

METHODS AND APPARATUS FOR CLEANING METAL CONTACTS

#14
20210005446
2021-01-07

System and method of cleaning mesa sidewalls of a template

#15
20200385861
2020-12-10

Method for cleaning quartz epitaxial chambers

#16
20200321212
2020-10-08

Method for cleaning substrate and cleaning device

#17
20200130025
2020-04-30

Substrate processing method and substrate processing apparatus

#18
20200118810
2020-04-16

LAMINAR FLOW DEVICE

#19
20200075782
2020-03-05

PERC solar cell capable of improving photoelectric conversion efficiency and preparation method thereof

#20
20200033740
2020-01-30

Pellicle adhesive residue removal system and methods

#21
20190333758
2019-10-31

Method of manufacturing semiconductor device by etching and washing

#22
20190198314
2019-06-27

Method for removing organic cured film on substrate, and acidic cleaning liquid

#23
20190172732
2019-06-06

Determination method and substrate processing equipment

#24
20190148182
2019-05-16

Cleaning apparatus and cleaning method of substrate processing apparatus

#25
20190051540
2019-02-14

SYSTEMS AND METHODS FOR PLASMA-LESS DE-HALOGENATION

#26
20180090332
2018-03-29

Substrate processing device which performs processing on substrate

#27
20180044816
2018-02-15

Method of growing high quality, thick SiC epitaxial films by eliminating silicon gas phase nucleation and suppressing parasitic deposition

#28
20180019119
2018-01-18

Drying high aspect ratio features

#29
20170316934
2017-11-02

Method for processing a semiconductor region and an electronic device

#30
20170162382
2017-06-08

Sealing composition and method of manufacturing semiconductor device

#31
20170032958
2017-02-02

Method for Cleaning Hermetic Semiconductor Packages

#32
20170018424
2017-01-19

Method for cleaning lanthanum gallium silicate wafer

#33
20160365371
2016-12-15

UV cleaning device of glass substrate

#34
20160214148
2016-07-28

Substrate processing method

#35
20160181087
2016-06-23

Particle removal with minimal etching of silicon-germanium

#36
20160148802
2016-05-26

Liquid chemical for forming protecting film

#37
20160096206
2016-04-07

Systems and methods for treating substrates with cryogenic fluid mixtures

#38
20160089685
2016-03-31

Substrate processing method and substrate processing apparatus

#39
20160086829
2016-03-24

Systems and methods for drying high aspect ratio structures without collapse using stimuli-responsive sacrificial bracing material

#40
20160016206
2016-01-21

Method of cleaning substrate processing apparatus

#41
20150357180
2015-12-10

METHODS FOR CLEANING SEMICONDUCTOR SUBSTRATES

#42
20150129897
2015-05-14

Pretreatment method for reduction and/or elimination of basal plane dislocations close to epilayer/substrate interface in growth of SiC epitaxial films

#43
20150128850
2015-05-14

Pretreatment method for reduction and/or elimination of basal plane dislocations close to epilayer/substrate interface in growth of SiC epitaxial films

#44
20150054142
2015-02-26

Wafer surface conditioning for stability in fab environment

#45
20140373384
2014-12-25

Method of collapse-free drying of high aspect ratio structures

#46
20140338588
2014-11-20

Method of growing high quality, thick SiC epitaxial films by eliminating silicon gas phase nucleation and suppressing parasitic deposition

#47
20140315367
2014-10-23

Rinse liquid for insulating film and method of rinsing insulating film

#48
20140107008
2014-04-17

Cleaning composition and cleaning method using the same

#49
20140060573
2014-03-06

SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS

#50
20130269126
2013-10-17

Apparatus and method for inspecting defect in object surface

#51
20130143396
2013-06-06

Pretreatment method for reduction and/or elimination of basal plane dislocations close to epilayer/substrate interface in growth of SiC epitaxial films

#52
20120273011
2012-11-01

Method of cleaning substrate processing apparatus

#53
20120017934
2012-01-26

Liquid chemical for forming protecting film

#54
20090261362
2009-10-22

4H-POLYTYPE GALLIUM NITRIDE-BASED SEMICONDUCTOR DEVICE ON A 4H-POLYTYPE SUBSTRATE

#55
20090250431
2009-10-08

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

#56
20090103079
2009-04-23

Apparatus and method for inspecting defect on object surface

#57
20080207002
2008-08-28

Method of removing graphitic and/or fluorinated organic layers from the surface of a chip passivation layer having Si-containing compounds

#58
20070072431
2007-03-29

Method for cleaning substrate having exposed silicon and silicon germanium layers and related method for fabricating semiconductor device

#59
20050218414
2005-10-06

4H-polytype gallium nitride-based semiconductor device on a 4H-polytype substrate

#60
20050173067
2005-08-11

Plasma etching chamber and plasma etching system using same