207035 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof; Forming layers; Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
Sub-classes:MICROELECTRONIC DEVICES COMPRISING A BORON-CONTAINING MATERIAL
#2METHOD OF MANUFACTURING ISOLATION STRUCTURE
#3SEAM-TOP SEAL FOR DIELECTRICS
#4SEMICONDUCTOR DEVICE WITH CONDUCTORS DISPOSED IN INSULATING FILMS AND METHOD FOR MANUFACTURING THE SAME
#5HARD MASK PROTECTION OF METAL INTERCONNECTS
#6SOI SUBSTRATE AND RELATED METHODS
#7SOI SUBSTRATE AND RELATED METHODS
#8METHODS FOR SEPARATING SEMICONDUCTOR DEVICES USING SINGULATION GROOVES, AND DEVICES RESULTING FROM SUCH METHODS
#9HEATING PLATFORM, THERMAL TREATMENT AND MANUFACTURING METHOD
#10Methods of Forming Material Within Openings Extending into a Semiconductor Construction, and Semiconductor Constructions Having Fluorocarbon Material
#11METHOD OF GLASS DEPOSITION FOR SEMICONDUCTOR DEVICE FABRICATION
#12SEMICONDUCTOR DEVICE AND RELATED FABRICATION METHOD
#13SOI substrate and related methods
#14SEMICONDUCTOR CLEANING USING PLASMA-FREE PRECURSORS
#15SELF-ALIGNMENT LAYER WITH LOW-K MATERIAL PROXIMATE TO VIAS
#16NON-PLANAR METAL-INSULATOR-METAL STRUCTURE
#17Patterning Method Using Secondary Resist Surface Functionalization for Mask Formation
#18SEMICONDUCTOR DEVICE
#19SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
#20SEAM-TOP SEAL FOR DIELECTRICS
#21MICROELECTRONIC DEVICES COMPRISING A BORON-CONTAINING MATERIAL, AND RELATED ELECTRONIC SYSTEMS AND METHODS
#22HYBRID PATTERNING-BONDING SEMICONDUCTOR TOOL
#23WAFER SHAPE CONTROL FOR W2W BONDING
#24METHODS OF MANUFACTURING INTEGRATED CIRCUIT DEVICES USING CARBONYL COMPOUNDS
#25SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#26EXTERNAL SUBSTRATE SYSTEM ROTATION IN A SEMICONDUCTOR PROCESSING SYSTEM
#27SOI substrate and related methods
#28THERMOREFLECTANCE ENHANCEMENT COATINGS AND METHODS OF MAKING AND USE THEREOF
#29Semiconductor device cavity formation using directional deposition
#30Method of manufacturing semiconductor device
#31Heating platform, thermal treatment and manufacturing method
#32Methods of forming material within openings extending into a semiconductor construction, and semiconductor constructions having fluorocarbon material
#33Semiconductor device, manufacturing method thereof, and display device including the semiconductor device
#34Silicon-on-insulator (SOI) substrate and related methods
#35SOI substrate and related methods
#36SUBSTRATE SUPPORT PEDESTAL
#37Stress compensation for wafer to wafer bonding
#38Manufacturing method of organic light-emitting display and mask assembly
#39Semiconductor device and method of manufacturing the same
#40Trenched bottom electrode and liftoff based molecular devices
#41SELF-ALIGNED FINGER METAL-OXIDE-METAL (FMOM) AND METHOD OF MAKING THE SAME
#42External substrate system rotation in a semiconductor processing system
#43Interconnects with variable space mandrel cuts formed by block patterning
#44Memory device and manufacturing method thereof
#45SOI substrate and related methods
#46Differential type sensing circuit with differential input and output terminal pair
#47Platform and method of operating for integrated end-to-end area-selective deposition process
#48Platform and method of operating for integrated end-to-end area-selective deposition process
#49Schemes for selective deposition for patterning applications
#50Stretchable film assembly with conductive traces
#51Increased-transparency photovoltaic device
#52Semiconductor device and manufacture method of the same
#53Semiconductor processing method
#54Sensing device for sensing minor charge variations
#55Heating platform, thermal treatment and manufacturing method
#56Semiconductor device and method for forming the same
#57Threshold voltage tuning for fin-based integrated circuit device
#58Semiconductor device, manufacturing method thereof, and display device including the semiconductor device
#59Method of manufacturing a semiconductor device
#60Protection of low temperature isolation fill
#61Protection of low temperature isolation fill
#62Pattern fidelity enhancement
#63Photoelectric conversion element and photodetector
#64Semiconductor constructions having fluorocarbon material
#65Semiconductor device structures
#66Schemes for selective deposition for patterning applications
#67Method and apparatus for depositing a monolayer on a three dimensional structure
#68Lithography method with surface modification layer
#69Manufacturing method for insulation layer, manufacturing method for array substrate and array substrate
#70METHODS FOR FORMING STRUCTURES BY GENERATION OF ISOLATED GRAPHENE LAYERS HAVING A REDUCED DIMENSION
#71Semiconductor device structures
#72Method of fabricating semiconductor structure with self-aligned spacers
#73Thin film transistor and manufacturing method thereof, array substrate and manufacturing method thereof, and display device
#74Method and structure to fabricate closely packed hybrid nanowires at scaled pitch
#75Oxide dielectric and method for manufacturing same, and solid state electronic device and method for manufacturing same
#76Semiconductor fuses with nanowire fuse links and fabrication methods thereof
#77Substrate processing apparatus
#78SELECTIVE SILICON DIOXIDE DEPOSITION USING PHOSPHONIC ACID SELF ASSEMBLED MONOLAYERS AS NUCLEATION INHIBITOR
#79Semiconductor device and method for forming the same
#80Three-dimensional scatterometry for measuring dielectric thickness
#81Method and structure to fabricate closely packed hybrid nanowires at scaled pitch
#82Method and structure to fabricate closely packed hybrid nanowires at scaled pitch
#83Semiconductor structure with self-aligned spacers and method of fabricating the same
#84Method for selectively depositing a layer on a three dimensional structure
#85External substrate rotation in a semiconductor processing system
#86Semiconductor device structures
#87Method for forming semiconductor device structure
#88Semiconductor fuses with nanowire fuse links and fabrication methods thereof
#89Apparatuses and methods for depositing SiC/SiCN films via cross-metathesis reactions with organometallic co-reactants
#90Metal-insulator-metal structure and method for forming the same
#91Integrated semiconductor device and method for fabricating the same
#92Method of semiconductor integrated circuit fabrication
#93Method for manufacturing magnetoresistive element
#94Method for selectively depositing a layer on a three dimensional structure
#95High efficiency apparatus and method for depositing a layer on a three dimensional structure
#96Methods of forming openings in semiconductor structures
#97Methods for fabricating refined graphite-based structures and devices made therefrom
#98High-quality GaN high-voltage HFETs on silicon
#99Segmented graphene growth on surfaces of a patterned substrate layer and devices thereof
#100Method for manufacturing thin-film transistor array substrate
#101Apparatuses and methods for depositing SiC/SiCN films via cross-metathesis reactions with organometallic co-reactants
#102Structures having isolated graphene layers with a reduced dimension
#103Hydrogen-free amorphous dielectric insulating thin films with no tunneling states
#104Layer deposition on III-V semiconductors
#105MOS transistor having a gate dielectric with multiple thicknesses
#106Method of semiconductor integrated circuit fabrication
#107Semiconductor device and method of fabricating the same
#108Insulation of micro structures
#109High quality GaN high-voltage HFETs on silicon
#110In-situ hardmask generation
#111Thin film deposition apparatus and method of forming thin film using the same
#112HYDROGEN-PLASMA PROCESS FOR SURFACE PREPARATION PRIOR TO INSULATOR DEPOSITION ON COMPOUND SEMICONDUCTOR MATERIALS
#113Adhesion layer to minimize dielectric constant increase with good adhesion strength in a PECVD process
#114Apparatuses and methods for depositing SiC/SiCN films via cross-metathesis reactions with organometallic co-reactants
#115Methods and Systems for Reducing Particles During Physical Vapor Deposition
#116Method of semiconducotr integrated circuit fabrication
#117Deposition method and deposition apparatus
#118Flowable carbon for semiconductor processing
#119Shallow heavily doped semiconductor layer by cyclic selective epitaxial deposition process
#120METHOD OF DEPOSITION OF Al2O3/SiO2 STACKS, FROM ALUMINIUM AND SILICON PRECURSORS
#121High quality GaN high-voltage HFETs on silicon
#122Method of forming boron-containing silicon oxycarbonitride film and method of forming silicon oxycarbonitride film
#123PRETREATMENT AND IMPROVED DIELECTRIC COVERAGE
#124Direct bonding process using a compressible porous layer
#125Production of electronic switching devices
#126High quality GaN high-voltage HFETS on silicon
#127Nanostructured electrodes and active polymer layers
#128Fluorine-based surface treating agent for vapor deposition and article finished with the surface treating agent by vapor deposition
#129Semiconductor structures with dual trench regions and methods of manufacturing the semiconductor structures
#130Densely-packed films of lanthanide oxide nanoparticles via electrophoretic deposition
#131Methods of forming particle-containing materials
#132Apparatus including column having hollow part filled with filler and solid film-formation material
#133Precursors for depositing silicon containing films
#134Methods of forming particle-containing materials
#135Semiconductor constructions comprising particle-containing materials
#136Metal structure with sidewall passivation and method
#137Ferroelectric/paraelectric multilayer thin film, method of forming the same, and high frequency variable device using the same
#138Methods of forming particle-containing materials
#139Formation of metal oxide layer