ClassID:

207046

H01L21/02318 - page 2 - CPC Classification

Classification description:

Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof; Forming layers; Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment

Recent Application in this class:
#301
20050245098
2005-11-03

Method and apparatus for selectively altering dielectric properties of localized semiconductor device regions

#302
20050239264
2005-10-27

Materials suitable for shallow trench isolation

#303
20050233598
2005-10-20

Method of fabricating high-k dielectric layer having reduced impurity

#304
20050200025
2005-09-15

Low-K dielectric material system for IC application

#305
20050199877
2005-09-15

Silicon germanium surface layer for high-k dielectric integration

#306
20050199187
2005-09-15

Heat treatment apparatus and substrate processing apparatus

#307
20050191860
2005-09-01

Method for forming semiconductor device

#308
20050181626
2005-08-18

Manufacture of semiconductor device having nitridized insulating film

#309
20050181619
2005-08-18

Method for forming metal oxide layer by nitric acid oxidation

#310
20050170663
2005-08-04

He treatment to improve low-k adhesion property

#311
20050170531
2005-08-04

Method for formation of an ultra-thin film and semiconductor device containing such a film

#312
20050159015
2005-07-21

Method for forming interlayer insulation film

#313
20050151211
2005-07-14

Semiconductor device, and method and apparatus for manufacturing the same

#314
20050136690
2005-06-23

Method for controlling defects in gate dielectrics

#315
20050130439
2005-06-16

Methods of forming spin-on-glass insulating layers in semiconductor devices and associated semiconductor device

#316
20050124121
2005-06-09

Anneal of high-k dielectric using NH3 and an oxidizer

#317
20050118769
2005-06-02

Method of forming sidewall spacer elements for a circuit element by increasing an etch selectivity

#318
20050064726
2005-03-24

Method of forming low-dielectrics using a rapid curing process

#319
20050026358
2005-02-03

Method for manufacturing semiconductor integrated circuit device

#320
20050009281
2005-01-13

Method of forming gates in semiconductor devices

#321
16352948
2021-11-09

Process for fabricating one or more ultra-large area nanoscale polymer films

#322
15725258
2018-10-16

Manufacturing method for forming a semiconductor structure

#323
15618000
2018-10-09

Graphene heat dissipating structure

#324
15615884
2018-11-06

Formation of metal oxide layer

#325
15091798
2017-07-11

Siloxanes, doped siloxanes, methods for their synthesis, compositions containing the same, and films formed therefrom

#326
15089257
2016-10-25

Methods for forming patterns in honeycomb array

#327
15073073
2017-06-20

Method of patterning a film layer

#328
15069936
2017-04-04

Method of forming patterns

#329
14662091
2017-08-01

Graphene heat dissipating structure

#330
14449421
2016-07-05

Method of manufacturing semiconductor device

#331
12210060
2015-06-09

Progressive UV cure