207072 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof; Forming layers; Forming inorganic semiconducting materials on a substrate; Intermediate layers between substrates and deposited layers; Materials Group 13/15 materials
METHOD FOR MANUFACTURING OPTOELECTRONIC DEVICES
#2Semiconductor substrate and method of manufacturing thereof
#3Method for manufacturing diamond substrate
#4METHOD FOR FLATTENING A SURFACE ON AN EPITAXIAL LATERAL GROWTH LAYER
#5Semiconductor substrate, semiconductor device, and method for forming semiconductor structure
#6High percentage silicon germanium graded buffer layers with lattice matched Ga(As-P) interlayers
#7Semiconductor structure comprising III-N material
#8Method of forming III-V on insulator structure on semiconductor substrate
#9III-V or II-VI compound semiconductor films on graphitic substrates
#10Method for printing wide bandgap semiconductor materials
#11Systems and methods of dislocation filtering for layer transfer
#12Single-crystal rare earth oxide grown on III-V compound
#13Fabrication of compound semiconductor structures
#14Method of forming III-V on insulator structure on semiconductor substrate
#15Nanostructured substrates for improved lift-off of III-V thin films
#16Buffer layers having composite structures
#17High-electron-mobility transistors with counter-doped dopant diffusion barrier
#18High-electron-mobility transistors with heterojunction dopant diffusion barrier
#19Pseudomorphic InGaAs on GaAs for gate-all-around transistors
#20Fabrication of compound semiconductor structures
#21Single-crystal rare earth oxide grown on III-V compound
#22Selective nanoscale growth of lattice mismatched materials
#23Buffer layers having composite structures
#24Method for removing native oxide and residue from a III-V group containing surface
#25Stress assisted wet and dry epitaxial lift off
#26Conversion of strain-inducing buffer to electrical insulator
#27Strained group IV channels
#28Compound finFET device including oxidized III-V fin isolator
#29III-V or II-VI compound semiconductor films on graphitic substrates
#30Method for forming group III/V conformal layers on silicon substrates
#31Utilization of angled trench for effective aspect ratio trapping of defects in strain-relaxed heteroepitaxy of semiconductor films
#32Type III-V and type IV semiconductor device formation
#33Method for reducing contact resistance in MOS
#34Method for removing native oxide and residue from a III-V group containing surface
#35Strained stacked nanosheet FETS and/or quantum well stacked nanosheet
#36Method for fabricating a semiconductor structure
#37Group III-V device with a selectively modified impurity concentration
#38GERMANIUM-CONTAINING SEMICONDUCTOR DEVICE AND METHOD OF FORMING
#39III-V semiconductor device having self-aligned contacts
#40Utilization of angled trench for effective aspect ratio trapping of defects in strain relaxed heteroepitaxy of semiconductor films
#41Hybrid III-V technology to support multiple supply voltages and off state currents on same chip
#42Multiple-threshold voltage devices and method of forming same
#43III-V semiconductor device having self-aligned contacts
#44Selective nanoscale growth of lattice mismatched materials
#45SEMICONDUCTOR WAFER, METHOD OF PRODUCING A SEMICONDUCTOR WAFER AND METHOD OF PRODUCING A COMPOSITE WAFER
#46Semiconductor device comprising epitaxially grown semiconductor material and an air gap
#47Group III-V device with a selectively modified impurity concentration
#48Group III-V device with a selectively reduced impurity concentration
#49Virtual substrates by having thick, highly relaxed metamorphic buffer layer structures by hydride vapor phase epitaxy
#50Selective epitaxial growth of semiconductor materials with reduced defects
#51REDUCING WAFER DISTORTION THROUGH A HIGH CTE LAYER
#52Reducing wafer distortion through a high CTE layer
#53Methods of forming hetero-layers with reduced surface roughness and bulk defect density of non-native surfaces and the structures formed thereby
#54Method for forming group III/V conformal layers on silicon substrates
#55III-V semiconductor structures and methods for forming the same
#56Selective epitaxial growth of semiconductor materials with reduced defects
#57Group III-V device structure having a selectively reduced impurity concentration
#58III-V compound crystal and semiconductor electronic circuit element
#59Reducing wafer distortion through a high CTE layer
#60Defect-free hetero-epitaxy of lattice mismatched semiconductors
#61Semiconductor nanocrystal, method of manufacture thereof and articles including the same
#62III-V semiconductor structures and methods for forming the same
#63Solar Cell Element, Color Sensor and Method of Manufacturing Light Emitting Element and Light Receiving Element
#64High-Quality Hetero-Epitaxy by Using Nano-Scale Epitaxy Technology
#65METHOD OF FORMING LED STRUCTURES
#66Method for manufacturing an III-V engineered substrate and the III-V engineered substrate thereof
#67Light emitting device and light emitting device package having the same
#68Selective epitaxial growth of semiconductor materials with reduced defects
#69SEMICONDUCTOR ELECTRONIC DEVICE AND PROCESS OF MANUFACTURING THE SAME
#70Method for epitaxial growth
#71III-V compound crystal and semiconductor electronic circuit element
#72Method of producing semiconductor optical device
#73Semiconductor member, manufacturing method thereof, and semiconductor device
#74Semiconductor device, semiconductor layer and production method thereof
#75Compound semiconductor substrate, epitaxial substrate, processes for producing compound semiconductor substrate, and epitaxial substrate
#76Semiconductor film manufacturing method and substrate manufacturing method
#77Semiconductor member, manufacturing method thereof, and semiconductor device
#78III-V and II-VI compounds as template materials for growing germanium containing film on silicon
#79Defect reduction in semiconductor materials
#80Method for depositing III-V semiconductor layers on a non-III-V substrate
#81III-V device structure with multiple threshold voltage
#82Method of removing threading dislocation defect from a fin feature of III-V group semiconductor material
#83Self-aligned and lateral-assembly method for integrating heterogeneous material structures on the same plane