207229 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AB compounds with or without impurities, e.g. doping materials; Treatment of semiconductor bodies using processes or apparatus not provided for in groups - to form insulating layers thereon, e.g. for masking or by using photolithographic techniques ; After treatment of these layers; Selection of materials for these layers Organic layers, e.g. photoresist
Method of depositing dielectric materials including oxygen-doped silicon carbide in damascene applications
#302Surface modification of CVD polymer films
#303Composition for film formation, coating solution containing the same and electronic device having insulating film obtained by using the coating solution
#304Film forming method, and substrate-processing apparatus
#305Preparation of crosslinked particles from polymers having activatible crosslinking groups
#306Solvent prewet and method to dispense the solvent prewet
#307Method for forming semiconductor device
#308Process for preparing low dielectric constant material
#309Selectively converted inter-layer dielectric
#310Formation of interconnect structures by removing sacrificial material with supercritical carbon dioxide
#311Interlayer dielectric film, and method for forming the same and interconnection
#312Method for manufacturing semiconductor device
#313Crosslinkable fill compositions for uniformly protecting via and contact holes
#314UV-activated dielectric layer
#315Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner
#316Fabricating a semiconductor device using fully cured bisbenzocyclobutene
#317Photolithographic method for forming a structure in a semiconductor substrate
#318Developer-soluble materials and methods of using the same in via-first dual damascene applications
#319Method and apparatus for forming insulating layer
#320Lithography pattern shrink process and articles
#321Porous silica dielectric having improved etch selectivity towards inorganic anti-reflective coating materials for integrated circuit applications, and methods of manufacture
#322Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD)
#323Composition for forming organic insulating film and organic insulating film formed from the same
#324Process for making air gap containing semiconducting devices and resulting semiconducting device
#325Semiconductor device and method for manufacturing the same
#326Organic field effect transistor with an organic dielectric
#327Plasma processing method
#328UV curable composition for forming dielectric coatings and related method
#329UV curable composition for forming dielectric coatings and related method
#330Via-filling material and process for fabricating semiconductor integrated circuit using the material
#331Semiconductor structure having reduced amine-based contaminants
#332METHOD OF PATTERNING LOW-K FILM AND METHOD OF FABRICATING DUAL-DAMASCENE STRUCTURE
#333Method for evaluating solution for a coating film for semiconductors
#334Organic thin film transistor enhanced in charge carrier mobility by virtue of surface relief structure
#335Undercoating material for wiring, embedded material, and wiring formation method
#336Structure and method for improved adhesion between two polymer films
#337Methods of forming patterned photoresist layers over semiconductor substrates
#338Electronic device with organic insulator
#339Method for ultra low-K dielectric deposition
#340Process modules for transport polymerization of low epsilon thin films
#341Bi-layer approach for a hermetic low dielectric constant layer for barrier applications
#342Polynorbornene foam insulation for integrated circuits
#343Method of fabricating a semiconductor device having a photo-sensitive polyimide layer and a device fabricated in accordance with the method
#344Composition for porous organic film
#345Semiconductor chip with FIB protection
#346Organic compositions
#347Organic polymers, laminates, and capacitors
#348Composition containing a cross-linkable matrix precursor and a poragen, and porous matrix prepared therefrom
#349Polyparaxylylene film, production method therefor and semiconductor device
#350Method and system for using ion implantation for treating a low-k dielectric film
#351Semiconductor device and manufacturing method thereof
#352Manufacturing method for wiring
#353Trench etch process for low-k dielectrics
#354Novel biological approach for forming low-k dielectrics
#355Photodefinable polymers for semiconductor applications
#356Solvent prewet and method to dispense the solvent prewet
#357Polyelectrolyte nanolayers as diffusion barriers in semiconductor devices
#358Reactor for producing reactive intermediates for low dielectric constant polymer thin films
#359Reactor for producing reactive intermediates for low dielectric constant polymer thin films
#360Method and system for backside dielectric patterning for wafer warpage and stress control