207235 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AB compounds with or without impurities, e.g. doping materials; Treatment of semiconductor bodies using processes or apparatus not provided for in groups - to modify their internal properties, e.g. to produce internal imperfections of AB compounds, e.g. to make them semi-insulating
METHOD FOR MAKING DEPLETION-MODE HIGH-ELECTRON-MOBILITY TRANSISTOR
#2GAN HEMT EPITAXIAL WAFER BASED ON ALN THICK FILM AND MANUFACTURING METHOD OF THE SAME
#3METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
#4Method for manufacturing semiconductor device
#5Gallium Nitride high-electron mobility transistors with p-type layers and process for making the same
#6Method of manufacturing semiconductor devices
#7Defect reduction of semiconductor layers and semiconductor devices by anneal and related methods
#8Control of p-contact resistance in a semiconductor light emitting device
#9Defect reduction of semiconductor layers and semiconductor devices by anneal and related methods
#10Method for making a semiconductor device including compound semiconductor materials and an impurity and point defect blocking superlattice
#11Semiconductor device including compound semiconductor materials and an impurity and point defect blocking superlattice
#12CONTROL OF P-CONTACT RESISTANCE IN A SEMICONDUCTOR LIGHT EMITTING DEVICE
#13Contact structure and extension formation for III-V nFET
#14Contact structure and extension formation for III-V nFET
#15Gallium nitride high-electron mobility transistors with p-type layers and process for making the same
#16Selective, electrochemical etching of a semiconductor
#17Method for treating a gallium nitride layer comprising dislocations
#18Contact structure and extension formation for III-V nFET
#19Contact structure and extension formation for III-V nFET
#20Semiconductor device and manufacturing method thereof
#21Control of P-contact resistance in a semiconductor light emitting device
#22Contact structure and extension formation for III-V nFET
#23Selective dopant junction for a group III-V semiconductor device
#24DEFECT REDUCTION IN III-V SEMICONDUCTOR EPITAXY THROUGH CAPPED HIGH TEMPERATURE ANNEALING
#25Semiconductor device and method of fabricating the same
#26Method for fabricating nitride semiconductor device with silicon layer
#27CONTROLLABLE OXYGEN CONCENTRATION IN SEMICONDUCTOR SUBSTRATE
#28METHOD FOR PURIFYING METALLURGICAL SILICON
#29Aluminum-nitride buffer and active layers by physical vapor deposition
#30Control of P-contact resistance in a semiconductor light emitting device
#31Planar semiconductor growth on III-V material
#32Method for chemically passivating a surface of a product made of a III-V semiconductor material and the product obtained by such a method
#33Method for treating a gallium nitride layer comprising dislocations
#34Semiconductor device and method of fabricating the same
#35Compound semiconductor device and method of manufacturing the same
#36EPITAXIAL SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#37Compound semiconductor device and method of manufacturing the same
#38Method for fabricating semiconductor device
#39Low etch pit density (EPD) semi-insulating III-V wafers
#40Semiconductor device and manufacturing method thereof
#41METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#42LOW ETCH PIT DENSITY (EPD) SEMI-INSULATING III-V WAFERS
#43Method for oxidizing a layer, and associated holding devices for a substrate
#44Low Etch Pit Density (EPD) Semi-Insulating GaAs Wafers
#45Removal of impurities from semiconductor device layers
#46Compound semiconductor substrate and control for electrical property thereof
#47Method for eliminating defects from semiconductor materials
#48Method for eliminating defects from semiconductor materials
#49Low etch pit density (EPD) semi-insulating GaAs wafers
#50Method for oxidizing a layer, and associated holding devices for a substrate
#51Method for activating P-type semiconductor layer
#52Semiconductor devices and methods for manufacturing the same