207233 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AB compounds with or without impurities, e.g. doping materials; Treatment of semiconductor bodies using processes or apparatus not provided for in groups - to modify their internal properties, e.g. to produce internal imperfections
Sub-classes:METAL-BASED PROTECTION OF SILICON-CONTAINING EDGE REGION
#2METHOD FOR MANUFACTURING SEMICONDUCTOR EPITAXIAL LAYER
#3SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#4USING LASER BASED SYSTEM FOR MEAN OF SHAPING OF UNSINGULATED & SINGULATED DIES BY SUBSTRATE LATTICE MANIPULATION
#5METHOD FOR SEMICONDUCTOR MANUFACTURING
#6LOW CAPACITANCE AND LOW RESISTANCE DEVICES
#7SILICON CARBIDE EPITAXIAL SUBSTRATE AND METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE
#8Shutter disk
#9Semiconductor device and semiconductor device manufacturing method
#10SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#11Methods for forming trench structures in substrates
#12Method of annealing out silicon defectivity
#13METHOD FOR FORMING A FET DEVICE
#14LASER MACHINING DEVICE AND LASER MACHINING METHOD
#15METHOD FOR VERIFICATION OF CONDUCTIVITY TYPE OF SILICON WAFER
#16High brightness LEDs with non-specular nanostructured thin film reflectors
#17Method for manufacturing silicon single crystal wafer and silicon single crystal wafer
#18Semiconductor device and semiconductor device manufacturing method
#19Semiconductor device
#20Techniques and apparatus for anisotropic stress compensation in substrates using ion implantation
#21ADHESION REMOVAL METHOD AND FILM-FORMING METHOD
#22Shutter disk
#23METHOD FOR HEAT-TREATING SILICON WAFER
#24Methods and devices for fabricating and assembling printable semiconductor elements
#25Semiconductor structure and method for forming same
#26Semiconductor device and manufacturing method of 1HE same
#27SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#28Atomic layer etching of metals
#29Shutter disk
#30Semiconductor device and method of manufacturing semiconductor device
#31Semiconductor device
#32Semiconductor device and semiconductor device manufacturing method
#33Techniques and apparatus for anisotropic stress compensation in substrates using ion implantation
#34Contact stacks to reduce hydrogen in semiconductor devices
#35Silicon germanium alloy fins with reduced defects
#36Methods and devices for fabricating and assembling printable semiconductor elements
#37Method for reducing defects of electronic components by a supercritical fluid
#38Apparatus for stressing semiconductor substrates
#39Light assisted platelet formation facilitating layer transfer from a semiconductor donor substrate
#40Schemes for forming barrier layers for copper in interconnect structures
#41Apparatus for stressing semiconductor substrates
#42Apparatus for stressing semiconductor substrates
#43Apparatus for stressing semiconductor substrates
#44SIC SEMICONDUCTOR DEVICE HAVING PN JUNCTION INTERFACE AND METHOD FOR MANUFACTURING THE SIC SEMICONDUCTOR DEVICE
#45WAFER PRODUCING METHOD AND WAFER PRODUCING APPARATUS
#46Semiconductor device and method of manufacturing semiconductor device
#47Passivation of nonlinear optical crystals
#48Method of manufacturing epitaxial silicon wafer, epitaxial silicon wafer, and method of manufacturing solid-state image sensing device
#49Semiconductor device, and method for manufacturing semicondcutor device
#50Semiconductor device
#51Silicon wafer
#52Semiconductor device
#53Semiconductor device and manufacturing method of the same
#54Thin film transistor and method for manufacturing the same
#55Semiconductor device with dummy hole
#56Method for manufacturing silicon wafer
#57Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
#58Method of processing workpiece
#59Insulated-gate bipolar transistor (IGBT) or diode including buffer region and lifetime killer region
#60Schemes for forming barrier layers for copper in interconnect structures
#61Methods for chemical etching of silicon
#62Methods and devices for fabricating and assembling printable semiconductor elements
#63Method of processing SiC wafer
#64Semiconductor device and method of manufacturing semiconductor device
#65Isotropic silicon and silicon-germanium etching with tunable selectivity
#66Structure and formation method of semiconductor device structure
#67Method of forming a semiconductor device
#68Wafer container and method for holding wafer
#69Controlled confined lateral III-V epitaxy
#70Silicon germanium alloy fins with reduced defects
#71Silicon germanium alloy fins with reduced defects
#72Epitaxial silicon wafer and method for producing the epitaxial silicon wafer
#73Structure and formation method of semiconductor device structure
#74Semiconductor device and semiconductor device manufacturing method
#75High-efficiency line-forming optical systems and methods using a serrated spatial filter
#76Passivation of nonlinear optical crystals
#77Method for evaluating semiconductor substrate
#78Silicon germanium alloy fins with reduced defects
#79Method for low temperature bonding and bonded structure
#80Silicon wafer and method for manufacturing the same
#81Semiconductor device and manufacturing method of semiconductor device
#82High-efficiency line-forming optical systems and methods
#83Methods and devices for fabricating and assembling printable semiconductor elements
#84Semiconductor-substrate manufacturing method and semiconductor-device manufacturing method in which germanium layer is heat-treated
#85SiC semiconductor device having pn junction interface and method for manufacturing the SiC semiconductor device
#86Method for manufacturing a capacitor for semiconductor devices
#87Wafer producing method
#88Semiconductor device and method of fabricating the same
#89Wafer producing method
#90Method for low temperature bonding and bonded structure
#91Semiconductor device and formation thereof
#92Method for producing a conductor line
#93Wafer backside particle mitigation
#94High-efficiency line-forming optical systems and methods
#95Plasma reactor with conductive member in reaction chamber for shielding substrate from undesirable irradiation
#96Method for reducing nonuniformity of forward voltage of semiconductor wafer
#97Schemes for forming barrier layers for copper in interconnect structures
#98Oxide thin film, method for post-treating oxide thin film and electronic apparatus
#99Semiconductor structure and fabrication method thereof
#100Method for low temperature bonding and bonded structure
#101Mechanical Compression-Based Method for the Reduction of Defects in Semiconductors
#102Semiconductor device with vertically inhomogeneous heavy metal doping profile
#103Semiconductor device and method of forming the same
#104Semiconductor device and formation thereof
#105Gettering process for producing semiconductor device
#106POST ETCH TREATMENT TECHNOLOGY FOR ENHANCING PLASMA-ETCHED SILICON SURFACE STABILITY IN AMBIENT
#107Method for fabricating semiconductor device
#108Edge termination technique for high voltage power devices having a negative feature for an improved edge termination structure
#109METHOD OF SEPARATING SEMICONDUCTOR DIE USING MATERIAL MODIFICATION
#110Guarding ring structure of a high voltage device and manufacturing method thereof
#111Method for low temperature bonding and bonded structure
#112Processes and apparatus for preparing heterostructures with reduced strain by radial compression
#113Processes and apparatus for preparing heterostructures with reduced strain by radial distension
#114Apparatus for stressing semiconductor substrates
#115Ion implant for defect control
#116Controlled localized defect paths for resistive memories
#117Semiconductor device and method of forming the same
#118Method of forming gettering layer
#119Method for forming ultra-shallow boron doping regions by solid phase diffusion
#120Using a carbon vacancy reduction material to increase average carrier lifetime in a silicon carbide semiconductor device
#121Method for fabricating semiconductor device
#122METHODS FOR EXTENDING ION SOURCE LIFE AND IMPROVING ION SOURCE PERFORMANCE DURING CARBON IMPLANTATION
#123Method for producing a conductor line
#124Method of producing a vertically inhomogeneous platinum or gold distribution in a semiconductor substrate and in a semiconductor device
#125Method of separating semiconductor die using material modification
#126Passivation of nonlinear optical crystals
#127Process for high-pressure nitrogen annealing of metal nitrides
#128Integrated circuit having doped semiconductor body and method
#129Schemes for forming barrier layers for copper in interconnect structures
#130Method for forming ultra-shallow boron doping regions by solid phase diffusion
#131Gate etch optimization through silicon dopant profile change
#132Method For Low Temperature Bonding And Bonded Structure
#133Epitaxial substrate for solid-state imaging device with gettering sink, semiconductor device, back illuminated solid-state imaging device and manufacturing method thereof
#134Schemes for forming barrier layers for copper in interconnect structures
#135Methods and devices for fabricating and assembling printable semiconductor elements
#136Substrate processing method and semiconductor device manufacturing method including a proton injection step and a laser irradiation step
#137Method for low temperature bonding and bonded structure
#138Gate etch optimization through silicon dopant profile change
#139Microfeature workpiece processing system for, e.g., semiconductor wafer analysis
#140Controlled localized defect paths for resistive memories
#141Method for improving the quality of a SiC crystal
#142Method for low temperature bonding and bonded structure
#143Methods and devices for fabricating and assembling printable semiconductor elements
#144Methods and devices for fabricating and assembling printable semiconductor elements
#145Method for low temperature bonding and bonded structure
#146Method for improving the quality of a SiC crystal
#147SiC crystal semiconductor device
#148Method of producing a vertically inhomogeneous platinum or gold distribution in a semiconductor substrate and in a semiconductor device
#149Heteroepitaxial Crystal Quality Improvement
#150METHOD AND SYSTEM FOR REMOVING IMPURITIES FROM LOW-GRADE CRYSTALLINE SILICON WAFERS
#151Methods for producing smooth wafers
#152Integrated circuit having doped semiconductor body and method
#153Semiconductor devices and methods of manufacture thereof
#154Schemes for forming barrier layers for copper in interconnect structures
#155Method for low temperature bonding and bonded structure
#156Method for low temperature bonding and bonded structure
#157Method for improving the quality of an SiC crystal and an SiC semiconductor device
#158Process for producing high-resistance silicon wafers and process for producing epitaxial wafers and SOI wafers
#159SOI wafer and its manufacturing method
#160Semiconductor epitaxial wafer
#161Microfeature workpiece processing system for, e.g., semiconductor wafer analysis
#162Stretchable semiconductor elements and stretchable electrical circuits
#163Device and method using isotopically enriched silicon
#164Method of producing semiconductor crystal
#165Method for low temperature bonding and bonded structure
#166Microfeature workpiece processing system for, e.g., semiconductor wafer analysis
#167Elimination of defects in long aspect ratio trapping trench structures
#168Enhanced defect reduction for heteroepitaxy by seed shape engineering