207273 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer; Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups -; Conductive parts; Flat leads, e.g. lead frames with or without insulating supports Etching
Sawn leadless package having wettable flank leads
#302WFCQFN (Very-Very Thin Flip Chip Quad Flat No Lead) with Embedded Component on Leadframe and Method Therefor
#303HIGH-VOLTAGE RESET MEMS MICROPHONE NETWORK AND METHOD OF DETECTING DEFECTS THEREOF
#304Semiconductor package with multiple molding routing layers and a method of manufacturing the same
#305LEAD FRAME WITH SOLDER SIDEWALLS
#306Semiconductor package with multiple molding routing layers and a method of manufacturing the same
#307Systems and methods for lead frame locking design features
#308Semiconductor device having die pad
#309Cavity based feature on chip carrier
#310Method of forming a semiconductor package with conductive interconnect frame and structure
#311Manufacturing method of semiconductor package
#312Thermosonically bonded connection for flip chip packages
#313Methods for manufacturing a packaged device with an extended structure for forming an opening in the encapsulant
#314Sensor chip package assembly and electronic device having sensor chip package assembly
#315Leadframe leads having fully plated end faces
#316LEAD FRAME WITH SOLDER SIDEWALLS
#317Lead frame and method for manufacturing the same
#318Lead frame including a plurality of units connected together and semiconductor device including the lead frame
#319Laser-induced forming and transfer of shaped metallic interconnects
#320Cavity package with pre-molded substrate
#321Integrated circuit package having an IC die between top and bottom leadframes
#322LEAD FRAME AND SEMICONDUCTOR PACKAGE STRUCTURE
#323Wiring circuit board and method of manufacturing the same
#324Method of fabricating low-profile footed power package
#325LEAD FRAME, ELECTRONIC COMPONENT DEVICE, AND METHODS OF MANUFACTURING THEM
#326Electronic packages for flip chip devices
#327Semiconductor packages and methods of packaging semiconductor devices
#328Low profile leaded semiconductor package
#329Leadless semiconductor packages, leadframes therefor, and methods of making
#330Leadframe and semiconductor device
#331Semiconductor device and leadframe
#332Semiconductor systems having premolded dual leadframes
#333SEMICONDUCTOR PACKAGE WITH INTEGRATED DIE PADDLES FOR POWER STAGE
#334Leadframe
#335Plasma etch singulated semiconductor packages and related methods
#336SUPPORT AND/OR CLIP FOR SEMICONDUCTOR ELEMENTS, SEMICONDUCTOR COMPONENT, AND PRODUCTION METHOD
#337Lead frame and semiconductor device
#338Laser-induced forming and transfer of shaped metallic interconnects
#339Die attachment for packaged semiconductor device
#340Wafer level fan-out package and method for manufacturing the same
#341Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device
#342Power converter package with integrated output inductor
#343Semiconductor die substrate with integral heat sink
#344Semiconductor devices and methods of making the same
#345METHOD FOR MAKING A SEMICONDUCTOR DEVICE HAVING AN INTERPOSER
#346Method of fabricating integrated circuits having a recessed molding package and corresponding package
#347Resin-encapsulated semiconductor device and its manufacturing method
#348Method for manufacturing semiconductor device and semiconductor device
#349Substrate structure and manufacturing method thereof
#350LEAD FRAME INCLUDING U-NOTCH
#351Method of forming a flexible semiconductor layer and devices on a flexible carrier
#352Method of forming a flexible semiconductor layer and devices on a flexible carrier
#353Method of forming a flexible semiconductor layer and devices on a flexible carrier
#354First-etched and later-packaged three-dimensional system-in-package normal chip stack package structure and processing method thereof
#355Semiconductor lead frame, semiconductor package, and manufacturing method thereof
#356Chip package structure and manufacturing method thereof
#357Method for fabricating an advanced routable quad flat no-lead package
#358Lead bonding structure
#359METHOD OF MAKING A QFN PACKAGE
#360Packaging solutions for devices and systems comprising lateral GaN power transistors
#361Semiconductor packages and related manufacturing methods
#362Manufacturing method of chip package structure
#363Current sensor isolation
#364Lead frame for mounting semiconductor element and method for manufacturing the same
#365Electronic package structure having insulated substrate with lands and conductive patterns
#366Integrated circuit package and method of making the same
#367Electronic packages for flip chip devices
#368Substrate having a conductive structure within photo-sensitive resin
#369Methods for making a multilevel leadframe by etching a conductive sheet from two opposite sides
#370Molded lead frame package with embedded die
#371Semiconductor packages and related methods
#372Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device
#373Land structure for semiconductor package and method therefor
#374Bonding clip, carrier and method of manufacturing a bonding clip
#375PACKAGING-BEFORE-ETCHING FLIP CHIP 3D SYSTEM-LEVEL METAL CIRCUIT BOARD STRUCTURE AND TECHNIQUE THEREOF
#376Wiring substrate, method of manufacturing the same and electronic component device
#377Die attachment for packaged semiconductor device
#378LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
#379Method for producing substrate for mounting semiconductor element
#380Integrated circuit package fabrication with die attach paddle having middle channels
#381Patterned grounds and methods of forming the same
#382Semiconductor package having routing traces therein
#383ELECTRONIC MODULE HAVING AN OXIDE SURFACE FINISH AS A SOLDER MASK, AND METHOD OF MANUFACTURING ELECTRONIC MODULE USING ORGANIC SOLDERABILITY PRESERVATIVE AND OXIDE SURFACE FINISH PROCESSES
#384Leadframe Strip with Sawing Enhancement Feature
#385BALL GRID ARRAY PACKAGE WITH MORE SIGNAL ROUTING STRUCTURES
#386Leadframe and method of manufacturing the same
#387Thin plastic leadless package with exposed metal die paddle
#388Semiconductor device
#389SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
#390Semiconductor packaging structure and forming method therefor
#391Ball grid array and land grid array assemblies fabricated using temporary resist
#392Packaging for an electronic device
#393RADIO FREQUENCY SHIELDING CAVITY PACKAGE
#394Semiconductor structure and method of fabricating the same
#395Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion
#396Electronic device and mounting structure of the same
#397Universal surface-mount semiconductor package
#398Semiconductor packages and methods of packaging semiconductor devices
#399Packaging substrate and method for manufacturing same
#400Systems and methods for lead frame locking design features
#401Package in package (PiP) electronic device and manufacturing method thereof
#402Method for making semiconductor device with lead frame made from top and bottom components and related devices
#403Metal base substrate, power module, and method for manufacturing metal base substrate
#404LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
#405Substrate, semiconductor package thereof and process of making same
#406Low-profile footed power package
#407Universal lead frame for flat no-leads packages
#408Resilient electrical interposers, systems that include the interposers, and methods for using and forming the same
#409Method for manufacturing semiconductor device
#410Chip package structure and manufacturing method thereof
#411Power converter package structure and method
#412Housing for an Optical Component, Assembly, Method for Producing a Housing and Method for Producing an Assembly
#413Lead frame structure for quad flat no-lead package, quad flat no-lead package and method for forming the lead frame structure
#414Wafers, panels, semiconductor devices, and glass treatment methods
#415Method and device for an integrated trench capacitor
#416LEAD CARRIER WITH THERMALLY FUSED PACKAGE COMPONENTS
#417Compliant dielectric layer for semiconductor device
#418Multi-level leadframe with interconnect areas for soldering conductive bumps, multi-level package assembly and method for manufacturing the same
#419System and method for manufacturing a fabricated carrier
#420Leadless semiconductor package with optical inspection feature
#421Method of electrically isolating shared leads of a lead frame strip
#422Resilient electrical interposers, systems that include the interposers, and methods for using and forming the same
#423Multilevel Leadframe
#424METHOD OF PRODUCING A COMPONENT CARRIER, AN ELECTRONIC ARRANGEMENT AND A RADIATION ARRANGEMENT, AND COMPONENT CARRIER, ELECTRONIC ARRANGEMENT AND RADIATION ARRANGEMENT
#425Chip package and method for forming the same
#426Chip package having a patterned conducting plate and method for forming the same
#427Cavity package with pre-molded substrate
#428Lead frame having a perimeter recess within periphery of component terminal
#429Packaged semiconductor device
#430Leadless semiconductor package and method of manufacture
#431Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device
#432Fabrication method of packaging substrate, and fabrication method of semiconductor package
#433Low profile leaded semiconductor package
#434FCOC (Flip Chip On Chip) package and manufacturing method thereof
#435Packaging for an electronic device
#436Method for packaging quad flat non-leaded package body, and package body
#437Lead frame and a method of manufacturing thereof
#438Lead frame and a method of fabrication thereof
#439Pre-encapsulated etching-then-plating lead frame structure with island and method for manufacturing the same
#440Integrated circuit packaging system with transferable trace lead frame
#441Land structure for semiconductor package and method therefor
#442Lead frame with grooved lead finger
#443Packaging substrate and semiconductor package
#444Semiconductor package and lead frame thereof
#445Semiconductor device assembly and semiconductor device and method of manufacturing the same
#446Systems and methods for lead frame locking design features
#447Lead frame with grooved lead finger
#448Lead frame including an insulating resin layer entirely covering lead surface, and semiconductor device including the same
#449Integrated circuit packaging system with a grid array with a leadframe and method of manufacture thereof
#450Substrate structure, semiconductor package device, and manufacturing method of semiconductor package
#451Semiconductor package structure and manufacturing method thereof
#452Semiconductor device and manufacturing method thereof
#453Systems and methods for lead frame locking design features
#454QFN DEVICE AND LEAD FRAME THEREFOR
#455Integrated circuit die with low thermal resistance
#456Lead carrier with multi-material print formed package components
#457Chip package structure and manufacturing method thereof
#458LEAD CARRIER WITH THERMALLY FUSED PACKAGE COMPONENTS
#459Power converter package structure and method
#460LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
#461LEADFRAME-BASED BALL GRID ARRAY PACKAGING
#462Semiconductor package and lead frame therefor
#463Integrated circuit packaging system with lead frame etching and method of manufacture thereof
#464Leadless semiconductor package with routable leads, and method of manufacture
#465LEADLESS SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE
#466Pre-bonded substrate for integrated circuit package and method of making the same
#467Pre-bonded substrate for integrated circuit package and method of making the same
#468Substrate for integrated circuit package with selective exposure of bonding compound and method of making thereof
#469Semiconductor packages with reduced solder voiding
#470Resilient electrical interposers, systems that include the interposers, and methods for using and forming the same
#471SEMICONDUCTOR DEVICE WITH NESTED ROWS OF CONTACTS
#472Method for manufacturing semiconductor device
#473Electronic module with vertical connector between conductor patterns
#474Substrate for semiconductor element, method for manufacturing substrate for semiconductor element, and semiconductor device
#475Resin-encapsulated semiconductor device
#476Semiconductor packages and methods of packaging semiconductor devices
#477Semiconductor device, substrate for producing semiconductor device and method of producing them
#478LEAD FRAME, ELECTRONIC COMPONENT INCLUDING THE LEAD FRAME, AND MANUFACTURING METHOD THEREOF
#479LEAD FRAME, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#480Ball-Grid Array Device Having Chip Assembled on Half-Etched metal Leadframe
#481Packaging process to create wettable lead flank during board assembly
#482Enhanced integrated circuit package
#483Etched recess package on package system
#484Semiconductor device
#485Manufacturing method of lead frame substrate and semiconductor apparatus
#486Lead frame substrate, manufacturing method thereof, and semiconductor apparatus
#487Lead frame, its manufacturing method, and semiconductor light emitting device using the same
#488Thermal enhanced upper and dual heat sink exposed molded leadless package and method
#489Semiconductor device having grooved leads to confine solder wicking
#490SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY ELECTROPLATING
#491Circuit Device and Method of Manufacturing Thereof
#492Enhanced integrated circuit package
#493Electronic component for surface mounting
#494Semiconductor device and manufacturing method thereof
#495Semiconductor device which exposes die pad without covered by interposer and its manufacturing method
#496Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same
#497Etched leadframe structure
#498ADHESIVE FILM FOR PRODUCING SEMICONDUCTOR DEVICE
#499SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AND WIRING BOARD
#500Method for forming an etched recess package on package system
#501Resin-encapsulated semiconductor device and its manufacturing method
#502Die attach method and leadframe structure
#503Integrated circuit package system with die and package combination
#504SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#505Semiconductor device
#506Method of making and designing lead frames for semiconductor packages
#507Integrated circuit packaging system with etched ring and die paddle and method of manufacture thereof
#508Lead Frame Fabrication Method
#509Method of fabricating chip package structure
#510Ultra-Thin Semiconductor Package
#511Lead frame, electronic component including the lead frame, and manufacturing method thereof
#512Semiconductor device having grooved leads to confine solder wicking
#513Manufacturing process of leadframe-based BGA packages
#514Thermal enhanced upper and dual heat sink exposed molded leadless package
#515Manufacturing process for a quad flat non-leaded chip package structure
#516Thin plastic leadless package with exposed metal die paddle
#517METHOD OF MULTI-CHIP PACKAGING IN A TSOP PACKAGE
#518Leadframe with extended pad segments between leads and die pad, and leadframe package using the same
#519Semiconductor module manufacturing method, semiconductor module, and mobile device
#520Process for producing and apparatus for improving the bonding between a plastic and a metal
#521Etched leadframe structure including recesses
#522Semiconductor device
#523CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
#524Method of fabricating chip package structure
#525Chip package structure
#526PRE-MOLDED LEAD FRAME AND PROCESS FOR MANUFACTURING THE SAME
#527Semiconductor device manufacturing method, semiconductor device, and wiring board
#528Semiconductor device package diepad having features formed by electroplating
#529STRESS-IMPROVED FLIP-CHIP SEMICONDUCTOR DEVICE HAVING HALF-ETCHED LEADFRAME
#530Pin Array No Lead Package and Assembly Method Thereof
#531INTERDIGITATED LEADFINGERS
#532Semiconductor device, substrate for producing semiconductor device and method of producing them
#533Lead Frame and Fabrication Method thereof
#534Integrated circuit package system with flashless leads
#535Fine pitch microcontacts and method for forming thereof
#536Method of fabricating an integrated circuit with etched ring and die paddle
#537Lead frame and method of manufacturing the same and semiconductor device
#538Surface mounting electronic component and manufacturing method thereof
#539Semiconductor device, substrate for producing semiconductor device and method of producing them
#540Etched leadframe flipchip package system
#541Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same
#542Leadless leadframe implemented in a leadframe-based BGA package
#543Leadframe and method of manufacturing the same
#544Thermal enhanced upper and dual heat sink exposed molded leadless package
#545Etched leadframe flipchip package system
#546Structure and method of molded QFN device suitable for miniaturization, multiple rows and stacking
#547Integrated circuit package system with adhesive restraint
#548Method of forming metal plate pattern and circuit board
#549Semiconductor device
#550Circuit device and method of manufacturing thereof
#551Process for manufacturing sawing type leadless semiconductor packages
#552Integrated circuit package system with die and package combination
#553Etched leadframe for reducing metal gaps
#554Electronic device with high lead density
#555Surface-mounting semiconductor device and method of making the same
#556Flip-chip semiconductor package with lead frame and method for fabricating the same
#557Leadless semiconductor package and method for manufacturing the same
#558Flip chip packaging method and flip chip assembly thereof
#559Packaged integrated circuit with MLP leadframe and method of making same
#560Electronic device with high lead density
#561Exposed pad module integrating a passive device therein
#562Semiconductor device and method of manufacturing the same
#563Semiconductor device and method of manufacturing same
#564Carrier, method of manufacturing a carrier and an electronic device
#565Leadframe and method of manufacturing the same
#566Chemical leadframe roughening process and resulting leadframe and integrated circuit package
#567Process for making circuit board or lead frame
#568Semiconductor device
#569Singulation method used in leadless packaging process
#570Sand blasting fixture and method of manufacturing package lead frames using the same
#571Laser devices using a semipolar plane
#572Laser devices using a semipolar plane
#573Laser devices using a semipolar plane
#574Wiring substrate for stackable semiconductor assembly and stackable semiconductor assembly using the same
#575Laser devices using a semipolar plane
#576Universal preformed lead frame device
#577Semiconductor device with leadframe configured to facilitate reduced burr formation
#578Leadframe package with side solder ball contact and method of manufacturing
#579Leadframe with improved half-etch layout to reduce defects caused during singulation
#580Laser devices using a semipolar plane
#581Enhanced thermal transfer in a semiconductor structure
#582Semiconductor package with multiple molding routing layers and a method of manufacturing the same
#583Semiconductor package with multiple molding routing layers and a method of manufacturing the same
#584Semiconductor package with multiple molding routing layers and a method of manufacturing the same
#585Double-sided electronic package
#586Method for fabricating semiconductor package and semiconductor package using the same
#587Power module packaging with dual side cooling
#588Semiconductor packaging identifier
#589Molded flip-clip semiconductor package
#590Nonleaded package and leadframe strip and method
#591Semiconductor package having etched foil capacitor integrated into leadframe
#592Etched hybrid die package