ClassID:

207365

H01L21/67316 - CPC Classification

Classification description:

Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders; Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements characterized by a material, a roughness, a coating or the like

Recent Application in this class:
#1
20240355655
2024-10-24

Semiconductor Device and Methods of Making and Using an Enhanced Carrier to Reduce Electrostatic Discharge

#2
20240145443
2024-05-02

Fluidic assembly MicroLED mass transfer method

#3
20230386874
2023-11-30

SUBSTRATE SUPPORTS, SEMICONDUCTOR PROCESSING SYSTEMS, AND MATERIAL LAYER DEPOSITION METHODS

#4
20230253377
2023-08-10

Fluidic assembly carrier substrate for microLED mass transfer

#5
20230253225
2023-08-10

GRAPHITE DISC

#6
20230245868
2023-08-03

HOLDING DEVICE, AND USE OF THE HOLDING DEVICE

#7
20230111655
2023-04-13

WAFER BOAT

#8
20210296145
2021-09-23

Substrate support, test device, and method of adjusting temperature of substrate support

#9
20210091052
2021-03-25

Fluidic assembly enabled mass transfer for microLED displays

#10
20200199746
2020-06-25

COATING DEVICE AND COATING METHOD FOR TUBE-TYPE PERC SOLAR CELL

#11
20200176256
2020-06-04

METHOD AND SYSTEM FOR IMPROVING WAFER BONDING STRENGTH

#12
20190115241
2019-04-18

HYDROPHOBIC ELECTROSTATIC CHUCK

#13
20190071265
2019-03-07

Transport fixing jig

#14
20180374730
2018-12-27

Bowing semiconductor wafers

#15
20180337080
2018-11-22

Semiconductor wafer carriers

#16
20180261482
2018-09-13

WAFER CASSETTE AND A METHOD OF FORMING THE SAME

#17
20180190525
2018-07-05

Bowing semiconductor wafers

#18
20180190524
2018-07-05

Semiconductor wafer carriers

#19
20170265252
2017-09-14

Industrial heater

#20
20170011908
2017-01-12

Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

#21
20160315003
2016-10-27

WAFER BOAT

#22
20160300744
2016-10-13

Moisture and/or electrically conductive remains detection for wafers after rinse / dry process

#23
20160276142
2016-09-22

SUBSTRATE CARRIER FOR A REDUCED TRANSMISSION OF THERMAL ENERGY

#24
20140147800
2014-05-29

QUARTZ BOAT METHOD AND APPARATUS FOR THIN FILM THERMAL TREATMENT

#25
20140124820
2014-05-08

Light emitting device, adhesive having surface roughness, and lighting system having the same

#26
20130236844
2013-09-12

SUBSTRATE CARRIER AND SELENIZATION PROCESS SYSTEM THEREOF

#27
20130236274
2013-09-12

Moisture and/or electrically conductive remains detection for wafers after rinse / dry process

#28
20120021552
2012-01-26

Quartz boat method and apparatus for thin film thermal treatment

#29
20110266736
2011-11-03

Vapor dryer having hydrophilic end effector

#30
20110062053
2011-03-17

Chimerized Wafer Boat for Use in Semiconductor Chip Processing and Related Methods

#31
20090159897
2009-06-25

Method for treating semiconductor processing components and components formed thereby

#32
20090084413
2009-04-02

Vapor dryer having hydrophilic end effector

#33
20050051083
2005-03-10

Apparatus for carrying reticles and method of using the same to process reticles