ClassID:

207369

H01L21/6733 - CPC Classification

Classification description:

Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders; Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like

Recent Application in this class:
#1
20250386616
2025-12-18

SOLAR CELL PREPARATION METHOD, AND COATING CARRIER PLATE FOR SOLAR CELL AND APPLICATION THEREOF

#2
20240355655
2024-10-24

Semiconductor Device and Methods of Making and Using an Enhanced Carrier to Reduce Electrostatic Discharge

#3
20240178026
2024-05-30

Apparatus for transporting semiconductor wafers

#4
20230386875
2023-11-30

UNDER BOAT SUPPORT WITH ELECTROSTATIC DISCHARGE STRUCTURE

#5
20230245868
2023-08-03

HOLDING DEVICE, AND USE OF THE HOLDING DEVICE

#6
20220351986
2022-11-03

Wet bench structure

#7
20210005469
2021-01-07

SiC freestanding film structure

#8
20200149159
2020-05-14

Substrate processing apparatus, quartz reaction tube and method of manufacturing semiconductor device

#9
20200006093
2020-01-02

Wet bench structure

#10
20190371629
2019-12-05

Sub-nanometer-level substrate cleaning mechanism

#11
20160160381
2016-06-09

Method for producing group III nitride semiconductor using a crucible

#12
20160027677
2016-01-28

Substrate carrier system for moving substrates in a vertical oven and method for processing substrates

#13
20150068948
2015-03-12

Wafer loaders having buffer zones

#14
20140208557
2014-07-31

Joining device and joining system

#15
20140124820
2014-05-08

Light emitting device, adhesive having surface roughness, and lighting system having the same

#16
20130236844
2013-09-12

SUBSTRATE CARRIER AND SELENIZATION PROCESS SYSTEM THEREOF

#17
20100062243
2010-03-11

METHOD FOR TREATING SEMICONDUCTOR PROCESSING COMPONENTS AND COMPONENTS FORMED THEREBY

#18
20070190276
2007-08-16

High temperature, high strength, colorable materials for device processing systems

#19
20070178259
2007-08-02

High temperature, high strength, colorable materials for device processing systems

#20
20070029268
2007-02-08

Wafer cassette used in high temperature baking process

#21
20050236110
2005-10-27

Semiconductor component handling device having a performance film

#22
20050056601
2005-03-17

Semiconductor component handling device having an electrostatic dissipating film