ClassID:

207377

H01L21/67356 - CPC Classification

Classification description:

Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders; Closed carriers specially adapted for containing chips, dies or ICs

Recent Application in this class:
#1
20250321573
2025-10-16

AUTOMATIC HANDLING SYSTEM AND METHOD OF OPERATING THE SAME

#2
20250285897
2025-09-11

SEMICONDUCTOR DIE CARRIER STRUCTURE

#3
20250096024
2025-03-20

MODULE TRAY FOR SEMICONDUCTOR DEVICE

#4
20240312814
2024-09-19

METHOD OF OPERATING A PROCESSING APPARATUS

#5
20240304478
2024-09-12

METHODS AND SYSTEMS FOR TEMPERATURE CONTROL FOR A SUBSTRATE

#6
20240128107
2024-04-18

Module tray for semiconductor device

#7
20240087932
2024-03-14

Semiconductor die carrier structure

#8
20240087930
2024-03-14

FRAME CASSETTE WITH INTERNAL COVER CASES

#9
20230290661
2023-09-14

SINGULATED DIE SHIPPING TRAY ASSEMBLY

#10
20230110990
2023-04-13

Molded substrates

#11
20230058606
2023-02-23

Mapping of a replacement parts storage container

#12
20230056554
2023-02-23

SEMICONDUCTOR CHIP CONTAINER AND FIXTURE

#13
20220396057
2022-12-15

Cover tape for packing electronic component, package, and package set

#14
20220328716
2022-10-13

Assembly chamber for self-assembly of semiconductor light-emitting diodes

#15
20220230901
2022-07-21

CONTAINERS FOR PROTECTING SEMICONDUCTOR DEVICES AND RELATED METHODS

#16
20220199438
2022-06-23

Method of forming dice and structure of die

#17
20210397921
2021-12-23

Chip counter for semiconductor chip-mounted tape reel

#18
20210366728
2021-11-25

Semiconductor package including leads of different lengths

#19
20210358786
2021-11-18

Method of forming dice and structure of die

#20
20210098273
2021-04-01

Method of performing a substrate detection process

#21
20210057246
2021-02-25

Mapping of a replacement parts storage container

#22
20200090970
2020-03-19

Semiconductor chip holder

#23
20200083076
2020-03-12

Transport packaging and method for expanded wafers

#24
20190371638
2019-12-05

Substrate detecting system in a substrate storage container

#25
20190172740
2019-06-06

Modular pressing device capable of generating stage downward forces and electronic device testing apparatus comprising the same

#26
20190061111
2019-02-28

Compressing apparatus and compressing jig thereof

#27
20190017940
2019-01-17

On-wafer calibration device

#28
20180130683
2018-05-10

Apparatus and method for contactless transfer and soldering of chips using a flash lamp

#29
20180076059
2018-03-15

Article transport device

#30
20180074119
2018-03-15

Electronic component transport apparatus and electronic component inspection apparatus

#31
20170330779
2017-11-16

Magazine for packaged integrated circuits

#32
20170194179
2017-07-06

Magazine for packaged integrated circuits

#33
20170032991
2017-02-02

Methods and devices for securing and transporting singulated die in high volume manufacturing

#34
20160343598
2016-11-24

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND FOUP TO BE USED THEREFOR

#35
20160204010
2016-07-14

Method of manufacturing semiconductor device

#36
20160035787
2016-02-04

Method of manufacturing semiconductor device

#37
20150235882
2015-08-20

DEVICES AND METHODS FOR HANDLING MICROELECTRONICS ASSEMBLIES

#38
20150206779
2015-07-23

Semiconductor processing boat design with pressure sensor

#39
20140340509
2014-11-20

System and method for real time positioning of a substrate in a vacuum processing system

#40
20130213853
2013-08-22

Package for metal-ceramic substrate and method for packing such substrates

#41
20120273389
2012-11-01

SEMICONDUCTOR TRAY CARRIER

#42
20110259772
2011-10-27

Devices and method for handling microelectronics assemblies

#43
20110183409
2011-07-28

Sealed chip package

#44
20100101635
2010-04-29

PACKAGINGS FOR THIN-LAYER SLICE-FORM PRODUCTS

#45
20100089851
2010-04-15

DEVICES AND METHODS FOR HANDLING MICROELECTRONIC ASSEMBLIES

#46
20080185389
2008-08-07

VACUUM STORAGE BOX

#47
20070272590
2007-11-29

Packaging structure

#48
20070216000
2007-09-20

Cover tape for packaging semiconductor device and package for semiconductor device

#49
20060213805
2006-09-28

Carrier tape for disk components

#50
20060006183
2006-01-12

Box for receiving chip seats

#51
20050186122
2005-08-25

Molded container

#52
20050002763
2005-01-06

Chip receptacle, method for fabricating a chip receptacle and chip transport container