MICROELECTRONIC ASSEMBLIES

CHEMICAL PASSIVATION OF MOLYBDENUM PLUG OR TRENCH'S OUTER SURFACE TO PREVENT MO NITRIDATION OR OXIDATION AND MAINTAIN LOW CONTACT RESISTANCE

SHALLOW TRENCH ISOLATION STRUCTURES AND TECHNIQUES

TRENCH ETCHING PROCESS FOR PHOTORESIST LINE ROUGHNESS IMPROVEMENT

SEMICONDUCTOR STRUCTURE INCLUDING ISOLATION ELEMENTS WITH ETCHING-RESISTANT UPPER PORTIONS AND METHOD FOR MANUFACTURING THE SAME

BACKSIDE ETCH PROCESSES FOR ULTRA UNIFORMITY OF FRONT-END STRUCTURES

PLANARIZATION METHOD FOR BACK-END-OF-LINE REGION OF INTEGRATED CIRCUIT DEVICE

DENSE REDISTRIBUTION LAYERS IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

HEAT DISSIPATION BY NANO PIPES

Structure And Method For Finfet Device With Contact Over Dielectric Gate

PLANARIZATION STRUCTURE FOR MIM TOPOGRAPHY

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE THEREOF

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE THEREOF

SEMICONDUCTOR STRUCTURE WITH BONDING INTERFACE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICES WITH GUARD RING STRUCTURES

METHODS OF FORMING SEMICONDUCTOR DEVICE

LOW RESISTIVITY CONDUCTOR SUBTRACTIVELY PATTERNED INTERCONNECTS USING LAYER TRANSFER OF MICROSTRUCTURE ENGINEERED THIN FILMS

SEMICONDUCTOR DEVICE INCLUDING INTERCONNECT STRUCTURE WITH CAPPING STRUCTURE

SEMICONDUCTOR DEVICE CONTAINING SELF-ALIGNED VIA STRUCTURES AND ETCH-STOP DIELECTRIC LAYER AND METHODS FOR FORMING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

METHOD FOR PATTERNING FOR CHEMICAL MECHANICAL POLISHING (CMP) ISO-DENSE BIAS COMPENSATION USING Z-HEIGHT

SEMICONDUCTOR DEVICE HAVING A DUMMY SECTION AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

MULTI-LEVEL SELECTIVE PATTERNING FOR STACKED DEVICE CREATION

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FABRICATING SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

HIGH VOLTAGE ISOLATION DEVICE

BEOL INTEGRATION SOLUTION BASED ON DIRECT CMP TO IMPROVE INTERMETAL DIELECTRIC LAYER

SEMICONDUCTOR STRUCTURE WITH BONDING INTERFACE AND METHODS OF FORMING THE SAME

HEAT DISSIPATION BY NANO PIPES

SEMICONDUCTOR DEVICE HAVING CAPACITOR ARRAY AND METHOD OF FORMING THE SAME

CHEMICAL PLANARIZATION OF NON-METALLIC MATERIALS

SEMICONDUCTOR CHIP STRUCTURE

METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND STRUCTURE THEREOF

WAFER-LEVEL DIE SINGULATION USING BURIED SACRIFICIAL STRUCTURE

MICROELECTRONIC ASSEMBLIES

METHOD FOR PRODUCING AN INTERCONNECT VIA

Surface Profile Control Of Passivation Layers In Integrated Circuit Chips

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHOD OF FORMING THE SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FORMING THE SAME

METHODS FOR MANUFACTURING AN INTERCONNECT STRUCTURE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF

PLANAR PASSIVATION LAYERS

METHOD OF FORMING SEMICONDUCTOR MEMORY DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE INCLUDING NITROGEN TREATMENT

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE INCLUDING NITROGEN TREATMENT AND SEMICONDUCTOR STRUCTURE THEREOF

MULTI LEVEL CONTACT ETCH

TRENCH ETCHING PROCESS FOR PHOTORESIST LINE ROUGHNESS IMPROVEMENT

METHOD OF FORMING SEMICONDUCTOR MEMORY DEVICE

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIRCUITS

INTEGRATED CIRCUIT INTERCONNECT STRUCTURE HAVING DISCONTINUOUS BARRIER LAYER AND AIR GAP

METHODS OF FORMING SEMICONDUCTOR DEVICE

VIA FOR SEMICONDUCTOR DEVICE CONNECTION

SEMICONDUCTOR DEVICE STRUCTURES

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT INTERCONNECT LEVEL COMPRISING MULTI-HEIGHT LINES & SELF-ALIGNED VIAS

SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING THE SAME

PLANARIZATION STRUCTURE FOR MIM TOPOGRAPHY

STACKED FET CONTACT FORMATION

WET ETCH PROCESS AND METHODS TO FORM AIR GAPS BETWEEN METAL INTERCONNECTS

SUBSTRATE CLEANING DEVICE AND SUBSTRATE CLEANING METHOD

SEMICONDUCTOR DEVICE INTERCONNECTS HAVING CONDUCTIVE ANNULUS-STABILIZED THROUGH-SILICON VIAS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

COMPOSITION FOR SEMICONDUCTOR PROCESSING AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME

Method for manufacturing a semiconductor device having a dummy section

Manufacturing method of semiconductor structure having elastic member within via

SEMICONDUCTOR STRUCTURE, TEST STRUCTURE, MANUFACTURING METHOD AND TEST METHOD

FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device

SELF-ALIGNMENT ETCHING OF INTERCONNECT LAYERS

INTEGRATED CIRCUIT DEVICES INCLUDING METAL LINES SPACED APART FROM METAL VIAS, AND RELATED FABRICATION METHODS

SEMICONDUCTOR DEVICE STRUCTURE

COMPOSITION FOR SEMICONDUCTOR PROCESSING AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME

Method of forming semiconductor memory device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Method of forming an interconnect structure having an air gap and structure thereof

Interconnect structure and method for manufacturing the interconnect structure

3D UFET DEVICE FOR ADVANCED 3D INTEGRATION

FORMING LINE END VIAS

Integrated circuit interconnect structure having discontinuous barrier layer and air gap

Reducing copper line resistance

Microelectronic assemblies

DOUBLE PATTERNING WITH SELECTIVELY DEPOSITED SPACER

Redistribution substrate, method of fabricating the same, and semiconductor package including the same

Via patterning for integrated circuits

BEOL TOP VIA WIRINGS WITH DUAL DAMASCENE VIA AND SUPER VIA REDUNDANCY

Reliability Macros for Contact Over Active Gate Layout Designs

PREVENTING ELECTRODE DISCONTINUATION ON MICRODEVICE SIDEWALL

Semiconductor device

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Structure And Method For Finfet Device With Contact Over Dielectric Gate

Integrated circuit devices including a via and methods of forming the same

FULLY SELF ALIGNED VIA INTEGRATION PROCESSES

Semiconductor device and method of fabricating the same

Trench etching process for photoresist line roughness improvement

In-situ PECVD cap layer

Semiconductor device structures

Semiconductor structure and method for forming the same

Methods of Forming an Abrasive Slurry and Methods for Chemical-Mechanical Polishing

Semiconductor Devices and Methods of Manufacture

Method for manufacturing semiconductor device

Fin field-effect transistor with a gate structure having a dielectric protection layer

Via for semiconductor device connection and methods of forming the same

Integrated circuit structure and method for forming the same

Methods for forming recesses in source/drain regions and devices formed thereof

Dense Redistribution Layers in Semiconductor Packages and Methods of Forming the Same

Subtractively patterned interconnect structures for integrated circuits

MULTIPLE FUNCTION BLOCKS ON A SYSTEM ON A CHIP (SOC)

Fully aligned subtractive processes and electronic devices therefrom

Method of manufacturing semiconductor device and semiconductor devices

Integrated circuit interconnect structure having discontinuous barrier layer and air gap

Method of manufacturing semiconductor device and ion beam irradiation apparatus

Contact structure and method of forming the same

Semiconductor chip structure

Planar passivation layers

TECHNIQUES FOR MRAM MTJ TOP ELECTRODE CONNECTION

Semiconductor device and methods of forming the same

SEMICONDUCTOR PROCESS POLISHING COMPOSITION AND POLISHING METHOD OF SUBSTRATE APPLIED WITH POLISHING COMPOSITION

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Interconnect structure and method for manufacturing the interconnect structure

BEOL METALLIZATION FORMATION

Methods and structures for improved electrical contact between bonded integrated circuit interfaces

Chemical mechanical polishing composition containing composite silica particles, method of making the silica composite particles and method of polishing a substrate

Memory cell stack and via formation for a memory device

Integrated circuit and fabrication method thereof

Method for forming semiconductor device structure with source/drain contact

Subtractively patterned interconnect structures for integrated circuits

Device terminal interconnect structures

ADDITIVE DAMASCENE PROCESS

Fabricating method of transistors without dishing occurred during CMP process

Polishing composition, polishing method, and method for producing substrate

Methods of forming a semiconductor device with a gate structure having a dielectric protection layer

Semiconductor device and a manufacturing method thereof

TECHNIQUES FOR MRAM MTJ TOP ELECTRODE CONNECTION

Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device

BEOL metallization formation

Chemical mechanical polishing composition containing composite silica particles, method of making the silica composite particles and method of polishing a substrate

Interconnects with tight pitch and reduced resistance

Self-alignment etching of interconnect layers

Method of integration of a magnetoresistive structure

Semiconductor devices having a conductive pillar and methods of manufacturing the same

Method of forming an interconnect structure having an air gap and structure thereof

Polishing pad, semiconductor fabricating device and fabricating method of semiconductor device

Semiconductor device

Memory cell stack and via formation for a memory device

Interconnect structure and method for manufacturing the interconnect structure

Method of making a semiconductor structure

Process for integrated circuit fabrication using a buffer layer as a stop for chemical mechanical polishing of a coupled dielectric oxide layer

Semiconductor device having symmetric conductive interconnection patterns

Redistribution substrate, method of fabricating the same, and semiconductor package including the same

Circuit substrate with mixed pitch wiring

Trench etching process for photoresist line roughness improvement

Material for forming organic film, method for forming organic film, patterning process, and compound

Method of forming self-aligned via

Three-dimensional semiconductor memory devices

SELECTIVE INTERCONNECTS IN BACK-END-OF-LINE METALLIZATION STACKS OF INTEGRATED CIRCUITRY

Method of forming semiconductor memory device

Planarization method of a capping insulating layer, a method of forming a semiconductor device using the same, and a semiconductor device formed thereby

Semiconductor device and methods of forming the same

Methods and structures for improved electrical contact between bonded integrated circuit interfaces

Method for manufacturing a semiconductor device having a dummy section

Memory device

Interconnect structure having fully aligned vias

FinFET device with contact over dielectric gate

Polishing composition, manufacturing method of polishing composition, polishing method, and manufacturing method of semiconductor substrate

Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device

Local interconnect with air gap

Selective removal process to create high aspect ratio fully self-aligned via

Semiconductor device structures

Interconnects with tight pitch and reduced resistance

Fully aligned subtractive processes and electronic devices therefrom

Methods for forming recesses in source/drain regions and devices formed thereof

Porous barrier layer for improving reliability of through-substrate via structures and methods of forming the same

Recessed interconnet line having a low-oxygen cap for facilitating a robust planarization process and protecting the interconnect line from downstream etch operations

Interconnect structure and method of forming the same

Semiconductor device and a method of manufacturing the same

Memory device and manufacturing method thereof

Method for processing substrate and substrate processing apparatus

Method of semiconductor integrated circuit fabrication

Semiconductor device

DENSE ARRAYS AND CHARGE STORAGE DEVICES

Via for semiconductor device connection and methods of forming the same

Planar passivation layers

Semiconductor device and manufacturing method thereof

Interconnect structures with airgaps arranged between capped interconnects

Method of forming self-aligned via

Stair step structures including insulative materials, and related devices

Semiconductor devices having a conductive pillar and methods of manufacturing the same

Late gate cut using selective dielectric deposition

Selective deposition of carbon films and uses thereof

Interconnect structure for semiconductor device and methods of fabrication thereof

Structure and method for FinFET device with contact over dielectric gate

Method of forming self-aligned via

Semiconductor device and method for fabricating the same

Structure and method for forming fully-aligned trench with an up-via integration scheme

Metal spacer self aligned multi-patterning integration

Techniques for MRAM MTJ top electrode connection

Self-aligned chamferless interconnect structures of semiconductor devices

Redistribution substrate, method of fabricating the same, and semiconductor package including the same

Single metallization scheme for gate, source, and drain contact integration

Via structures and via patterning using oblique angle deposition processes

Semiconductor device and fabrication method thereof

Method for manufacturing a semiconductor device

Single metallization scheme for gate, source, and drain contact integration

Integrated circuit and fabrication method thereof

Method for manufacturing semiconductor device

Memory device and forming method thereof

Method of etching one or more of mixed metal and dielectric layers of a semiconductor device

Methods for forming recesses in source/drain regions and devices formed thereof

SEMICONDUCTOR DEVICE HAVING SYMMETRIC CONDUCTIVE INTERCONNECTION PATTERNS

Transistor device and related methods

Semiconductor device and a manufacturing method thereof

Void-free metallic interconnect structures with self-formed diffusion barrier layers

Void-free metallic interconnect structures with self-formed diffusion barrier layers

Contact structures for integrated circuit products

Microelectronic assemblies

Semiconductor devices formed using multiple planarization processes

Semiconductor device and method of manufacturing thereof

Semiconductor device structures

Structure and method for FinFET device with contact over dielectric gate

Methods for forming recesses in source/drain regions and devices formed thereof

Method for creating a fully self-aligned via

Selective removal process to create high aspect ratio fully self-aligned via

Method of forming semiconductor memory device

Method of forming an interconnect structure having an air gap and structure thereof

Method for manufacturing a semiconductor device having a dummy section

Interconnect structure and method of forming the same

MODIFIED COLLOIDAL SILICA AND METHOD FOR PRODUCING THE SAME, AND POLISHING AGENT USING THE SAME

Modified colloidal silica and method for producing the same, and polishing agent using the same

Device terminal interconnect structures

POLISHING PAD, SEMICONDUCTOR FABRICATING DEVICE AND FABRICATING METHOD OF SEMICONDUCTOR DEVICE

Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device

Via for semiconductor device connection and methods of forming the same

Interlayer dielectric film in semiconductor devices

IN-SITU CALIBRATION STRUCTURES AND METHODS OF USE IN SEMICONDUCTOR PROCESSING

Semiconductor devices including a stair step structure, and related methods

Contact structure and associated method for flash memory

Dielectric gap fill evaluation for integrated circuits

Dielectric gap fill evaluation for integrated circuits

Mixed wire structure and method of making the same

Methods of forming contact structures on integrated circuit products

High aspect ratio via etch using atomic layer deposition protection layer

Semiconductor device and a method of manufacturing the same

Capacitance reduction in sea of lines BEOL metallization

Semiconductor process for improving loading effect in planarization

Method of integration of a magnetoresistive structure

Methods of forming semiconductor devices using multiple planarization processes

Method for manufacturing semiconductor device

Dense redistribution layers in semiconductor packages and methods of forming the same

Metal interconnect processing for an integrated circuit metal stack

Integrated circuit component package and method of fabricating the same

Interconnect structure for semiconductor device and methods of fabrication thereof

Interconnect structure for semiconductor device and methods of fabrication thereof

Planar passivation layers

Methods of producing self-aligned grown via

Stop-On Silicon Containing Layer Additive

CHEMICAL MECHANICAL POLISHING SLURRY AND APPLICATION THEREOF

Semiconductor structure and method for fabricating the same

Semiconductor device

Integrated circuit structure having gate contact and method of forming same

Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device

Step height reduction of memory element

Semiconductor structure and fabrication method thereof

Semiconductor device with inductive coupling and method of manufacturing the same

Semiconductor structure with contact plug and method of fabricating the same

Embedded memory in back-end-of-line low-k dielectric

Method of planarizing semiconductor device

Dense arrays and charge storage devices

Microelectronic elements with post-assembly planarization

Semiconductor structure and fabrication method thereof

Method for defining patterns for conductive paths in dielectric layer

Self-aligned via forming to conductive line and related wiring structure

Method of forming an interconnect structure having an air gap and structure thereof

Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device

Interconnect structure and method of forming the same

Array substrate, method for forming array substrate, display panel and display device

Airgap protection layer for via alignment

Semiconductor structure and planarization method thereof

Methods of forming an interconnect structure

Method to reduce resistance for a copper (Cu) interconnect landing on multilayered metal contacts, and semiconductor structures formed therefrom

Microelectronic conductive routes and methods of making the same

Dense redistribution layers in semiconductor packages and methods of forming the same

Simulation method of CMP process

Integrated circuit structure having gate contact and method of forming same

Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device

Contact structure and associated method for flash memory

Modified colloidal silica and method for producing the same, and polishing agent using the same

Semiconductor structure

Method of manufacturing semiconductor device with interlayer insulating layers

Semiconductor device and a method of manufacturing the same

Process of forming an electronic device

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Airgap protection layer for via alignment

Method of manufacturing semiconductor device having air gap between wirings for low dielectric constant

Semiconductor device and manufacturing method thereof