207490 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof; Manufacture of specific parts of devices defined in group; Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing Smoothing of the dielectric
Self-aligned interconnects
#302Microelectronic elements with post-assembly planarization
#303Semiconductor device including air gaps between interconnects and method of manufacturing the same
#304Interlayer dielectric film in semiconductor devices
#305SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD
#306Self-aligned via forming to conductive line and related wiring structure
#307Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer readable recording medium
#308Semiconductor device and process
#309Method of integration of a magnetoresistive structure
#310Slurry compounds and methods of fabricating semiconductor devices using the same
#311Stop-on silicon containing layer additive
#312Dense arrays and charge storage devices
#313Semiconductor device and method for fabricating the same
#314Method of forming an interconnect structure having an air gap and structure thereof
#315Semiconductor device including source/drain contact having height below gate stack
#316Antifuse structure in via hole in interplayer dielectric
#317Semiconductor device and a method of manufacturing the same
#318Method to reduce resistance for a copper (CU) interconnect landing on multilayered metal contacts, and semiconductor structures formed therefrom
#319Method for forming semiconductor structure
#320PROCESS FOR MANUFACTURING INTEGRATED ELECTRONIC DEVICES, IN PARTICULAR CMOS DEVICES USING A BORDERLESS CONTACT TECHNIQUE
#321Through-dielectric-vias (TDVs) for 3D integrated circuits in silicon
#322Interconnect structure and method of forming the same
#323Manufacturing method of semiconductor device
#324Method of manufacturing semiconductor device
#325Method of manufacturing semiconductor device
#326Semiconductor structure and fabrication method thereof
#327Method of forming an interconnect structure having an air gap and structure thereof
#328Semiconductor device structure and method of manufacturing the same
#329Method of forming semiconductor packages having through package vias
#330Interlayer dielectric layer with two tensile dielectric layers
#331Self-aligned via process flow
#332Mechanisms of forming damascene interconnect structures
#333Semiconductor device and process
#334Semiconductor device and a method of manufacturing the same
#335Semiconductor device and a method of manufacturing the same
#336Method of semiconductor integrated circuit fabrication
#337Method for fabricating interlayer dielectric layer
#338Combination interconnect structure and methods of forming same
#339Aluminum interconnection apparatus
#340Method of forming package-on-package (PoP) structure having a chip package with a plurality of dies attaching to first side of an interposer with a die formed thereon
#341Method of forming semiconductor device including source/drain contact having height below gate stack
#342Method for forming self-aligned contacts/vias with high corner selectivity
#343Method for forming semiconductor structure
#344Method for polishing a polymer surface
#345Semiconductor integrated circuit device and process for manufacturing the same
#346Methods for fabrication interconnect structures with functional components and electrical conductive contact structures on a same level
#347Planarization process
#348Microelectronic elements with post-assembly planarization
#349Semiconductor structure with inlaid capping layer and method of manufacturing the same
#350Integrated circuits including selectively deposited metal capping layers on copper lines and methods for fabricating the same
#351Integrated circuits with improved gap fill dielectric and methods for fabricating same
#352Metal hardmask all in one integrated etch
#353Method for forming self-aligned contacts/vias with high corner selectivity
#354Air gap structure integration using a processing system
#355Composition for advanced node front-and-back-end of line chemical mechanical polishing
#356METHOD AND STRUCTURE OF FORMING BACKSIDE THROUGH SILICON VIA CONNECTIONS
#357Interconnect structure with enhanced reliability
#358Semiconductor devices including spacers on sidewalls of conductive lines and methods of manufacturing the same
#359Semiconductor device and production method therefor
#360Dual damascene dual alignment interconnect scheme
#361Method of fabricating a semiconductor interconnect structure
#362INTERCONNECT FABRICATION AT AN INTEGRATED SEMICONDUCTOR PROCESSING STATION
#363Semiconductor device and a method of manufacturing the same
#364Multilevel interconnect structures and methods of fabricating same
#365Flattened substrate surface for substrate bonding
#366Method for forming interlevel dielectric (ILD) layer
#367Method of fabricating dielectric layer and shallow trench isolation
#368Methods for selective reverse mask planarization and interconnect structures formed thereby
#369Facilitating gate height uniformity and inter-layer dielectric protection
#370Polishing slurry for metal films and polishing method
#371Semiconductor integrated circuit device and process for manufacturing the same
#372Method and structure of forming backside through silicon via connections
#373Dual damascene dual alignment interconnect scheme
#374Semiconductor device fabrication method capable of scribing chips with high yield
#375Process control methods for CMP (chemical mechanical polishing) and other polishing methods used to form semiconductor devices
#376Method of fabricating a semiconductor device
#377Contact elements of a semiconductor device formed by electroless plating and excess material removal with reduced sheer forces
#378Replacement gate approach for high-k metal gate stacks by using a multi-layer contact level
#379Locally tailoring chemical mechanical polishing (CMP) polish rate for dielectrics
#380Mechanisms of forming damascene interconnect structures
#381DIELECTRIC DUMMIFICATION FOR ENHANCED PLANARIZATION WITH SPIN-ON DIELECTRICS
#382Flattened substrate surface for substrate bonding
#383Package-on-package (PoP) structure having at least one package comprising one die being disposed in a core material between first and second surfaces of the core material
#384INTERCONNECT STRUCTURES WITH FUNCTIONAL COMPONENTS AND METHODS FOR FABRICATION
#385Thin Film Deposition Method
#386Semiconductor device and a method of manufacturing the same
#387APPARATUS TO CONDUCT SPIN-ON FILM PROCESSING
#388Carrier structures for microelectronic elements
#389System and method of plating conductive gate contacts on metal gates for self-aligned contact interconnections
#390Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer readable recording medium
#391Method of Setting a Work Function of a Fully Silicided Semiconductor Device, and Related Device
#392Dense arrays and charge storage devices
#393Semiconductor integrated circuit device and process for manufacturing the same
#394Post CMP planarization by cluster ion beam etch
#395SEMICONDUCTOR DEVICES HAVING PLANARIZED INSULATION LAYERS AND METHODS OF FABRICATING THE SAME
#396CHEMICAL MECHANICAL POLISHING METHOD
#397SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
#398Method for planarizing interlayer dielectric layer
#399Method for manufacturing semiconductor device
#400Magnetic random access memory integration having improved scaling
#401Manufacturing method of device and planarization process
#402Semiconductor device
#403Methods of fabricating passive element without planarizing and related semiconductor device
#404Interconnect structure with enhanced reliability
#405Semiconductor integrated circuit device and process for manufacturing the same
#406SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
#407Microelectronic elements with post-assembly planarization
#408Composition for advanced node front-and back-end of line chemical mechanical polishing
#409Replacement Gate Approach for High-K Metal Gate Stacks Based on a Non-Conformal Interlayer Dielectric
#410Post CMP planarization by cluster ION beam etch
#411Semiconductor integrated circuit device
#412Multilevel interconnect structures and methods of fabricating same
#413Cyclic self-limiting CMP removal and associated processing tool
#414Contact elements of a semiconductor device formed by electroless plating and excess material removal with reduced sheer forces
#415Replacement gate approach for high-k metal gate stacks by avoiding a polishing process for exposing the placeholder material
#416Semiconductor device and method for manufacturing the same
#417Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer readable recording medium
#418Method of Providing a Semiconductor Device With a Dielectric Layer and Semiconductor Device Thereof
#419Dishing-free gap-filling with multiple CMPs
#420Semiconductor device having dummy pattern and the method for fabricating the same
#421Chemical mechanical polishing method
#422DENSE ARRAYS AND CHARGE STORAGE DEVICES
#423PASSIVATION PLANARIZATION
#424INTERLAYER INSULATING FILM, WIRING STRUCTURE, AND METHODS OF MANUFACTURING THE SAME
#425Methods of manufacturing semiconductors using dummy patterns
#426Method of Setting a Work Function of a Fully Silicided Semiconductor Device, and Related Device
#427Multilayer wiring, method for placing dummy wiring in multilayer wiring, semiconductor device, and semiconductor device manufacturing method
#428Method of high density memory fabrication
#429Nonvolatile semiconductor memory device
#430SLURRY COMPOSITION FOR A CHEMICAL MECHANICAL POLISHING PROCESS, METHOD OF POLISHING AN OBJECT LAYER AND METHOD OF MANUFACTURING A SEMICONDUCTOR MEMORY DEVICE USING THE SLURRY COMPOSITION
#431SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#432Polishing slurry for metal films and polishing method
#433Planarization method using hybrid oxide and polysilicon CMP
#434Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer readable recording medium
#435Technique for compensating for a difference in deposition behavior in an interlayer dielectric material
#436Production method of semiconductor device and semiconductor device
#437Method and apparatus for inserting metal fill in an integrated circuit (“IC”) layout
#438Fabrication method of semiconductor integrated circuit device
#439Semiconductor integrated circuit device and process for manufacturing the same
#440Method of Setting a Work Function of a Fully Silicided Semiconductor Device, and Related Device
#441Method for manufacturing semiconductor
#442Semiconductor device and method of manufacturing the same
#443Fill patterning for symmetrical circuits
#444Chemical mechanical polishing method
#445Methods for selective reverse mask planarization and interconnect structures formed thereby
#446Semiconductor integrated circuit device
#447Semiconductor integrated circuit device and a method for manufacturing a semiconductor integrated circuit device
#448Semiconductor device, and manufacturing method thereof
#449SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#450Semiconductor devices having a planarized insulating layer
#451Manufacturing method of semiconductor device
#452Semiconductor device having a dummy portion, method for manufacturing the semiconductor device, method for manufacturing a semiconductor package having the semiconductor device
#453METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#454Dishing-free gap-filling with multiple CMPs
#455Structure and method for hybrid tungsten copper metal contact
#456Spin-on film processing using acoustic radiation pressure
#457Method to improve uniformity of chemical mechanical polishing planarization
#458SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
#459Three terminal nonvolatile memory device with vertical gated diode
#460Method of forming an interlayer dielectric material having different removal rates during CMP
#461Method for fabricating a semiconductor device
#462Semiconductor device and a method of manufacturing the same
#463Technique for compensating for a difference in deposition behavior in an interlayer dielectric material
#464Method of manufacturing metal interconnection
#465Method for forming interlayer insulating film in semiconductor device
#466METHOD OF SETTING A WORK FUNCTION OF A FULLY SILICIDED SEMICONDUCTOR DEVICE, AND RELATED DEVICE
#467Method of fabricating an integrated circuit having a multi-layer structure with a seal ring
#468Method for fabricating semiconductor device
#469Semiconductor device and method for fabricating the same
#470Semiconductor integrated circuit device and process for manufacturing the same
#471Semiconductor device manufactured using a gate silicidation involving a disposable chemical/mechanical polishing stop layer
#472Planarizing coating method
#473METHOD FOR PLANARIZING AN INSULATION LAYER IN A SEMICONDUCTOR DEVICE CAPABLE OF OMITTING A MASK PROCESS AND AN ETCHING PROCESS
#474Methods of fabricating passive element without planarizing and related semiconductor device
#475Semiconductor device manufacturing method, semiconductor device, and semiconductor wafer structure
#476Multilevel interconnects structure with shielding function and fabricating method thereof
#477Semiconductor device and method for manufacturing the same
#478Semiconductor integrated circuit device including wiring lines and interconnections
#479Semiconductor device having dummy pattern and the method for fabricating the same
#480METHOD TO ACHIEVE A LOW COST TRANSISTOR ISOLATION DIELECTRIC PROCESS MODULE WITH IMPROVED PROCESS CONTROL, PROCESS COST, AND YIELD POTENTIAL
#481Semiconductor constructions
#482Semiconductor device manufacture method
#483CMOS imager with Cu wiring and method of eliminating high reflectivity interfaces therefrom
#484Chemical-mechanical polishing method
#485Planarization method using hybrid oxide and polysilicon CMP
#486Method of manufaturing a semiconductor device
#487Dual layer dielectric stack for microelectronics having thick metal lines
#488Method and apparatus for planarizing gap-filling material
#489Semiconductor device and fabricating method thereof
#490Methods of fabricating passive element without planarizing and related semiconductor device
#491Slurry Composition For a Chemical Mechanical Polishing Process, Method of Polishing an Object Layer and Method of Manufacturing a Semiconductor Memory Device Using the Slurry Composition
#492Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer readable recording medium
#493Semiconductor integrated circuit device
#494Semiconductor integrated circuit device
#495Two step post-deposition treatment of ILD layer for a lower dielectric constant and improved mechanical properties
#496METHOD FOR INCREASING THE PLANARITY OF A SURFACE TOPOGRAPHY IN A MICROSTRUCTURE
#497Methods of fabricating passive element without planarizing
#498Slurry composition, method of polishing an object layer and method of manufacturing a non-volatile memory device using the slurry composition
#499SLURRY AND METHOD FOR CHEMICAL MECHANICAL POLISHING
#500Fabrication method of semiconductor integrated circuit device
#501Methods of forming contact openings
#502Method of manufacturing a semiconductor device having a capacitor
#503Semiconductor device and method of producing the same
#504Method for reducing polish-induced damage in a contact structure by forming a capping layer
#505Interconnects forming method and interconnects forming apparatus
#506Semiconductor integrated circuit device
#507Contact hole formation method
#508Method for fabricating semiconductor device
#509Resin layer formation method and semiconductor device fabrication method
#510Method for stress free conductor removal
#511Method for planarization
#512CMP method providing reduced thickness variations
#513Method of forming an insulating layer in a semiconductor device
#514Passivation planarization
#515Method of manufacturing a semiconductor device having a cell area with a high device element density
#516Method of manufacturing metal insulating layer in semiconductor device
#517Semiconductor device and method for manufacturing the same
#518Method and apparatus for a deposited fill layer
#519Method to form topography in a deposited layer above a substrate
#520Semiconductor device having step-wise connection structures for thin film elements
#521Semiconductor device and manufacturing method thereof
#522Damascene copper wiring optical image sensor
#523Methods and systems for implementing dummy fill for integrated circuits
#524Method for forming thin film and film-forming device
#525Chemical mechanical polishing techniques for integrated circuit fabrication
#526Method for maintaining topographical uniformity of a semiconductor memory array
#527Semiconductor device and fabrication method therefor
#528Method for manufacturing a semiconductor device
#529Interconnect structure and method of manufacturing the same
#530Semiconductor integrated circuit device and process for manufacturing the same
#531Control system for multi-layer chemical mechanical polishing process and control method for the same
#532Dense arrays and charge storage devices
#533Method and structure for landing polysilicon contact
#534SEMICONDUCTOR DEVICE HAVING UPPER ELECTRODE AND METHOD OF FABRICATING THE SAME
#535Methods of forming integrated circuitry and methods of forming local interconnects
#536Method and apparatus for maintaining topographical uniformity of a semiconductor memory array
#537Methods for making nearly planar dielectric films in integrated circuits
#538Method for manufacturing metal line contact plug of semiconductor device
#539METHODS FOR MAKING NEARLY PLANAR DIELECTRIC FILMS IN INTEGRATED CIRCUITS
#540Semiconductor device using solid phase epitaxy and method for fabricating the same
#541Method and apparatus for planarizing gap-filling material
#542Method of manufacturing semiconductor device having planarized interlayer insulating film
#543Semiconductor integrated circuit device and process for manufacturing the same
#544Nonvolatile semiconductor memory device
#545Methods of fabricating semiconductor device using sacrificial layer
#546Methods of manufacturing semiconductor devices
#547Semiconductor constructions
#548Method of fabricating semiconductor device
#549Method of planarizing an inter-metal insulation film
#550Method for fabricating a semiconductor device
#551Method for fabricating a semiconductor device
#552Chemical mechanical polishing method
#553Method for fabricating storage node contact in semiconductor device
#554Method for forming an intermetal dielectric layer in a semiconductor device using HDP-CVD, and a semiconductor device manufactured thereby
#555CMOS imager with Cu wiring and method of eliminating high reflectivity interfaces therefrom
#556Method for cleaning slurry particles from a surface polished by chemical mechanical polishing
#557Damascene copper wiring image sensor
#558Method to form etch and/or CMP stop layers
#559Semiconductor device
#560Deposition and patterning of boron nitride nanotube ILD
#561Semiconductor device and manufacturing method of the same
#562Semiconductor devices having a planarized insulating layer and methods of forming the same
#563Contact planarization for integrated circuit processing
#564Nonselective unpatterned etchback to expose buried patterned features
#565Methods for making nearly planar dielectric films in integrated circuits
#566Methods for manufacturing a soft error and defect resistant pre-metal dielectric layer
#567Elongated features for improved alignment process integration
#568Semiconductor device and method capable of scribing chips with high yield
#569Fabrication method of semiconductor integrated circuit device
#570Methods for planarization of dielectric layer around metal patterns for optical efficiency enhancement
#571Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
#572Integrated circuits having a multi-layer structure with a seal ring
#573Semiconductor structures
#574Dummy fill for integrated circuits
#575Chemical-mechanical polishing method
#576Semiconductor integrated circuit device
#577Treatment condition decision method, treatment condition decision system, treatment system, treatment condition decision calculator program, program recording medium, and semiconductor device manufacturing method
#578Differential planarization
#579Method for end point detection polysilicon chemical mechanical polishing in an anti-fuse memory device
#580Coating device and coating method
#581Methods of forming planarized surfaces over semiconductor substrates
#582Semiconductor device including fine dummy patterns
#583Semiconductor device manufacture method
#584Chemical mechanical polishing a substrate having a filler layer and a stop layer
#585Slurry composition with high planarity and CMP process of dielectric film using the same
#586Semiconductor device and method of fabricating the same
#587Chemical-mechanical polishing proximity correction method and correction pattern thereof
#588Method of forming an insulator between features of a semiconductor device
#589Novel method to deposit carbon doped SiO2 films with improved film quality
#590Method for manufacturing a semiconductor device
#591Semiconductor device and manufacturing method thereof
#592Semiconductor integrated circuit device including dummy patterns located to reduce dishing
#593System and method for stress free conductor removal
#594Diamond metal-filled patterns achieving low parasitic coupling capacitance
#595Method for fabricating semiconductor integrated circuit device
#596Method for forming contact of semiconductor device
#597Endpoint detection in manufacturing semiconductor device
#598Semiconductor device having dummy wiring layers and a method for manufacturing the same
#599ILD stack with improved CMP results
#600Interconnects forming method and interconnects forming apparatus