207508 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof; Manufacture of specific parts of devices defined in group; Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors; Barrier, adhesion or liner layers characterized by particular after-treatment steps
Method for Producing a Power Semiconductor Component Having a Contact Hole
#2Interconnect Structures and Methods and Apparatuses for Forming the Same
#3Interconnect Structures and Methods and Apparatuses for Forming the Same
#4Method of forming a barrier layer in an interconnect structure of semiconductor device
#5Methods for inhibiting line bending during conductive material deposition, and related apparatus
#6Method for manufacturing bit line structure, method for manufacturing semiconductor structure, and semiconductor structure
#7Multi-pass plating process with intermediate rinse and dry
#8Surface-mount thin-film components having terminals configured for visual inspection
#9Apparatus with species on or in conductive material on elongate lines
#10Interconnect structures and methods and apparatuses for forming the same
#11Systems and methods to monitor particulate accumulation for bake chamber cleaning
#12Ohmic contacts and methods for manufacturing the same
#13Robust gate cap for protecting a gate from downstream metallization etch operations
#14Multi-pass plating process with intermediate rinse and dry
#15Interconnect structure of semiconductor device including barrier layer located entirely in via
#16Surface-mount thin-film components having terminals configured for visual inspection
#17Contact Hole
#18Post-etch treatment of an electrically conductive feature
#19Wet etch removal of Ru selective to other metals
#20Low temperature molybdenum film deposition utilizing boron nucleation layers
#21Cu wiring forming method and semiconductor device manufacturing method
#22Semiconductor device and method for fabricating the same
#23Semiconductor device and method for fabricating the same
#24Reducing liner corrosion during metallization of semiconductor devices
#25SELF-ALIGNED BARRIER AND CAPPING LAYERS FOR INTERCONNECTS
#26Integrated circuits including modified liners and methods for fabricating the same
#27Plasma treatment of film for impurity removal
#28Semiconductor device having a multilevel interconnect structure and method for fabricating the same
#29Self-aligned barrier and capping layers for interconnects
#30Semiconductor device having a multilevel interconnect structure and method for fabricating the same