207510 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof; Manufacture of specific parts of devices defined in group; Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors; Barrier, adhesion or liner layers Forming or treating discontinuous thin films, e.g. repair, enhancement or reinforcement of discontinuous thin films
THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES
#2CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
#3SEMICONDUCTOR DEVICE STRUCTURE WITH BARRIER LAYER
#4SEMICONDUCTOR DEVICE STRUCTURE WITH CARBON-CONTAINING CONDUCTIVE STRUCTURE
#5METHODS OF FORMING NANOSTRUCTURES UTILIZING SELF-ASSEMBLED NUCLEIC ACIDS
#6MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE
#7FORMING METHOD OF INTERCONNECT STRUCTURE
#8SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
#9CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
#10METHODS OF FORMING INTERCONNECT STRUCTURES
#11SUBSTRATE WITH THIN FILM, AND SEMICONDUCTOR SUBSTRATE
#12Three-dimensional semiconductor memory devices
#13Radiation hardened thin-film transistors
#14SEMICONDUCTOR DEVICE STRUCTURE WITH BARRIER LAYER AND METHOD FOR FORMING THE SAME
#15Structure and formation method of semiconductor device with carbon-containing conductive structure
#16Contact features of semiconductor device and method of forming same
#17PREVENTING ELECTRODE DISCONTINUATION ON MICRODEVICE SIDEWALL
#18Interconnect with Redeposited Metal Capping and Method Forming Same
#19Barrier Schemes for Metallization Using Manganese and Graphene
#20Three-dimensional semiconductor memory devices having a vertical semiconductor pattern
#21Microelectronic assembly from processed substrate
#22Methods of forming nanostructures utilizing self-assembled nucleic acids
#23Radiation hardened thin-film transistors
#24Method for filling recessed features in semiconductor devices with a low-resistivity metal
#25Deposition system and method using the same
#26Method of forming self-aligned via
#27Integrated circuit device and method of manufacturing the same
#28Microelectronic devices comprising manganese-containing conductive structures, and related electronic systems
#29Three-dimensional semiconductor memory devices
#30LASER IRRADIATION DEVICE, PROJECTION MASK AND LASER IRRADIATION METHOD
#31Methods of forming structures utilizing self-assembling nucleic acids
#32Microelectronic assembly from processed substrate
#33Method of forming self-aligned via
#34Method of forming self-aligned via
#35Integrated circuit devices including a via and methods of forming the same
#36Method for filling recessed features in semiconductor devices with a low-resistivity metal
#37Semiconductor device and method
#38Radiation hardened thin-film transistors
#39Void-free metallic interconnect structures with self-formed diffusion barrier layers
#40Three-dimensional semiconductor memory devices
#41Semiconductor device and a method of forming the semiconductor device
#42Array substrate and repairing method thereof
#43Methods of forming structures
#44SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESPUTTERING
#45Method of forming tungsten film
#46Methods of forming structures and methods of decreasing defect density
#47Microelectronic assembly from processed substrate
#48Processed Substrate
#49Manufacturing method of semiconductor device
#50Touch sensing unit and display device
#51TFT STRUCTURE AND REPAIR METHOD THEREOF, GOA CIRCUIT
#52Interconnect structure and fabrication thereof
#53Wafer rigidity with reinforcement structure
#54Selective deposition of metallic films
#55Formation of getter layer for memory device
#56Methods of forming nanostructures having low defect density
#57Self-organizing barrier layer disposed between a metallization layer and a semiconductor region
#58Wafer rigidity with reinforcement structure
#59Method of reducing stress in metal film and metal film forming method
#60Reliable packaging and interconnect structures
#61Device comprising a ductile layer and method of making the same
#62Self-aligned repairing process for barrier layer
#63NANOSTRUCTURES HAVING LOW DEFECT DENSITY AND METHODS OF FORMING THEREOF
#64Through silicon vias and thermocompression bonding using inkjet-printed nanoparticles
#65Integrated circuits including modified liners and methods for fabricating the same
#66Selective repairing process for barrier layer
#67Method for forming semiconductor device structure
#68Method for forming recess-free interconnect structure
#69Electrolytic copper process using anion permeable barrier
#70Semiconductor devices and methods of forming same
#71Contact plug and method for manufacturing the same
#72Self-ionized and inductively-coupled plasma for sputtering and resputtering
#73Semiconductor device with low resistance wiring and manufacturing method for the device
#74Organic electroluminescent display device and method of fabricating the same
#75Microfeature workpieces having alloyed conductive structures, and associated methods
#76Discontinuous/non-uniform metal cap structure and process for interconnect integration
#77Reliable packaging and interconnect structures
#78Through hole via filling using electroless plating
#79Electrolytic process using anion permeable barrier
#80Barrier layers
#81Methods for forming layers on a substrate
#82METHODS OF FABRICATING ELECTRONIC DEVICES USING DIRECT COPPER PLATING
#83Redistribution layers for microfeature workpieces, and associated systems and methods
#84Copper interconnection structure and method for forming copper interconnections
#85Method for repairing copper diffusion barrier layers on a semiconductor solid substrate and repair kit for implementing this method
#86METHOD OF DIRECT PLATING OF COPPER ON A RUTHENIUM ALLOY
#87Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods
#88Noble metal activation layer
#89Large grain size conductive structure for narrow interconnect openings
#90Copper diffusion barrier
#91Application of Mn for damage restoration after etchback
#92SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#93Copper interconnection structure and method for forming copper interconnections
#94Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
#95Discontinuous/non-uniform metal cap structure and process for interconnect integration
#96Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods
#97Conformal adhesion promoter liner for metal interconnects
#98Method for forming a ruthenium metal cap layer
#99SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESPUTTERING
#100In situ Cu seed layer formation for improving sidewall coverage
#101Multi-step Cu seed layer formation for improving sidewall coverage
#102MULTIPLE-STEP ELECTRODEPOSITION PROCESS FOR DIRECT COPPER PLATING ON BARRIER METALS
#103Selective ruthenium deposition on copper materials
#104Void-free copper filling of recessed features for semiconductor devices
#105METHOD OF FORMING METAL WIRING LAYER OF SEMICONDUCTOR DEVICE
#106Method of manufacturing a semiconductor device
#107Semiconductor device including interlayer interconnecting structures and methods of forming the same
#108METAL LINE OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
#109Process for selectively depositing copper thin films on substrates with copper and ruthenium areas via vapor deposition
#110Methods of fabricating electronic devices using direct copper plating
#111Conductor-dielectric structure and method for fabricating
#112Copper diffusion barrier
#113Method of manufacturing semiconductor device, and semiconductor device
#114CONDUCTIVE VIA FORMATION
#115Oxidized barrier layer
#116Semiconductor device and method for manufacturing same
#117METHOD OF FORMING A COPPER-BASED METALLIZATION LAYER INCLUDING A CONDUCTIVE CAP LAYER BY AN ADVANCED INTEGRATION REGIME
#118Method of testing an integrity of a material layer in a semiconductor structure
#119Semiconductor device including a discontinuous film and method for manufacturing the same
#120Interconnect structures with linear repair layers and methods for forming such interconnection structures
#121Self-ionized and inductively-coupled plasma for sputtering and resputtering
#122Design structures incorporating interconnect structures with liner repair layers
#123Redistribution layers for microfeature workpieces, and associated systems and methods
#124Semiconductor device and methods of forming the same
#125SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#126Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods
#127NANO-ELECTRODE-ARRAY FOR INTEGRATED CIRCUIT INTERCONNECTS
#128Microfeature workpieces and methods for forming interconnects in microfeature workpieces
#129Method of repairing seed layer for damascene interconnects
#130Method of direct plating of copper on a substrate structure
#131Conductor-dielectric structure and method for fabricating
#132Electrolytic copper process using anion permeable barrier
#133Catalytic activation technique for electroless metallization of interconnects
#134Method of forming metal wiring layer of semiconductor device
#135Microfeature workpieces and methods for forming interconnects in microfeature workpieces
#136Microfeature workpieces having alloyed conductive structures, and associated methods
#137Method of direct plating of copper on a ruthenium alloy
#138Method to deposit organic grafted film on barrier layer
#139Plating bath and surface treatment compositions for thin film deposition
#140Seed layers, cap layers, and thin films and methods of making thereof
#141Cobalt tungsten phosphate used to fill voids arising in a copper metallization process
#142Methods of forming materials comprising tungsten and nitrogen, and methods of forming capacitors
#143Method and system for forming a variable thickness seed layer
#144Reduction of copper dewetting by transition metal deposition
#145Semiconductor device and method for production thereof
#146Electrolytic process using anion permeable barrier
#147Semiconductor device including a discontinuous film and method for manufacturing the same
#148Method of manufacturing semiconductor device, and semiconductor device
#149Wire structure, semiconductor device, MRAM, and manufacturing method of semiconductor device
#150Barrier enhancement process for copper interconnects
#151Deep via seed repair using electroless plating chemistry
#152Exposed pore sealing post patterning
#153Method of fabricating robust nucleation/seed layers for subsequent deposition/fill of metallization layers
#154Exposed pore sealing post patterning
#155Self-ionized and inductively-coupled plasma for sputtering and resputtering
#156Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
#157High aspect ratio contact structure with reduced silicon consumption
#158Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
#159Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
#160Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
#161Methods and chemistry for providing initial conformal electrochemical deposition of copper in sub-micron features
#162System and method for defect free conductor deposition on substrates
#163Heterogeneous activation layers formed by ionic and electroless reactions used for IC interconnect capping layers
#164Deep via seed repair using electroless plating chemistry
#165Passivation processes for use with metallization techniques
#166High aspect ratio contact structure with reduced silicon consumption
#167Plating method
#168Multiple-step electrodeposition process for direct copper plating on barrier metals
#169Self-ionized and inductively-coupled plasma for sputtering and resputtering
#170Methods of forming nanostructures utilizing self-assembled nucleic acids
#171Microelectronic devices comprising manganese-containing conductive structures, and related electronic systems and methods
#172Interconnect structure and fabrication thereof
#173Formation of getter layer for memory device